Job description

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview The Digital Data Networks (DDN) Business Unit is seeking a highly skilled and driven PRINCIPAL R&D/PRODUCT DVL ENGINEER within the Advanced Development (AD) team. In this key technical role, you will be responsible for spearheading structural mechanics, thermal-mechanical coupling, and multi-physics modeling to rapidly screen, evaluate, and down-select next-generation high-speed interconnect technology concepts. You will tackle critical engineering challenges across switches, servers, data storage systems, and AI hardware platforms—pushing the boundaries of density, signal integrity, and mechanical reliability. As a senior technical contributor in the DDN Advanced Development team, you will establish first-principles analytical models and high-fidelity simulations to generate decision-quality performance predictions. You will lead simulation-driven design trade-offs, drive model-to-test correlation, and partner closely with cross-functional teams including Signal Integrity, Mechanical Design, Product Management, and Front-Line Product Engineering (PDE/NPI). Additionally, you will play an instrumental role in shaping the team’s Advanced Simulation roadmap and maturing virtual prototyping methodologies. Key qualifications include a proven track record of superior technical expertise in finite element analysis (FEA), advanced mechanical and thermal-mechanical modeling, and a passion for engineering innovation. You are expected to drive prediction-driven decision-making through rigorous model verification and validation (V&V), clearly communicate engineering trade-offs, and mentor engineering peers in best simulation practices. Job Requirements • Lead the development, application, and continuous improvement of first-principles engineering analysis, FEA modeling, and multi-physics simulation to down-select solution concepts. • Build first principles and reduced-order mechanical/thermal models to quickly screen early architectures and identify scaling limits. • Execute advanced high-fidelity non-linear structural and thermal-mechanical simulations (e.g., elastoplastic deformation, creep, stress relaxation, thermal expansion/CTE mismatch, contact mechanics, and insertion/retention force). • Perform sensitivity studies, tolerance stack-ups, and statistical variation analyses to understand assembly robustness, coplanarity, and risk early in the product lifecycle. • Partner with design engineers to define simulation-ready geometry, boundary conditions, and loading scenarios supported by GD&T interpretation. • Handle complex FEA models involving hundreds of components in high-speed interconnect systems to build high-fidelity simulation models. Simplify models as appropriate to balance simulation accuracy, computational efficiency, and delivery timelines. • Deliver comprehensive simulation reports, actionable design recommendations, and technical presentations to drive executive and architectural down-selection. • Define and lead physical prototype test plans; actively partner with test labs to execute model verification and validation (V&V), correlate experimental data with simulation results, and calibrate constitutive material models. • Collaborate with PDE/NPI teams to ensure smooth handoff of validated simulation models, design guidelines, and predictive methodologies for commercialization. • Champion simulation process automation, script development, and methodology standardization across the engineering group. • Maintain deep awareness of cutting-edge simulation tools, high-performance computing (HPC/Cloud), advanced material systems, and emerging packaging/interconnect technologies. What your background should look like • Bachelor’s degree in Mechanical Engineering, Aerospace Engineering, Materials Science, or related field; Master’s Degree or Ph.D. strongly preferred . • Generally requires 8–10+ years of progressive engineering experience in high-fidelity FEA and structural/thermal-mechanical analysis in high-tech electromechanical products, connectors, high-speed interconnects, or electronic packaging. • Recognized technical expert in commercial FEA platforms (e.g., Ansys Mechanical , preferred) with demonstrated mastery in non-linear materials, complex contact interfaces, dynamic response, and thermal-stress coupling. • Strong practical experience in test correlation and model calibration (e.g., strain gauge testing, displacement/force measurement, thermal warpage profiling). • Deep understanding of high-speed interconnect architecture, micro-contact physics, spring pin design, socket/cable assemblies, and CTE management in AI/compute hardware environments. • Working knowledge of 3D CAD platforms (Creo and SpaceClaim preferred) for geometric defeaturing, parameterization, and simulation prep. • Experience with cloud/HPC simulation environments (e.g., Rescale) and automation scripting (Python, MATLAB) is a plus. • Proven ability to work effectively in a cross-functional, global R&D environment, translating complex technical findings into actionable engineering guidance. • Excellent written and verbal communication skills. Competencies • Values: Integrity, Accountability, Teamwork, Innovation • Technical Leadership & Influence (Individual Contributor track) • Problem Solving & Analytical Rigor ABOUT TE CONNECTIVITY TE Connectivity plc (NYSE: TEL) is a global industrial technology leader creating a safer, sustainable, productive, and connected future. As a trusted innovation partner, our broad range of connectivity and sensor solutions enable the distribution of power, signal and data to advance next-generation transportation, energy networks, automated factories, data centers enabling artificial intelligence, and more. Our more than 90,000 employees, including 10,000 engineers, work alongside customers in approximately 130 countries. In a world that is racing ahead, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com and on LinkedIn , Facebook , WeChat, Instagram and X (formerly Twitter). COMPENSATION • Competitive base salary commensurate with experience: $158,200 – 197,800 (subject to change dependent on physical location) • Posted salary ranges are made in good faith. TE Connectivity reserves the right to adjust ranges depending on the experience/qualification of the selected candidate as well as internal and external equity. • Total Compensation = Base Salary + Incentive(s) + Benefits BENEFITS • A comprehensive benefits package including health insurance, 401(k), disability, life insurance, employee stock purchase plan, paid time off and voluntary benefits. EOE, Including Disability/Vets IMPORTANT NOTICE REGARDING RECRUITMENT FRAUD TE Connectivity has become aware of fraudulent recruitment activities being conducted by individuals or organizations falsely claiming to represent TE Connectivity. Please be advised that TE Connectivity never requests payment or fees from job applicants at any stage of the recruitment process. All legitimate job openings are posted exclusively on our official careers website at te.com/careers, and all email communications from our recruitment team will come only from actual email addresses ending in @te.com . If you receive any suspicious communications, we strongly advise you not to engage or provide any personal information, and to report the incident to your local authorities.

