CAD/PCB Design Engineer, Pixel Phones
Google· Internet & Cloud Services· Jul 27, 2026 · 3mo agoPosted 92 days ago
Chicago, IL, USA
In office
Full-time
Mid
$130K–$175K est.
2+ years exp
Before you apply
Ghost Signal:
Open since July 27, 2026 — 92 days, and still accepting applications.
Job description
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration. The Google Pixel team focuses on designing and delivering the world's most helpful mobile experience. The team works on shaping the future of Pixel devices and services through some of the most advanced designs, techniques, products, and experiences in consumer electronics. This includes bringing together the best of Google’s artificial intelligence, software, and hardware to build global smartphones and create transformative experiences for users across the world.
Individual pay is determined by factors including job-related skills, experience, and relevant education or training.
US: $132000 - $189000 (USD) + 15% bonus target + equity + benefits
Learn more about benefits at Google .
• Drive the mechanical and electrical design of printed circuit boards (PCBs) from initial concept through mass production, including outline creation, layer stack-up definition, optimal component placement, and high-speed signal routing.
• Collaborate closely with board fabrication vendors to establish and implement precise impedance control rules, while ensuring adherence to design for manufacturing (DFM), design for assembly (DFA), and design for testability (DFT) guidelines.
• Serve as a key interface between Electrical Engineers, PCB Designers, Mechanical Engineers, and Fabricators, facilitating seamless communication and problem-solving throughout the product development lifecycle.
• Foster robust cross-functional partnerships with Electrical Engineering, Product Design, and DFM/DFA teams to optimize designs for performance, manufacturability, and cost-effectiveness.
• Utilize advanced CAD tools and methodologies to create and maintain complex PCB layouts, ensuring signal integrity and power delivery meet stringent performance requirements.
• Bachelor’s degree in Electrical Engineering, Computer Engineering, Physics, a related field, or equivalent practical experience.
• 2 years of experience working in PCB design, or 1 year of experience with an advanced degree.
Minimum qualifications:
• Bachelor’s degree in Electrical Engineering, Computer Engineering, Physics, a related field, or equivalent practical experience.
• 2 years of experience working in PCB design, or 1 year of experience with an advanced degree.
Preferred qualifications:
• Experience with PCB design tools and methodologies.
• Experience in both flexible printed circuit (FPC) and rigid-flex layout techniques, showcasing versatility in various design challenges.
• Proficiency in executing high-speed board designs and complex layouts, including a thorough familiarity with high-density Ball-Grid Array (BGA) packages.
• Knowledge of mechanical design outline formats, ensuring seamless integration and collaboration between electrical and mechanical design teams.
• Understanding of phases of hardware development, from initial schematic entry and meticulous manual constraint generation to rigorously meeting all design requirements and producing polished board layouts.
Application prep
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