Job description

ADVANCE YOUR CAREER. ADVANCE THE WORLD. At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future. Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger — technology that moves the world forward. Join us and, together, we’ll advance your career. THE ROLE Join our team to drive customer success on the memory subsystem across our silicon portfolio, covering DDR and LPDDR across generations and the memory controller, Network-on-Chip and physical interface behind them. You will be a technical point of contact for escalated memory cases, from early design-in and bring-up through production support. You are the person strategic customers escalate to when memory does not behave the way the specification says it should. You will root-cause those failures on real systems, drive the fix through the teams that own it, and review next-generation memory architecture and design to catch defects before they reach silicon. You will also own the memory documentation customers design against. The scope runs from JEDEC device behavior and PCB routing, through controller architecture and RAS features, to the product and roadmap decisions your findings should drive. THE PERSON You have a passion for memory technology, system architecture, and hardware debug at the level where silicon, firmware, board and DRAM device all interact. You are a thorough memory expert who knows what the specification says, what the silicon actually does, and where the two diverge. You are a team player with excellent written and verbal communication skills and experience collaborating with engineers located in different sites and timezones, and you can hold a technical conversation directly with a customer. You are effective across organizations you do not manage, and you are drawn to problems that arrive without a clear owner or a clear root cause. We place a high value on technical writing. You produce documentation a customer can design against with confidence, and you can present a complex technical finding clearly to both engineering and customer audiences. KEY RESPONSIBILITIES Customer Support and Debug: Own escalated customer support issues for memory, from early design-in and bring-up through production support. Partner with key customers to root-cause system memory failures such as intermittent errors, calibration and training failures, and margin and boot issues. Attribute each correctly across DRAM, board, controller IP, calibration firmware and silicon, and drive the fix to closure. Memory Subsystem and Interconnect Expertise: Be the authority on DDR and LPDDR, covering JEDEC standards, device behavior, module topologies, ranks, widths and supported data rates. Know how traffic reaches the controller across the Network-on-Chip, including QoS, arbitration, and bandwidth and latency budgeting. Customer Documentation and Communication: Author the customer-facing memory documentation, including product guides, user guides, datasheets, answer records, tutorials and layout guidance, and publish resolutions internally and externally. Architecture Review and RAS Validation: Review memory and NoC architecture and design specifications for next-generation silicon, identifying gaps, inconsistencies and design bugs, and proposing fixes. Evaluate and validate its memory RAS features. Signal and Power Integrity: Perform DRAM SI/PI and timing measurements. Apply PCB layout and routing knowledge for DDR and LPDDR to assess customer designs and define the layout guidance we publish. Support IBIS/IBIS-AMI models and channel simulation. Memory Health Tooling and Experiments: Create experiments and tooling that catch memory health issues before they are reported. Write targeted memory tests in C to stress and characterize specific failure modes on real hardware. Product Influence and Cross-Functional Leadership: Translate system-level challenges into product and roadmap decisions on supported configurations, data rates, feature scope and documentation accuracy. Drive teams across IP, firmware, tools, signal integrity, validation and quality without direct authority, for feature enablement, optimization and characterization. Apply AI to Engineering Workflows: Use AI/LLM/ML tools to surface design gaps, summarize and correlate large test and log datasets, and drive productivity in debug, automation and documentation. PREFERRED EXPERIENCE • Extensive hands-on experience with memory subsystems in an applications, architecture, design, or validation role, built across multiple DRAM generations and product cycles. • Expertise across DDR and LPDDR generations (DDR4/DDR5, LPDDR4/4X/5/5X/6), with fluency in the relevant JEDEC specifications and in module variants (UDIMM, SODIMM, RDIMM, LRDIMM, CUDIMM). HBM experience is a plus. • Excellent technical writing, with a track record of authoring and publishing customer-facing documentation that an external audience designs against: product guides, user guides, datasheets, answer records and tutorials. • Deep knowledge of DRAM, memory controller and PHY architecture: command scheduling and arbitration, address mapping and decode, calibration and training, DQS gating and delay-line behavior, termination and drive strength, voltage and temperature tracking, and page policy, with experience evaluating and validating RAS features. • Working knowledge of on-chip interconnect architecture, including Network-on-Chip, and of bandwidth and latency budgeting. • Proven root cause of system-level memory failures, attributing each correctly across the DRAM device, board, controller IP, firmware, tools and silicon, including reading calibration and training firmware closely enough to trace a failure to the step that produced it. Hands-on lab debug with oscilloscopes, signal generators, BERTs, logic and protocol analyzers, and register-level debug over JTAG. • Hands-on DRAM SI/PI and timing analysis (measurement on real hardware, eye and margin analysis, and channel simulation with IBIS and IBIS-AMI models) together with a practical understanding of PCB layout and routing for DDR/LPDDR. Platform-level signal and power integrity is a plus. • Experience working directly with strategic customers in technical or architecture-facing roles, translating system-level challenges into product or roadmap decisions, and influencing multi-functional teams without direct authority, with a track record of mentoring and running technical reviews. • Demonstrated use of AI in engineering workflows , applying AI/LLM/ML tools to identify design gaps, summarize collected data for distribution and analysis, and drive productivity in debug, automation and documentation. • Strong C for writing targeted memory test applications, and able to read architecture specifications, design documentation and SystemVerilog/Verilog RTL closely enough to identify implementation bugs. This role is not eligible for visa sponsorship. #LI-RL1 Benefits offered are described: AMD benefits at a glance . AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.

Requirements

Must-haves

ADVANCE YOUR CAREER. ADVANCE THE WORLD.
Apply AI to Engineering Workflows: Use AI/LLM/ML tools to surface design gaps, summarize and correlate large test and log datasets, and drive productivity in debug, automation and documentation.
Benefits offered are described: AMD benefits at a glance .
AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.
This posting is for an existing vacancy.

Nice-to-haves

Extensive hands-on experience with memory subsystems in an applications, architecture, design, or validation role, built across multiple DRAM generations and product cycles.
Expertise across DDR and LPDDR generations (DDR4/DDR5, LPDDR4/4X/5/5X/6), with fluency in the relevant JEDEC specifications and in module variants (UDIMM, SODIMM, RDIMM, LRDIMM, CUDIMM). HBM experience is a plus.
Excellent technical writing, with a track record of authoring and publishing customer-facing documentation that an external audience designs against: product guides, user guides, datasheets, answer records and tutorials.
Working knowledge of on-chip interconnect architecture, including Network-on-Chip, and of bandwidth and latency budgeting.
Demonstrated use of AI in engineering workflows , applying AI/LLM/ML tools to identify design gaps, summarize collected data for distribution and analysis, and drive productivity in debug, automation and documentation.
Strong C for writing targeted memory test applications, and able to read architecture specifications, design documentation and SystemVerilog/Verilog RTL closely enough to identify implementation bugs.

Application prep

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Platform: amd
Effort: medium