Job description

Staff Engineer, Hardware Design Req ID: 131066 Band: 10 Region: Americas Country: USA State/Province: Texas City: Austin About Celestica: If you’re reading this, chances are that you’re getting this information over at least one piece of hardware that we designed, developed, manufactured or service. Celestica is the brand behind the brands you love in tech. We design, develop, and manufacture leading-edge Hardware Platform Solutions in Networking, Storage, and Server solutions from general purpose to customized Cloud, AI, machine learning, Edge and 5G deployments. Across Data Centers and Enterprise deployments, we are partnered with an impressive roster of some of the world’s biggest tech companies. We work with 9 of the top 10 global internet service providers, 4 of the top 5 global storage providers, 3 of the top 5 networking OEMs, and the top 3 non-X86 server providers engineering solutions for this generation and the next. Our customers experience firsthand the power of our people - people who share a passion for innovation, technology, collaboration, performance and quality. People who, together, make a formidable team that is not only transforming our company, but transforming the technology landscape of the future. Celestica might not be a household name, but as you evaluate the companies, industries, cultures and teams that you are considering for your next career move, we hope that one thing will become very clear: Celestica is no ordinary company. We are change makers. Innovators. And we have an unrelenting drive to find the way for our customers. Let’s engineer the future together. Summary Join a world class team to create high end electronics cooling solutions for systems such as AI servers, switches, and accelerators. We work hard together to design at the leading edge of cooling technology. Must have relevant coursework in heat transfer and fluid mechanics, and good familiarity with 3D software applications. As a member of the Hardware Product Development team, you have the ability to work in partnership with hardware, software, and thermal architects within and outside Celestica to define the best in class products. Celestica has a profoundly cooperative and nonconfrontational culture. Responsibilities: • Complete ownership of thermal design for various electronic products from thermal modeling, design, test, and design revision, until transfer to manufacturing. • Conduct thermal simulations, postprocessing, and analysis ranging from chip to facilities level to verify thermal feasibility, risk, and to inform your designs. • Maintain awareness of heat transfer hardware available from all sources, including how it operates and performs, its cost, and how it can be incorporated into our products. • Conceive and implement ways to enhance and extend operation of heat transfer hardware. • Consider the thermal aspects of chip packaging technologies. • Apply best-in-class fluid flow geometry and technology to cool high heat flux chips. • Determine and consider the effects of contact resistance and the use of Thermal Interface Materials. • Apply air cooling when possible and liquid cooling when necessary to achieve full performance and reliability at the lowest cost. • Size liquid cold plates, heat sinks, heat pipes, air movers, air filters, air ducting, and perforated plates. • Plan your work to achieve full required performance, and stay on schedule to support overall product development. • Reference real world limitations to inform your work, such as manufacturing methods and cost, reliability, variability of incoming parts, and tolerances on all specifications. • Perform hands-on lab tests of equipment from component to rack and facility level for design and model validation. Document thermal test plans, devise and build test stands, including technical support, cooling liquid supply, power delivery, metrology and instrumentation, compute workload, experiment control, and data recording. • Analyze test data to draw inferences about the equipment tested. Apply statistical methods as required to maximize utilization of data and test usefulness. • Work with multi-disciplinary groups to define system requirements and design products. • Work with cross-functional teams to identify root causes of system performance. Typical Education Master’s degree in Mechanical Engineering. Preference given to candidates with their Master’s concentration in heat transfer and fluid mechanics. Educational Requirements may vary by Geography Notes This job description is not intended to be an exhaustive list of all duties and responsibilities of the position. Employees are held accountable for all duties of the job. Job duties and the % of time identified for any function are subject to change at any time. Salary Range: The salary range described in this posting is an estimate by the Company, and may change based on several factors, including by not limited to a change in the duties covered by the job posting, or the credentials, experience or geographic jurisdiction of the successful candidate. Salary Range: $ 128K - $200K Annually All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or status as a protected veteran. Celestica's policy on equal employment opportunity prohibits discrimination based on race, color, creed, religion, national origin, gender, sexual orientation, gender identity, age, marital status, veteran or disability status, or other characteristics protected by law. This policy applies to hiring, promotion, discharge, pay, fringe benefits, job training, classification, referral and other aspects of employment and also states that retaliation against a person who files a charge of discrimination, participates in a discrimination proceeding, or otherwise opposes an unlawful employment practice will not be tolerated. All information will be kept confidential according to EEO guidelines. COMPANY OVERVIEW: Celestica (NYSE, TSX: CLS) enables the world's best brands. Through our recognized customer-centric approach, we partner with leading companies in Aerospace and Defense, Communications, Enterprise, HealthTech, Industrial, Capital Equipment and Energy to deliver solutions for their most complex challenges. As a leader in design, manufacturing, hardware platform and supply chain solutions, Celestica brings global expertise and insight at every stage of product development – from drawing board to full-scale production and after-market services for products from advanced medical devices, to highly engineered aviation systems, to next-generation hardware platform solutions for the Cloud. Headquartered in Toronto, with talented teams spanning 40+ locations in 13 countries across the Americas, Europe and Asia, we imagine, develop and deliver a better future with our customers. Celestica would like to thank all applicants, however, only qualified applicants will be contacted. Celestica does not accept unsolicited resumes from recruitment agencies or fee based recruitment services. This location is a US ITAR facility and these positions will involve the release of export controlled goods either directly to employees or through the employee's movement within the facility. As such, Celestica will require necessary information from all applicants upon an applicant's acceptance of employment to determine if any export control exemptions or licenses must be filed.

Requirements

Must-haves

Staff Engineer, Hardware Design
Req ID: 131066
Region: Americas
Country: USA
State/Province: Texas
City: Austin
Complete ownership of thermal design for various electronic products from thermal modeling, design, test, and design revision, until transfer to manufacturing.
Conduct thermal simulations, postprocessing, and analysis ranging from chip to facilities level to verify thermal feasibility, risk, and to inform your designs.
Maintain awareness of heat transfer hardware available from all sources, including how it operates and performs, its cost, and how it can be incorporated into our products.
Conceive and implement ways to enhance and extend operation of heat transfer hardware.
Consider the thermal aspects of chip packaging technologies.
Apply best-in-class fluid flow geometry and technology to cool high heat flux chips.
Determine and consider the effects of contact resistance and the use of Thermal Interface Materials.
Apply air cooling when possible and liquid cooling when necessary to achieve full performance and reliability at the lowest cost.
Size liquid cold plates, heat sinks, heat pipes, air movers, air filters, air ducting, and perforated plates.
Plan your work to achieve full required performance, and stay on schedule to support overall product development.
Reference real world limitations to inform your work, such as manufacturing methods and cost, reliability, variability of incoming parts, and tolerances on all specifications.
Analyze test data to draw inferences about the equipment tested. Apply statistical methods as required to maximize utilization of data and test usefulness.
Work with multi-disciplinary groups to define system requirements and design products.
Work with cross-functional teams to identify root causes of system performance.
Typical Education
Master’s degree in Mechanical Engineering. Preference given to candidates with their Master’s concentration in heat transfer and fluid mechanics.
Educational Requirements may vary by Geography
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or status as a protected veteran.

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Keywords to mirror

aimachine learning

Platform: successfactors
Effort: medium

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