Requirements

Must-haves

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world.
Job Overview
Job Requirements
Lead the development, application, and continuous improvement of first-principles engineering analysis, FEA modeling, and multi-physics simulation to down-select solution concepts.
Build first principles and reduced-order mechanical/thermal models to quickly screen early architectures and identify scaling limits.
Perform sensitivity studies, tolerance stack-ups, and statistical variation analyses to understand assembly robustness, coplanarity, and risk early in the product lifecycle.
Partner with design engineers to define simulation-ready geometry, boundary conditions, and loading scenarios supported by GD&T interpretation.
Deliver comprehensive simulation reports, actionable design recommendations, and technical presentations to drive executive and architectural down-selection.
Collaborate with PDE/NPI teams to ensure smooth handoff of validated simulation models, design guidelines, and predictive methodologies for commercialization.
Champion simulation process automation, script development, and methodology standardization across the engineering group.
Maintain deep awareness of cutting-edge simulation tools, high-performance computing (HPC/Cloud), advanced material systems, and emerging packaging/interconnect technologies.
What your background should look like
Strong practical experience in test correlation and model calibration (e.g., strain gauge testing, displacement/force measurement, thermal warpage profiling).
Deep understanding of high-speed interconnect architecture, micro-contact physics, spring pin design, socket/cable assemblies, and CTE management in AI/compute hardware environments.
Proven ability to work effectively in a cross-functional, global R&D environment, translating complex technical findings into actionable engineering guidance.
Excellent written and verbal communication skills.
Competencies
Values: Integrity, Accountability, Teamwork, Innovation
Technical Leadership & Influence (Individual Contributor track)
Problem Solving & Analytical Rigor

Nice-to-haves

Bachelor’s degree in Mechanical Engineering, Aerospace Engineering, Materials Science, or related field; Master’s Degree or Ph.D. strongly preferred .
Recognized technical expert in commercial FEA platforms (e.g., Ansys Mechanical , preferred) with demonstrated mastery in non-linear materials, complex contact interfaces, dynamic response, and thermal-stress coupling.
Working knowledge of 3D CAD platforms (Creo and SpaceClaim preferred) for geometric defeaturing, parameterization, and simulation prep.
Experience with cloud/HPC simulation environments (e.g., Rescale) and automation scripting (Python, MATLAB) is a plus.

Application prep

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Benefits

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Health Insurance

401(K)

Paid Time Off