Job description

Company: Qualcomm Technologies, Inc. Job Area: Engineering Services Group, Engineering Services Group > CAD Component General Summary: Qualcomm is a company of inventors that unlocked 5G & 6G, ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5G's potential into world-changing technologies and products. This is the Invention Age — and this is where you come in. The Central Hardware Systems (CHS) PCB CAD team designs cutting-edge printed circuit boards across Qualcomm's most strategic platforms — spanning Mobile, Automotive, Infrastructure, IoT, Compute, and R&D. As a Senior PCB Designer, you will be a key contributor shaping next-generation hardware from concept through fabrication, working alongside world-class electrical and mechanical engineering teams. Key Responsibilities • Design and document high-density printed circuit board (PCB) layouts that conform to manufacturing and industry standards and Qualcomm design guidelines, using supplied schematics and electrical/mechanical design constraints • Develop PCB layouts for a wide variety of 5G designs across multiple business units, including R&D, Mobile, Compute, IoT, Infrastructure, Automotive, and Test Equipment • Support form factor accurate (FFA) test platform circuit boards requiring mastery of digital processors, RF, radio circuits, and power control devices • Work with micro-vias (stacked), sequential lamination stack-ups, and design rules using 0.5mm pitch and smaller packages • Collaborate with US and India-based teams to deliver PCB design solutions for high-performance electronic assemblies • Develop and present PCB design trade-offs and solutions to the engineering design team for resolution and implementation • Determine trade-offs necessary to meet design requirements while producing high-quality, cost-effective PCBs that meet schedule objectives • Maintain technical coordination with Engineering and Manufacturing; resolve PCB design issues with fabrication and assembly vendors • Prepare and deliver design reviews to project teams • Contribute to process improvement initiatives, PCB and DFM checklists, and design guidelines • Collaborate with internal PCB designers to optimize product development processes and schedule execution • Provide direction, prioritization, and clear project task communication to team members and stakeholders • Manage multiple projects simultaneously in a fast-paced, dynamic environment Minimum Qualifications • 3+ years of active experience in PCB design for high-density electronics packaging • 3+ years of experience in a PCB design role designing consumer-grade mobile products or low-volume test products utilizing latest-generation processor chips and ICs • Proficiency in Siemens/Mentor Xpedition, PADS, Altium or Cadence Allegro PCB design software • Associate’s degree in Electronics, Electrical Technology, or a related technical field Preferred Qualifications Technical Skills & Design Experience: • Experience with RF, Analog, and high-speed digital circuit design, including: DDR2/3/4/5, HDMI, PCIe, SATA, MIPI, USB 2.0/3.x, and GigE • Expert understanding and demonstrated application of PCB design principles, practices, and industry standards • Proven ability to perform complex PCB design tasks requiring in-depth knowledge of fabrication and assembly process capabilities and limitations • Experience with EMI mitigation techniques and practices • Experience with IDF/EMN file exchange between mechanical and hardware teams • Familiarity with PWB technology and process trends and their application to advanced designs • Design for Manufacture (DFM) analysis experience utilizing Valor and/or CAM350 tools Soft Skills & Collaboration: • Strong verbal and written communication skills; ability to deliver clear status reports and presentations • Effective collaboration with cross-functional engineering teams and external suppliers via email, web meetings, and instant messaging • Ability to understand project goals and align individual contributions accordingly • Leadership skills to direct, prioritize, and communicate project milestones to team members Education Requirements • Required: Associate degree in Electronics, Electrical Technology, or a related technical field • Preferred: Bachelor’s degree in electrical engineering, electronics engineering technology, or a related technical field Additional Information • This is an onsite position based in San Diego, CA Applicants : Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here . Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). To all Staffing and Recruiting Agencies : Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications. EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification. Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. Pay range and Other Compensation & Benefits : $46.15 - $69.25 The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link . If you would like more information about this role, please contact Qualcomm Careers .

Requirements

Must-haves

Qualcomm Technologies, Inc.
Engineering Services Group, Engineering Services Group > CAD Component
Develop PCB layouts for a wide variety of 5G designs across multiple business units, including R&D, Mobile, Compute, IoT, Infrastructure, Automotive, and Test Equipment
Support form factor accurate (FFA) test platform circuit boards requiring mastery of digital processors, RF, radio circuits, and power control devices
Work with micro-vias (stacked), sequential lamination stack-ups, and design rules using 0.5mm pitch and smaller packages
Collaborate with US and India-based teams to deliver PCB design solutions for high-performance electronic assemblies
Develop and present PCB design trade-offs and solutions to the engineering design team for resolution and implementation
Determine trade-offs necessary to meet design requirements while producing high-quality, cost-effective PCBs that meet schedule objectives
Maintain technical coordination with Engineering and Manufacturing; resolve PCB design issues with fabrication and assembly vendors
Prepare and deliver design reviews to project teams
Contribute to process improvement initiatives, PCB and DFM checklists, and design guidelines
Collaborate with internal PCB designers to optimize product development processes and schedule execution
Provide direction, prioritization, and clear project task communication to team members and stakeholders
Manage multiple projects simultaneously in a fast-paced, dynamic environment
3+ years of active experience in PCB design for high-density electronics packaging
3+ years of experience in a PCB design role designing consumer-grade mobile products or low-volume test products utilizing latest-generation processor chips and ICs
Proficiency in Siemens/Mentor Xpedition, PADS, Altium or Cadence Allegro PCB design software
Associate’s degree in Electronics, Electrical Technology, or a related technical field
Experience with RF, Analog, and high-speed digital circuit design, including: DDR2/3/4/5, HDMI, PCIe, SATA, MIPI, USB 2.0/3.x, and GigE
Expert understanding and demonstrated application of PCB design principles, practices, and industry standards
Proven ability to perform complex PCB design tasks requiring in-depth knowledge of fabrication and assembly process capabilities and limitations
Experience with EMI mitigation techniques and practices
Experience with IDF/EMN file exchange between mechanical and hardware teams

Nice-to-haves

Preferred: Bachelor’s degree in electrical engineering, electronics engineering technology, or a related technical field

Application prep

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