Amphenol Communications Solutions (ACS), a division of Amphenol Corporation, is a world leader in interconnect solutions for Communications, Mobile, RF, Optics, and Commercial electronics markets. Amphenol Corporation is one of the world’s largest designers and manufacturers of electrical, electronic and fiber optic connectors and interconnect systems, antennas, sensors and sensor-based products and coaxial and high-speed specialty cable. ACS has an expansive global presence in research and development, manufacturing, and sales. We design and manufacture a wide range of innovative connectors as well as cable assemblies for diverse applications including server, storage, data center, mobile, RF, networking, industrial, business equipment, and automotive.
Position: Hardware Engineer – Interconnect systems
Location: Nashua, NH
Amphenol High Speed Products Group is the market leader for high speed, high bandwidth electrical connectors for the Telecom/Datacom market (Mobile Networks, Storage, Servers, Routers, Switches, etc.). Our products help to enable the electronics revolution and remain a key enabler for all the major Tier 1 OEMs globally. Our global headquarters are located in Nashua, NH and we have design, sales and manufacturing locations globally.
Position Summary
We are seeking an experienced Hardware Engineer to join our High-Speed Interconnect R&D team. The successful candidate will be responsible for the design, development, and validation of hardware platforms supporting Ethernet and PCIe interconnect products, including Active Electrical Cables (AEC), Optical Transceivers, and Linear Pluggable Optics (LPO).
The ideal candidate will have strong experience in high-speed digital hardware design, schematic capture, PCB development, component selection, power architecture, and board bring-up, working closely with cross-functional engineering teams from concept through production.
Responsibilities
Hardware Design & Development
• Design and develop hardware platforms for Ethernet and PCIe interconnect products such as AEC, optical transceiver, and LPO products.
• Develop schematics, component selection, and hardware design documentation.
• Define PCB stack-ups, layer assignments, and component placement requirements.
• Work closely with PCB layout engineers to optimize routing, manufacturability, and performance.
• Support design reviews and product qualification activities.
DSP and Retimer Integration
• Integrate DSPs, retimers, and SerDes devices into high-speed interconnect product test platforms.
• Collaborate with SI engineers to optimize channel performance and equalization.
• Support device bring-up, configuration, characterization, and validation.
• Develop and review high-speed channel architectures for copper and optical products.
• Support CMIS-compliant management architectures and low-speed control interfaces.
• Collaborate with optical, firmware, SI, and mechanical engineering teams.
Power Architecture
• Define power architectures including PMICs, DC-DC converters, LDOs, sequencing, and monitoring circuits.
• Support power integrity and analysis activities.
• Collaborate with thermal and mechanical teams to optimize cooling solutions, including direct module cooling and cold-plate architectures.
• Evaluate power consumption and thermal performance for high-density networking products.
Experience in below products is a plus
• Experience with OSFP, QSFP-DD, OSFP-XD, or LPO modules.
• Experience with Broadcom, Marvell, or similar high-speed networking chipsets.
• Experience supporting customer-facing technical discussions and design reviews.
Required Qualifications
• Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or a related field.
• 5+ years of experience in hardware design and development of high-speed networking or communication products.
• Strong understanding of signal integrity, power integrity, and high-speed design principles.
• Experience with optical networking products, AI infrastructure, cloud networking, or hyperscale data center platforms.
• Working knowledge of Ethernet standards, PCIe specifications, and high-speed networking architectures.
Amphenol Corporation is proud of our reputation as an excellent employer. Our focus is to provide the highest level of support and responsiveness to both our employees and our customers, the world's largest technology companies. Amphenol Corporation offers the opportunity for career growth within a global organization. We believe that Amphenol Corporation is unique in that every employee, regardless of his or her position, has the ability to positively impact the business.
Amphenol is an “Equal Opportunity Employer” - Minority/Female/Disabled/Veteran/Sexual Orientation/Gender Identity/National Origin. For additional company information please visit our website at amphenol-cs.com
Requirements
Must-haves
Position: Hardware Engineer – Interconnect systems
Location: Nashua, NH
Hardware Design & Development
Design and develop hardware platforms for Ethernet and PCIe interconnect products such as AEC, optical transceiver, and LPO products.
Develop schematics, component selection, and hardware design documentation.
Define PCB stack-ups, layer assignments, and component placement requirements.
Work closely with PCB layout engineers to optimize routing, manufacturability, and performance.
Support design reviews and product qualification activities.
DSP and Retimer Integration
Integrate DSPs, retimers, and SerDes devices into high-speed interconnect product test platforms.
Collaborate with SI engineers to optimize channel performance and equalization.
Support device bring-up, configuration, characterization, and validation.
Develop and review high-speed channel architectures for copper and optical products.
Support CMIS-compliant management architectures and low-speed control interfaces.
Collaborate with optical, firmware, SI, and mechanical engineering teams.
Power Architecture
Define power architectures including PMICs, DC-DC converters, LDOs, sequencing, and monitoring circuits.
Support power integrity and analysis activities.
Collaborate with thermal and mechanical teams to optimize cooling solutions, including direct module cooling and cold-plate architectures.
Evaluate power consumption and thermal performance for high-density networking products.
Experience with OSFP, QSFP-DD, OSFP-XD, or LPO modules.
Experience with Broadcom, Marvell, or similar high-speed networking chipsets.
Experience supporting customer-facing technical discussions and design reviews.
Nice-to-haves
Experience in below products is a plus
Application prep
Use the role’s language and application details while tailoring your materials.