Job description

Company: Qualcomm Technologies, Inc. Job Area: Engineering Services Group, Engineering Services Group > CAD Component General Summary: Qualcomm is a company of inventors that unlocked 5G & 6G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 6Gs potential into world-changing technologies and products. This is the Invention Age - and this is where you come in. The successful candidate will operate as a member of the Central Hardware Systems CAD layout department, and will be able to design and document printed circuit board layouts that conform to manufacturing and industry standards and Qualcomm design guidelines. You’ll collaborate with electrical and mechanical engineering teams to elevate schematics and constraints into high-quality PCB layouts for advanced layout designs across Server, 6G and compute platforms. Key Responsibilities include • Design PCB layouts for reference server and PC compute systems, including form factor accurate (FFA) test platforms and high-volume circuit boards. • Engineer high-speed, multi-layer stack-ups encompassing application processors, digital processors, RF/radio circuits, and power delivery networks. • Utilize advanced manufacturing techniques: stacked micro-vias, sequential lamination, and small-pitch package design rules. • Collaborate effectively with internal teams in the U.S. and design partners in India to deliver high-performance PWB solutions. • Liaise with internal stakeholders and external vendors to support PCB fabrication and assembly throughout the product lifecycle. The candidate is expected to have proficiency on Siemens/Mentor Xpedition, or Cadence Allegro PCB design software and is expected to have experience in developing PCB design solutions for a variety of design types and working with internal teams and external suppliers to support PCB fabrication and assembly. Minimum Qualifications • 5+ years actively involved in PCB high speed design. • 5+ years actively involved in PCB design for HDI & high-density electronics packaging. • 2+ years experience in a PCB design role designing consumer-grade products or low volume test products utilizing latest generation processor chips & ICs. • Design for Manufacture (DFM) analysis experience utilizing Valor and/or CAM350 tools. Preferred Qualifications • Design experience: RF, Analog, High-speed digital circuits – DDR5 & 6, HDMI, PCIe, SATA, MIPI, USB 2,3.x, GigE, LPDDR breakouts, complex stackups. • Expected to possess expert understanding and demonstrated application of PCB design principles, practices, and standards. • Able to perform complex and difficult PCB design tasks requiring extensive skill and knowledge of fabrication and assembly process capabilities and limitations. • Develops solutions to a variety of complex problems and proposes PCB design trade-offs to the engineering design team for resolution and implementation. • Determine PCB design trade-offs necessary to meet design requirements and produce high quality cost effective PCB’s that meet schedule objectives. • Understands the requirements driving PCB technology and process trends and their application to Qualcomm designs. • Maintain technical coordination with Engineering and Manufacturing. Resolve PCB design issues with fabrication and assembly vendors. • Participate and provide input into process improvement, PCB and DFM checklists and guidelines. • Participates in determining objectives of assignment and plans, schedules, and arranges own activities in accomplishing objectives. • Experience working with various EMI mitigation techniques and practices. • Experience with IDF/EMN file exchange between mechanical and HW teams. • Understands project goals and individual contribution toward those goals. • Effectively communicates with project peers and engineering personnel via e-mail, web meetings, and instant messaging including status reports and illustrative presentation slides. • Interact and collaborate with HW leads, Engineering team & other internal PCB designers for optimal product development processes and schedule execution. • Effectively multitasks and meets aggressive schedules in a dynamic environment. • Prepare and deliver design reviews to project team. • Possess excellent verbal and written communication skills • Leadership skills to help direct, prioritize, and clearly set project tasks per schedule. Communicate milestones and directions to outside team members. Applicants : Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here . Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). To all Staffing and Recruiting Agencies : Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications. EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification. Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. Pay range and Other Compensation & Benefits : $57.70 - $86.50 The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link . If you would like more information about this role, please contact Qualcomm Careers .

Requirements

Must-haves

Qualcomm Technologies, Inc.
Engineering Services Group, Engineering Services Group > CAD Component
Key Responsibilities include
Design PCB layouts for reference server and PC compute systems, including form factor accurate (FFA) test platforms and high-volume circuit boards.
Engineer high-speed, multi-layer stack-ups encompassing application processors, digital processors, RF/radio circuits, and power delivery networks.
Utilize advanced manufacturing techniques: stacked micro-vias, sequential lamination, and small-pitch package design rules.
Collaborate effectively with internal teams in the U.S. and design partners in India to deliver high-performance PWB solutions.
Liaise with internal stakeholders and external vendors to support PCB fabrication and assembly throughout the product lifecycle.
5+ years actively involved in PCB high speed design.
5+ years actively involved in PCB design for HDI & high-density electronics packaging.
2+ years experience in a PCB design role designing consumer-grade products or low volume test products utilizing latest generation processor chips & ICs.
Design for Manufacture (DFM) analysis experience utilizing Valor and/or CAM350 tools.

Nice-to-haves

Design experience: RF, Analog, High-speed digital circuits – DDR5 & 6, HDMI, PCIe, SATA, MIPI, USB 2,3.x, GigE, LPDDR breakouts, complex stackups.
Expected to possess expert understanding and demonstrated application of PCB design principles, practices, and standards.
Able to perform complex and difficult PCB design tasks requiring extensive skill and knowledge of fabrication and assembly process capabilities and limitations.
Develops solutions to a variety of complex problems and proposes PCB design trade-offs to the engineering design team for resolution and implementation.
Determine PCB design trade-offs necessary to meet design requirements and produce high quality cost effective PCB’s that meet schedule objectives.
Understands the requirements driving PCB technology and process trends and their application to Qualcomm designs.
Maintain technical coordination with Engineering and Manufacturing. Resolve PCB design issues with fabrication and assembly vendors.
Participate and provide input into process improvement, PCB and DFM checklists and guidelines.
Participates in determining objectives of assignment and plans, schedules, and arranges own activities in accomplishing objectives.
Experience working with various EMI mitigation techniques and practices.
Experience with IDF/EMN file exchange between mechanical and HW teams.
Understands project goals and individual contribution toward those goals.

Application prep

Use the role’s language and application details while tailoring your materials.

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