Establish KPIs and reviews for excursion response time, recurring defect prevention, and yield learning transfer across products and technologies.
Provide foundry and device-engineering technical leadership for technology development and sustaining, translating process and device learnings into design rules, signoff guidance, and reliability and yield guardbands.
Mentoring engineers to understand device physics and its’ relationship to product performance
Front line communication channel for customer and company communication for any processing, quality, reliability, tapeout, NPI, B2B data and DRC issues on custom wafer fab processes and off the shelf wafer fab processes
Customer engineering support as technical lead on wafer fab –related issues
Engage with CFTs to ensure manufacturing, DRC violations and assembly requirements are met
Review tapeout floorplan, frame structures to ensure foundry-related test, assembly and customer requirements are met
Manage and drive major fundamental changes to frame and reticle tapeout structures and procedures to accommodate changing assembly and customer product performance needs
Lead end-to-end foundry transfer programs (qualification strategy, comparability plans, risk mitigation, and readiness reviews), ensuring continuity of yield, reliability, and cycle time for customer commitments.
Design and implement scalable foundry-engineering operating processes (intake, prioritization, documentation, and post-mortems) to improve cycle time, predictability, and cross-site execution.
Leverage past expertise with fab processes to ensure new designs and processes capture and utilize lessons learnt from past processing, tapeout, technical investigations and system issues
Travel up to 25% (Singapore and Japan)
Minimum Qualifications (Experience and Skills)
10+ Years of experience including semiconductor manufacturing, process development, or foundry technical interface
Experience working with deep sub-micron fab processes, wafer fab organizations based in Asia