Job description

About Analog Devices Analog Devices, Inc. (NASDAQ: ADI ) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today s innovators stay Ahead of What s Possible. Learn more at www.analog.com and on LinkedIn and X . Senior Systems Semiconductor Packaging Engineer About the Role As a Senior Systems Semiconductor Packaging Engineer, you will lead the development of advanced semiconductor packaging solutions for MEMS sensors used in automotive, industrial, medical, aerospace, and defense applications. You will work across the product lifecycle, from concept through manufacturing readiness, helping translate product and customer requirements into robust, scalable packaging solutions. This role calls for strong technical judgment, cross-functional collaboration, and hands-on problem solving. You will partner closely with teams across applications, quality, reliability, manufacturing, and external vendors to improve package performance, manufacturability, and time to market. Key Responsibilities Packaging Development: - Lead project-level semiconductor packaging design activities from product conception through manufacturing readiness Manufacturability and Reliability: - Drive design for manufacturability and design for reliability through process characterization, risk assessment, and structured problem solving Root Cause and Yield Improvement: - Partner with quality and reliability teams to perform root cause analysis, improve yield, and implement corrective and preventive actions Engineering Analysis: - Perform detailed package analysis using 3D CAD tools such as SolidWorks and simulation tools such as ANSYS to evaluate mechanical and process performance Process and Quality Methods: - Apply engineering methodologies including control plans, PFMEA, DOE, SPC, 8D, and RCA to improve product and process outcomes Customer Requirements Translation: - Partner with Applications Engineering to translate customer specifications into clear technical direction for internal development teams OSAT Collaboration: - Work with OSAT partners to support rapid prototyping, early builds, and preliminary qualification activities Vendor and Assembly Readiness: - Help reduce time to market by aligning package designs with vendor assembly capabilities and manufacturing constraints Cross-Functional Leadership: - Collaborate with multidisciplinary teams to support execution, issue resolution, and product success across development phases Required Skills Semiconductor Packaging Expertise: - Strong experience in semiconductor packaging and manufacturing processes, with the ability to support package development from concept through release Materials Knowledge: - Strong understanding of substrates, adhesives, underfills, mold compounds, and interconnect materials used in semiconductor packaging Design for Reliability: - Experience applying reliability and manufacturability principles to package design, qualification readiness, and process optimization Simulation and Analysis Tools: - Hands-on experience with 3D CAD and engineering analysis tools such as SolidWorks and ANSYS Structured Problem Solving: - Demonstrated ability to apply DOE, PFMEA, SPC, 8D, RCA, and related methods to solve technical and manufacturing challenges Cross-Functional Collaboration: - Ability to work effectively across applications, manufacturing, quality, reliability, and external partner teams Technical Communication: - Strong communication skills with the ability to translate technical issues and requirements clearly across stakeholders Preferred Education and Experience Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, or a related technical field 5 years of relevant experience in semiconductor packaging, process development, or manufacturing engineering Experience supporting MEMS, sensor, or advanced package development is a plus Experience working with OSAT partners and external manufacturing vendors is preferred We recognize that candidates may not meet every listed requirement. If you bring relevant experience and a willingness to learn, we encourage you to apply. #LI-PG1 For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process. Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group. EEO is the Law: Notice of Applicant Rights Under the Law . Job Req Type: Experienced Required Travel: Yes, 10% of the time Shift Type: 1st Shift/Days The expected wage range for a new hire into this position is $110,385 to $151,808. Actual wage offered may vary depending on work location , experience, education, training, external market data, internal pay equity, or other bona fide factors. This position qualifies for a discretionary performance-based bonus which is based on personal and company factors. This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time , and other benefits.

Requirements

Must-haves

Packaging Development: - Lead project-level semiconductor packaging design activities from product conception through manufacturing readiness
Manufacturability and Reliability: - Drive design for manufacturability and design for reliability through process characterization, risk assessment, and structured problem solving
Root Cause and Yield Improvement: - Partner with quality and reliability teams to perform root cause analysis, improve yield, and implement corrective and preventive actions
Engineering Analysis: - Perform detailed package analysis using 3D CAD tools such as SolidWorks and simulation tools such as ANSYS to evaluate mechanical and process performance
Process and Quality Methods: - Apply engineering methodologies including control plans, PFMEA, DOE, SPC, 8D, and RCA to improve product and process outcomes
Customer Requirements Translation: - Partner with Applications Engineering to translate customer specifications into clear technical direction for internal development teams
OSAT Collaboration: - Work with OSAT partners to support rapid prototyping, early builds, and preliminary qualification activities
Vendor and Assembly Readiness: - Help reduce time to market by aligning package designs with vendor assembly capabilities and manufacturing constraints
Cross-Functional Leadership: - Collaborate with multidisciplinary teams to support execution, issue resolution, and product success across development phases
Semiconductor Packaging Expertise: - Strong experience in semiconductor packaging and manufacturing processes, with the ability to support package development from concept through release
Materials Knowledge: - Strong understanding of substrates, adhesives, underfills, mold compounds, and interconnect materials used in semiconductor packaging
Design for Reliability: - Experience applying reliability and manufacturability principles to package design, qualification readiness, and process optimization
Simulation and Analysis Tools: - Hands-on experience with 3D CAD and engineering analysis tools such as SolidWorks and ANSYS
Structured Problem Solving: - Demonstrated ability to apply DOE, PFMEA, SPC, 8D, RCA, and related methods to solve technical and manufacturing challenges
Cross-Functional Collaboration: - Ability to work effectively across applications, manufacturing, quality, reliability, and external partner teams
Technical Communication: - Strong communication skills with the ability to translate technical issues and requirements clearly across stakeholders
Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, or a related technical field
5 years of relevant experience in semiconductor packaging, process development, or manufacturing engineering
We recognize that candidates may not meet every listed requirement. If you bring relevant experience and a willingness to learn, we encourage you to apply.
EEO is the Law: Notice of Applicant Rights Under the Law .
Job Req Type: Experienced

Nice-to-haves

Preferred Education and Experience
Experience supporting MEMS, sensor, or advanced package development is a plus
Experience working with OSAT partners and external manufacturing vendors is preferred

Application prep

Use the role’s language and application details while tailoring your materials.

Keywords to mirror

aigo

Platform: workday
Effort: long

Benefits

Benefits detected in the listing.

Dental

Vision

401k