Capital Equipment Hardware engineer - Advanced Packaging
Amat· startup· Semiconductor equipment· Sep 8, 2026 · 2mo ago
Santa Clara,CA
Hybrid
Full-time
Senior
$124K–$171K
3+ years exp
Job description
Who We Are
Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology.
What We Offer
Salary:
$124,000.00 - $171,000.00
Location:
Santa Clara,CA
You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.
At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits .
Position Summary Applied Materials is seeking a Global Product Support (GPS) Engineer( Capital Equipment Hardware engineer ) to support installation, startup, qualification, and ongoing operation of the Kinex™ Hybrid Bonding platform being deployed for the CTO advanced packaging development programs.
The successful candidate will serve as the primary equipment support engineer responsible for bringing the system from installation through process readiness while coordinating closely with Facilities, BESI, Applied Materials product engineering teams, and CTO process development teams.
This role combines hands-on equipment support, system integration, startup execution, facilities coordination, and vendor engagement. The engineer will play a key role in establishing Kinex as a strategic advanced packaging platform supporting die-to-wafer hybrid bonding, optical interconnect, and next-generation heterogeneous integration development.
Key Responsibilities Installation & Startup Support Kinex installation activities from tool dock through release to engineering users
Coordinate Tier 0, Tier 1 and Tier 2 startup activities
Drive closure of installation punch-list items
Support factory acceptance and site acceptance activities with vendors
Develop recovery plans for installation and startup issues
Facilities Integration Support Facility Data Sheet (FDS) development and updates
Coordinate with Facilities, EHS and infrastructure teams
Define and validate tool utility requirements
Support hookup and qualification activities
Equipment Support Perform troubleshooting of mechanical, electrical, automation, and process-related issues
Develop preventative maintenance procedures
Support uptime improvement efforts
Analyze equipment performance and reliability trends
Drive root cause investigations and corrective actions
Vendor & Product Engineering Engagement Act as primary technical interface with BESI and Kinex product engineering teams
Coordinate technical reviews, service activities, upgrades, and modifications
Manage escalation of hardware and software issues
Support implementation of engineering changes and new capabilities
Advanced Packaging Development Support Support hybrid bonding process development activities
Work closely with CTO process engineers and researchers
Enable wafer-to-wafer and die-to-wafer bonding development
Support new module integration and experimental hardware evaluations
Minimum Qualifications BS in Mechanical Engineering, Electrical Engineering, Mechatronics, Systems Engineering or related engineering discipline
3–7 years of engineering experience in semiconductor equipment – new college graduates applications will NOT be considered
Experience supporting semiconductor manufacturing or development equipment
Strong troubleshooting and root-cause analysis skills
Excellent verbal and written communication skills
Ability to work across facilities, vendors, process engineering, and operations teams
Preferred Qualifications Highly Desired Experience with advanced packaging equipment
Experience with hybrid bonding, wafer bonding, die attach, packaging, or assembly systems
Experience with wet clean processes and systems
Equipment installation and startup experience
Facilities hookup and utility integration experience
Vendor management and supplier coordination experience
Hands-on experience troubleshooting complex semiconductor equipment
Preferred Knowledge of: Automated material handling systems
Vacuum systems
Plasma processing systems
Wet processing equipment
Metrology systems
Experience generating or reviewing: Site prep / installation documentation
Equipment specifications
Startup plans
Qualification procedures
Bonus Qualifications Prior experience with BESI equipment
Hybrid bonding process knowledge
300 mm equipment experience
Project management experience
Cleanroom construction or tool installation experience
Additional Information
Time Type:
Full time
Employee Type:
Assignee / Regular
Travel:
Yes, 10% of the Time
Relocation Eligible:
Yes
The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.
For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.
Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.
In addition, Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.
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