Job description

The XR Hardware Engineering organization builds hardware platforms enabling spatial computing, augmented reality (AR) glasses, and virtual/mixed reality headsets. We solve complex multi-physics and electro-mechanical issues to deliver lightweight, wearable consumer devices that seamlessly integrate spatial audio, display optics, eye/head tracking, high-performance silicon, and wireless connectivity. As a Staff Hardware Electrical Engineer, you will define and drive the electrical architecture for cutting-edge XR hardware products from early concepts through mass production. You will lead cross-functional technical alignment across Silicon, Product Design (Mechanical), Display/Optics, Firmware, and System Integration teams You will operate with technical autonomy, resolving ambiguity, architect subsystem interconnects, setting engineering standards, and mentoring junior and mid-level engineers. For decades, the computing revolution has reshaped our world driven by breakthroughs in compute, connectivity, mobile, and now, AI. Google's XR team is at the forefront of the next major leap – the convergence of AI and XR. This is more than just new devices – it's about reimagining how we interact with the world around us. We're building a future where lightweight XR devices like smart glasses and headsets pair with helpful AI to augment human intelligence, offering personalized, conversational, and contextually aware experiences. Individual pay is determined by factors including job-related skills, experience, and relevant education or training. US: $188000 - $274000 (USD) + 20% bonus target + equity + benefits Learn more about benefits at Google . • Define system-level electrical architecture, block diagrams, component selection, schematics, and HDI/rigid-flex PCB stackups for compact, battery-powered XR devices. • Design and optimize power distribution networks (PMICs, DC-DC converters, battery management) and high-speed interfaces (MIPI CSI/DSI, PCIe, USB-C, LPDDR) to meet strict power, thermal, and signal/power integrity (SI/PI) limits. • Integrate custom and commercial silicon, display optics drivers (micro-OLED/MicroLED), camera/sensor suites (IMUs, eye-tracking, environment perception), and wireless coexistence (Wi-Fi, Bluetooth, UWB). • Lead board bring-up, lab characterization, failure analysis, and hardware debugging across prototype builds (EVT, DVT, PVT) using oscilloscopes, logic analyzers, and RF test equipment. • Guide junior engineers, author comprehensive design specifications and test plans, and establish robust hardware design review processes across the organization. • Bachelor's degree in Electrical Engineering, Computer Engineering, Physics, a related field, or equivalent practical experience. • 6 years of experience working in an electrical hardware development or consumer electronics environment. • 3 years of experience in technical leadership, managing architecture decisions, and leading hardware design projects. Minimum qualifications: • Bachelor's degree in Electrical Engineering, Computer Engineering, Physics, a related field, or equivalent practical experience. • 6 years of experience working in an electrical hardware development or consumer electronics environment. • 3 years of experience in technical leadership, managing architecture decisions, and leading hardware design projects. Preferred qualifications: • Master's or PhD in Electrical Engineering, Computer Engineering, Physics, a related field, or equivalent practical experience. • Experience integrating spatial sensing pipelines (time-of-flight, global shutter cameras, eye-tracking) and display modules. • Expertise in rigid-flex and HDI PCB layout, impedance control, EMC or EMI mitigation, and RF coexistence. • Deep understanding of thermal management, battery life optimization, and ultra-miniaturized form-factor design. • Demonstrated capability to align cross-functional priorities across Silicon architects, Mechanical/Optical engineers, and Firmware developers. • Proven track record delivering high-volume, compact consumer electronics, smart wearables, AI glasses, or AR/VR headsets to mass production.

Requirements

Must-haves

You will operate with technical autonomy, resolving ambiguity, architect subsystem interconnects, setting engineering standards, and mentoring junior and mid-level engineers.
For decades, the computing revolution has reshaped our world driven by
breakthroughs in compute, connectivity, mobile, and now, AI. Google's XR
team is at the forefront of the next major leap – the convergence of AI and
XR. This is more than just new devices – it's about reimagining how we
interact with the world around us. We're building a future where
lightweight XR devices like smart glasses and headsets pair with helpful AI
to augment human intelligence, offering personalized, conversational, and
contextually aware experiences.
Individual pay is determined by factors including job-related skills, experience, and relevant education or training.
Learn more about benefits at Google .
Define system-level electrical architecture, block diagrams, component selection, schematics, and HDI/rigid-flex PCB stackups for compact, battery-powered XR devices.
Integrate custom and commercial silicon, display optics drivers (micro-OLED/MicroLED), camera/sensor suites (IMUs, eye-tracking, environment perception), and wireless coexistence (Wi-Fi, Bluetooth, UWB).
Lead board bring-up, lab characterization, failure analysis, and hardware debugging across prototype builds (EVT, DVT, PVT) using oscilloscopes, logic analyzers, and RF test equipment.
Guide junior engineers, author comprehensive design specifications and test plans, and establish robust hardware design review processes across the organization.
Bachelor's degree in Electrical Engineering, Computer Engineering, Physics, a related field, or equivalent practical experience.
6 years of experience working in an electrical hardware development or consumer electronics environment.

Nice-to-haves

US: $188000 - $274000 (USD) + 20% bonus target + equity + benefits
Master's or PhD in Electrical Engineering, Computer Engineering, Physics, a related field, or equivalent practical experience.
Experience integrating spatial sensing pipelines (time-of-flight, global shutter cameras, eye-tracking) and display modules.
Expertise in rigid-flex and HDI PCB layout, impedance control, EMC or EMI mitigation, and RF coexistence.
Deep understanding of thermal management, battery life optimization, and ultra-miniaturized form-factor design.
Demonstrated capability to align cross-functional priorities across Silicon architects, Mechanical/Optical engineers, and Firmware developers.
Proven track record delivering high-volume, compact consumer electronics, smart wearables, AI glasses, or AR/VR headsets to mass production.

Application prep

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Keywords to mirror

Platform: google
Effort: medium