Job description

Job Details: Job Description: As a Semiconductor Research Engineer, you will drive scientific innovation and research that shapes the future of semiconductor technologies. This role focuses on designing, simulating, and developing novel devices, packages, and interconnects using device physics, electromagnetics, and advanced materials science. You ll lead hands-on experiments to build prototypes that demonstrate groundbreaking concepts and collaborate across teams to establish methodologies that optimize performance, reliability, and cost. Your contributions will directly impact Intel s advancements in assembly packaging platform technologies, ensuring the company remains at the forefront of the industry. Business Group Join Intel Corporation s Thermal Core Comp organization, a team dedicated to enabling next-generation semiconductor technologies. This group leverages cutting-edge research and development efforts to ensure Intel delivers innovative assembly and packaging solutions that advance device miniaturization, high-speed signaling, and thermomechanical capabilities. As part of this team, you ll contribute to Intel s mission of transforming technology landscapes and driving industry progress. The primary responsibilities for this role will include, but are not limited to: Conduct research leveraging device physics, thermomechanical analysis, materials science, and process innovations to enable novel devices and systems. Design and fabricate prototypes to demonstrate proof-of-concepts for groundbreaking packaging and interconnect technologies. Perform electrical testing and establish methodologies for device characterization, including DC, RF signal analysis, pulsing, and stressing. Develop process solutions across production modules, such as lithography, etch, diffusion, CVD, PVD, and CMP, to address technological challenges. Plan and execute experiments in collaboration with device, reliability, and fabrication teams to benchmark results against industry standards. Develop models and measurements to advance the understanding of device physics, packaging, and systems for future technology platforms. Engage with external vendors and researchers to support collaborations and Intel s research pipeline. Qualifications: Minimum Qualifications : Minimum qualifications are required to be initially considered for this position. Bachelor s or BS degree in Electrical Engineering, Physics, Materials Science, Mechanical Engineering, or a related field. 6 years of experience with a bachelor s degree, 4 years with a master s degree, or 2 years with a PhD. Advanced experience in semiconductor fabrication processes, such as lithography, etch, diffusion, and packaging design methodologies. Advanced experience in simulation tools (e.g., Ansys, Abaqus) for finite element analysis and computational fluid dynamics. Advanced experience in programming skills in Python or MATLAB for engineering applications. Hands-on experience with experimental setups and data analysis techniques for lab testing. Minimum Qualifications : Minimum qualifications are required to be initially considered for this position. Experience with advanced packaging technologies, including EMIB and Foveros architectures. Expertise in Design of Experiments (DOE), statistical analysis methods, and model-based problem-solving techniques. Familiarity with materials characterization techniques and cross-disciplinary collaboration with academia and external partners. Proven ability to lead and influence technical teams to achieve milestones and drive performance improvements. Strong analytical and problem-solving abilities to address unique engineering challenges effectively. Excellent organizational and communication skills, with experience presenting findings and mentoring team members. Help us redefine the future of technology and innovation. Apply today to join a team that thrives on collaboration, expertise, and a shared passion for driving advancements in semiconductor research. Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel . Annual Salary Range for jobs which could be performed in the US: $164,470.00-232,190.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process. Work Model for this Role This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change. * ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Requirements

Must-haves

The primary responsibilities for this role will include, but are not limited to:
Conduct research leveraging device physics, thermomechanical analysis, materials science, and process innovations to enable novel devices and systems.
Design and fabricate prototypes to demonstrate proof-of-concepts for groundbreaking packaging and interconnect technologies.
Perform electrical testing and establish methodologies for device characterization, including DC, RF signal analysis, pulsing, and stressing.
Develop process solutions across production modules, such as lithography, etch, diffusion, CVD, PVD, and CMP, to address technological challenges.
Plan and execute experiments in collaboration with device, reliability, and fabrication teams to benchmark results against industry standards.
Develop models and measurements to advance the understanding of device physics, packaging, and systems for future technology platforms.
Engage with external vendors and researchers to support collaborations and Intel s research pipeline.
Minimum qualifications are required to be initially considered for this position.
Bachelor s or BS degree in Electrical Engineering, Physics, Materials Science, Mechanical Engineering, or a related field.
6 years of experience with a bachelor s degree, 4 years with a master s degree, or 2 years with a PhD.
Advanced experience in semiconductor fabrication processes, such as lithography, etch, diffusion, and packaging design methodologies.
Advanced experience in simulation tools (e.g., Ansys, Abaqus) for finite element analysis and computational fluid dynamics.
Advanced experience in programming skills in Python or MATLAB for engineering applications.
Hands-on experience with experimental setups and data analysis techniques for lab testing.
Minimum qualifications are required to be initially considered for this position.
Experience with advanced packaging technologies, including EMIB and Foveros architectures.
Expertise in Design of Experiments (DOE), statistical analysis methods, and model-based problem-solving techniques.
Familiarity with materials characterization techniques and cross-disciplinary collaboration with academia and external partners.
Proven ability to lead and influence technical teams to achieve milestones and drive performance improvements.
Strong analytical and problem-solving abilities to address unique engineering challenges effectively.
Excellent organizational and communication skills, with experience presenting findings and mentoring team members.
Help us redefine the future of technology and innovation. Apply today to join a team that thrives on collaboration, expertise, and a shared passion for driving advancements in semiconductor research.
Job Type: Experienced Hire

Nice-to-haves

None flagged.

Application prep

Use the role’s language and application details while tailoring your materials.

Keywords to mirror

python

Platform: workday
Effort: long