Job description

As a Package design engineer, you will lead advanced package architecture, drive next-generation package structure and configuration optimization, and own Package/SiP/module physical design from concept through tape-out. You will collaborate closely with cross-functional teams to deliver optimized SI/PI performance across a wide range of silicon technologies You are expected to leverage AI tools to enhance design efficiency, quality and performance. Bachelors degree required. Package Design Proficiency: Proven experience in IC package physical design using Cadence Allegro or Mentor Xpedition platforms, with knowledge of diverse package types (SiP, PoP, wirebond) and verification tools (Calibre, CAM350). High-Speed & SI/PI Expertise: Strong understanding of high-speed interface layout constraints (DDR, PCIe) and Signal/Power Integrity (SI/PI) analysis, including experience with simulation tools like HFSS or PowerSI and parasitic extraction (RLGC, S-parameters). Manufacturing & Materials Knowledge: Solid grasp of substrate manufacturing processes, design rules (DRC), design for manufacturability (DFM), and various sophisticated package configurations and assembly technology Automation & Scripting Skills: Familiarity with a Unix/Linux environment and proficiency in scripting languages such as Python, Perl, or TCL to automate design tasks and improve workflows.

Requirements

Must-haves

Bachelors degree required.
Manufacturing & Materials Knowledge: Solid grasp of substrate manufacturing processes, design rules (DRC), design for manufacturability (DFM), and various sophisticated package configurations and assembly technology
Automation & Scripting Skills: Familiarity with a Unix/Linux environment and proficiency in scripting languages such as Python, Perl, or TCL to automate design tasks and improve workflows.

Nice-to-haves

None flagged.

Application prep

Use the role’s language and application details while tailoring your materials.

Keywords to mirror

aipython

Platform: apple
Effort: medium