Job description

Company: Qualcomm Technologies, Inc. Job Area: Engineering Group, Engineering Group > Systems Engineering General Summary: Qualcomm's Chipset Systems & Architecture team drives definition of industry-leading chipsets through analysis of chipset partitions, PMIC and power grid, and power distribution network (PDN), clock distribution network, chipset interfaces, PCB and Platform cost, power and performance optimization. Please note “Chipset” in this context refers to the set of chips that make a product and includes the main SOC, Power Management chips, codec, wireless connectivity and modem. We are seeking a Principal Chipset Project Engineer – Hardware PCB/Platform Systems for Personal Compute (PC) to lead Platform/PCB strategy across the entire compute product portfolio. This is a leadership role responsible for defining PCB and hardware platform architecture, driving cost‑optimized system decisions, enabling scalable solutions, influencing platform direction and roadmaps, and engaging with vendors, OEMs, and ODMs to enable competitive PC platforms. The lead will work closely with Product Management, PC engineering leads, Packaging and PCB design engineers, Signal and Power Integrity engineers, Customer Engineering, Sourcing & vendor contacts to ensure we meet aggressive cost, area, power and performance targets for Qualcomm’s Compute PCB, Platform & Systems solutions. Decisions made in this role directly and materially impact platform cost, manufacturability, scalability, and market competitiveness. Responsibilities • Lead early PCB architectural trade‑off decisions, evaluating solution options and clearly articulating cost, power, performance, and risk implications in architecture reviews, product councils, and leadership forums. • Set, execute, and own targets for PCB cost, area, and bill of materials while maintaining best‑in‑class power and system performance. • Drive PCB competitiveness across platforms, including layer count and stack‑up minimization, board area and routing efficiency, customer design simplicity, and platform reuse across SKUs and generations. • Provide cross‑functional leadership & establish partnership across chipset systems & architecture, product management, packaging, platform hardware, SI/PI, validation, test, software, and customer engineering to ensure coherent end‑to‑end execution. • Engage with vendors, OEMs, and ODMs to align on early platform and PCB architecture and enable manufacturable, cost‑effective designs. • Establish best practices and execution playbooks for cost‑driven platform and PCB architecture to enable repeatable, scalable execution. • Influence future chipset and platform roadmaps using execution experience and competitive analysis of industry platforms. Minimum Qualifications: • Bachelor's degree in Engineering, Information Systems, Computer Science, or related field and 8+ years of Systems Engineering or related work experience. OR Master's degree in Engineering, Information Systems, Computer Science, or related field and 7+ years of Systems Engineering or related work experience. OR PhD in Engineering, Information Systems, Computer Science, or related field and 6+ years of Systems Engineering or related work experience. Preferred Qualifications: • 12+ years of experience in hardware platform architecture and PCB design with a focus on the personal computer (PC) segment . • Strong understanding of PCB architecture fundamentals, including layer drivers, stack‑up trade‑offs, routing density, and cost impacts. • Strong knowledge of power delivery networks (PDN), signal integrity (SI), and power integrity (PI), and how these constraints drive PCB architecture, stack‑up, and layout decisions. • Proven track record of making early architectural decisions that materially impact platform cost, complexity, manufacturability, and scalability. • Ability to clearly articulate PCB design and architectural choices and their impact on cost, power, performance, and manufacturability, and to work with vendors, OEMs, and ODMs to drive scalable, low‑cost strategies across products. • Demonstrated ability to lead and influence across highly matrixed, cross‑functional teams. • Strong communication skills with experience interfacing with senior executives, customers, and cross‑functional leadership teams. • Knowledge of PCB design tools & experience reviewing layouts in partnership with hardware design and layout leads. • Experience with OEM enablement of optimal PCB solutions • Familiarity with state‑of‑the‑art IC, package, and PCB design practices and trade‑offs. • Master’s, Electrical Engineering or Compute Engineering Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here . Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). To all Staffing and Recruiting Agencies : Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications. EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification. Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. Pay range and Other Compensation & Benefits : $197,000.00 - $295,400.00 The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link . If you would like more information about this role, please contact Qualcomm Careers .

Requirements

Must-haves

Qualcomm Technologies, Inc.
Engineering Group, Engineering Group > Systems Engineering
Lead early PCB architectural trade‑off decisions, evaluating solution options and clearly articulating cost, power, performance, and risk implications in architecture reviews, product councils, and leadership forums.
Set, execute, and own targets for PCB cost, area, and bill of materials while maintaining best‑in‑class power and system performance.
Drive PCB competitiveness across platforms, including layer count and stack‑up minimization, board area and routing efficiency, customer design simplicity, and platform reuse across SKUs and generations.
Engage with vendors, OEMs, and ODMs to align on early platform and PCB architecture and enable manufacturable, cost‑effective designs.
Establish best practices and execution playbooks for cost‑driven platform and PCB architecture to enable repeatable, scalable execution.
Influence future chipset and platform roadmaps using execution experience and competitive analysis of industry platforms.
Bachelor's degree in Engineering, Information Systems, Computer Science, or related field and 8+ years of Systems Engineering or related work experience.
Master's degree in Engineering, Information Systems, Computer Science, or related field and 7+ years of Systems Engineering or related work experience.
PhD in Engineering, Information Systems, Computer Science, or related field and 6+ years of Systems Engineering or related work experience.
12+ years of experience in hardware platform architecture and PCB design with a focus on the personal computer (PC) segment .

Nice-to-haves

Strong understanding of PCB architecture fundamentals, including layer drivers, stack‑up trade‑offs, routing density, and cost impacts.
Strong knowledge of power delivery networks (PDN), signal integrity (SI), and power integrity (PI), and how these constraints drive PCB architecture, stack‑up, and layout decisions.
Proven track record of making early architectural decisions that materially impact platform cost, complexity, manufacturability, and scalability.
Demonstrated ability to lead and influence across highly matrixed, cross‑functional teams.
Strong communication skills with experience interfacing with senior executives, customers, and cross‑functional leadership teams.
Knowledge of PCB design tools & experience reviewing layouts in partnership with hardware design and layout leads.
Experience with OEM enablement of optimal PCB solutions
Familiarity with state‑of‑the‑art IC, package, and PCB design practices and trade‑offs.
Master’s, Electrical Engineering or Compute Engineering
$197,000.00 - $295,400.00
If you would like more information about this role, please contact Qualcomm Careers .

Application prep

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