Job description

The Camera Hardware Engineering group is responsible for the design, development, and innovation of camera hardware for all related Apple products. Our target is to deliver extraordinary hardware to enable outstanding camera user experience. We are looking for an enthusiastic, passionate individual who can help us with tomorrow’s challenges! BS in Electrical Engineering, Computer Engineering, Physics, or related field with at least 3 years of relevant industry experience Analog and/or digital circuit design including Schematics capture and/or supervising layout for substrate, rigid PCB, or Flex Experience in signal and power integrity (High-speed design, PDN analysis) Experience in system integration knowledge for grounding, shielding, EMI, EMC and ESD Masters of Science or PhD in Electrical Engineering, Computer Engineering, Physics, or related field with 10 years of relevant industry experience. Knowledge of layout strategies for Substrates, Rigid PCB, Flex, or Rigid-Flex including good understanding of material selection, Stack-up planning and noise suppression Experience with high-speed interfaces : MIPI, DisplayPort, HDMI, PCIE etc., circuits and designs: LDO, Buck, ADC, DAC, Op-AMP, etc., and control interface like I2C, SPI, SPMI, UART, etc. Hands-on lab experience with hardware bring-up and debug Experience with high volume consumer electronics design for manufacturing, testing and reliability (DFM, DFT, DFR) Knowledge of CMOS image sensor, ISP or image processing Excellent written, verbal and communication skills focused on teamwork and collaboration in a dynamic cross-functional environment Statistical data analysis and visualization (ex. JMP)

Requirements

Must-haves

BS in Electrical Engineering, Computer Engineering, Physics, or related field with at least 3 years of relevant industry experience
Analog and/or digital circuit design including Schematics capture and/or supervising layout for substrate, rigid PCB, or Flex
Experience in signal and power integrity (High-speed design, PDN analysis)
Experience in system integration knowledge for grounding, shielding, EMI, EMC and ESD
Masters of Science or PhD in Electrical Engineering, Computer Engineering, Physics, or related field with 10 years of relevant industry experience.
Knowledge of layout strategies for Substrates, Rigid PCB, Flex, or Rigid-Flex including good understanding of material selection, Stack-up planning and noise suppression
Experience with high-speed interfaces : MIPI, DisplayPort, HDMI, PCIE etc., circuits and designs: LDO, Buck, ADC, DAC, Op-AMP, etc., and control interface like I2C, SPI, SPMI, UART, etc.
Hands-on lab experience with hardware bring-up and debug
Experience with high volume consumer electronics design for manufacturing, testing and reliability (DFM, DFT, DFR)
Knowledge of CMOS image sensor, ISP or image processing
Excellent written, verbal and communication skills focused on teamwork and collaboration in a dynamic cross-functional environment
Statistical data analysis and visualization (ex. JMP)

Nice-to-haves

None flagged.

Application prep

Use the role’s language and application details while tailoring your materials.

Platform: apple
Effort: medium