Job description

As an Electrical Manufacturing Engineer for the New Technology Introduction process, you are an integral part of the Physical Infrastructure Engineering (PIE) team. You will join the team that is responsible for releasing Google’s hardware to mass production and developing a supply chain to deliver it. You will lead the development and scale of new PCBA manufacturing and materials technologies to enable the growing roadmap of Google Cloud data center products. You will be the technical expert for advanced manufacturing processes and provide technical leadership for the delivery of approaches and processes for our product development efforts. In this role, you will work cross-functionally to influence technology direction and adoption for our data center products. You will also ensure that our supply chain stack is fully readied to execute novel manufacturing and test approaches in production environments.Our Platforms Infrastructure Engineering team designs and builds the hardware and software technologies that power all of Google's services. Our computational challenges are complex and unique, enabled by cutting-edge custom hardware designed and made in-house. As a hardware engineer, you will design and build the systems that are the heart of the world's largest and most powerful computing infrastructure. You will see those systems from concept all the way through to high-volume manufacturing. Your work has the potential to shape the machinery that goes into our cutting-edge data centers, affecting millions of Google users.Individual pay is determined by factors including job-related skills, experience, and relevant education or training. US: $188000 - $274000 (USD) + 20% bonus target + equity + benefits Learn more about benefits at Google . • Collaborate with design engineering on NPI roadmaps, develop strategy and plans to enable New Products Introduction with our manufacturing partners. • Lead overall manufacturing process development and validation including novel technologies, materials, and processes, to systematically identify and establish manufacturable and scalable manufacturing processes. • Develop and deliver manufacturing documentation (e.g., Engineering Bill of Materials, Assembly Drawings, Manufacturing Work Instructions, etc.) in support of New Product Introduction. • Collaborate with design and cross-functional engineering teams throughout NPI phases to identify value engineering opportunities, ensure Design for X (Dfx) and manufacturability. • Work closely with manufacturing partners in build readiness, process development, process validation, solve complex design and manufacturing issues efficiently to meet project timing and ensure flawless NPI launch. • Bachelor’s degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, a related field, or equivalent practical experience. • 6 years of experience in manufacturing process development in semiconductor packaging or Surface Mount Technology (SMT). • Experience in SMT manufacturing processes, thermal mechanical, and process development via Design of Experiments and applied Design for Manufacturability. • Experience in Process Improvement. Minimum qualifications: • Bachelor’s degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, a related field, or equivalent practical experience. • 6 years of experience in manufacturing process development in semiconductor packaging or Surface Mount Technology (SMT). • Experience in SMT manufacturing processes, thermal mechanical, and process development via Design of Experiments and applied Design for Manufacturability. • Experience in Process Improvement. Preferred qualifications: • Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field (e.g., Optics, Sensors, Audio/DSP). • Experience in advanced IC packaging qualifications, metallurgy, and mechanical thermal dynamics. • Experience delivering innovative manufacturing solutions, leading failure analysis investigations and resolutions, and overseeing yield improvements for high complexity products. • Knowledge of industry trends, emerging technologies, and engaged landscape in manufacturing processes.

Requirements

Must-haves

Learn more about benefits at Google .
Collaborate with design engineering on NPI roadmaps, develop strategy and plans to enable New Products Introduction with our manufacturing partners.
Lead overall manufacturing process development and validation including novel technologies, materials, and processes, to systematically identify and establish manufacturable and scalable manufacturing processes.
Develop and deliver manufacturing documentation (e.g., Engineering Bill of Materials, Assembly Drawings, Manufacturing Work Instructions, etc.) in support of New Product Introduction.
Collaborate with design and cross-functional engineering teams throughout NPI phases to identify value engineering opportunities, ensure Design for X (Dfx) and manufacturability.
Work closely with manufacturing partners in build readiness, process development, process validation, solve complex design and manufacturing issues efficiently to meet project timing and ensure flawless NPI launch.
Bachelor’s degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, a related field, or equivalent practical experience.
6 years of experience in manufacturing process development in semiconductor packaging or Surface Mount Technology (SMT).
Experience in SMT manufacturing processes, thermal mechanical, and process development via Design of Experiments and applied Design for Manufacturability.
Experience in Process Improvement.
Bachelor’s degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, a related field, or equivalent practical experience.
6 years of experience in manufacturing process development in semiconductor packaging or Surface Mount Technology (SMT).
Experience in SMT manufacturing processes, thermal mechanical, and process development via Design of Experiments and applied Design for Manufacturability.
Experience in Process Improvement.

Nice-to-haves

US: $188000 - $274000 (USD) + 20% bonus target + equity + benefits
Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field (e.g., Optics, Sensors, Audio/DSP).
Experience in advanced IC packaging qualifications, metallurgy, and mechanical thermal dynamics.
Experience delivering innovative manufacturing solutions, leading failure analysis investigations and resolutions, and overseeing yield improvements for high complexity products.
Knowledge of industry trends, emerging technologies, and engaged landscape in manufacturing processes.

Application prep

Use the role’s language and application details while tailoring your materials.

Platform: google
Effort: medium