Job description

Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. Job Description: Broadcom is searching for an ASIC top level floorplan Physical Design Engineer to join the Asic Products Division. This position involves working with the latest technology to continue driving next generation Artificial Intelligence and PCIe Switch Products. More specifically, this position will require in-depth knowledge and expertise in all Physical Design aspects of taking RTL to silicon tape-out. Responsibilities: Own chip floor planning, partition creation, clock tree and delivery of top level partitions Resolve physical design issues related to chip integration and assembly Manage all cross functional interactions related to top level floorplanning, I/O and bump planning with package team Develop and improve floorplan implementation methodologies using both industry and internal tools Perform technical evaluations of vendors and IP, providing recommendations and assessments to meet design specification Preferred qualifications: Bachelors degree in Electrical Engineering and 8 years of experience in top level floorplannning with a focus on die size estimate, partitioning, clocking and pin planning Or Master s degree in Electrical Engineering and 6 years of experience in top level floorplannning with a focus on die size estimate, partitioning, clocking and pin planning Experience working on various technologies (Switch Fabric, Arbiter, High Speed DDR, SerDes, HBM, D2D I/O, chiplet etc) Experience in resolving chip level DRC/LVS/EMIR issues for advance nodes Proven track record with bump planning, RDL implementation, and multi-voltage domain designs Experience with hierarchical floorplanning, power grid design, structured clocks, top level pipeline planning, custom routes and bump planning Experience in collaborating with design, package and methodology teams during development phase Experience in scripting languages like Python, Tcl, or Perl and EDA tools Must work in person at our San Jose site and no remote work option Compensation and Benefits The annual base salary range for this position is USD 121,900.00 To USD 195,000.00 As a valued member of our team, you ll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company s growth. All subject to relevant plan documents and award agreements. Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence. Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law. If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Requirements

Must-haves

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Own chip floor planning, partition creation, clock tree and delivery of top level partitions
Resolve physical design issues related to chip integration and assembly
Manage all cross functional interactions related to top level floorplanning, I/O and bump planning with package team
Develop and improve floorplan implementation methodologies using both industry and internal tools
Perform technical evaluations of vendors and IP, providing recommendations and assessments to meet design specification
Bachelors degree in Electrical Engineering and 8 years of experience in top level floorplannning with a focus on die size estimate, partitioning, clocking and pin planning
Or Master s degree in Electrical Engineering and 6 years of experience in top level floorplannning with a focus on die size estimate, partitioning, clocking and pin planning

Nice-to-haves

Experience working on various technologies (Switch Fabric, Arbiter, High Speed DDR, SerDes, HBM, D2D I/O, chiplet etc)
Experience in resolving chip level DRC/LVS/EMIR issues for advance nodes
Proven track record with bump planning, RDL implementation, and multi-voltage domain designs
Experience with hierarchical floorplanning, power grid design, structured clocks, top level pipeline planning, custom routes and bump planning
Experience in collaborating with design, package and methodology teams during development phase
Experience in scripting languages like Python, Tcl, or Perl and EDA tools
Must work in person at our San Jose site and no remote work option

Application prep

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Keywords to mirror

python

Platform: workday
Effort: long

Benefits

Benefits detected in the listing.

Dental

Vision

401(K)