Job description

The Amazon Web Services (AWS) Center for Quantum Computing in Pasadena, CA, is looking to hire a Hardware Development Engineer with experience in semiconductor process development – and in particular dicing, electrical probing, wirebonding, and flip chip bonding – who will aid in AWS’s effort to bring cloud quantum computing services to its worldwide customer base. Through your work inside and outside of the cleanroom environment in the device fabrication group, you will solve problems related to the fabrication and characterization of novel quantum processors. Key job responsibilities - Lead the sustainment and development of die singulation, die preparation, and device probing. - May need to support wirebonding, and flip chip bonding - Operate and maintain associated equipment to ensure optimal process outcomes and provide rapid, expert troubleshooting of process and equipment issues to minimize downtime and maintain production goals. - Design, build, and maintain backend process infrastructure to enhance efficiency, organization, and scalability. Implement standardized work practices and optimize workflows for streamlined operations. - Analyze process data to identify trends, improve stability, and drive continuous yield improvement. A day in the life The schedule is late afternoon through late night for this role, 4pm-1am for example. The initial training will be performed in the day time. Once the training is finished, the candidate is expected to work independently in the assigned hours. The candidate will spend most of the time in a cleanroom environment, in a protective suit performing hands-on packaging tasks using IC packaging equipment. The candidate will carry out packaging steps for quantum computing product chips, as well as for development projects. Diverse Experiences Amazon values diverse experiences. Even if you do not meet all of the preferred qualifications and skills listed in the job description, we encourage candidates to apply. If your career is just starting, hasn’t followed a traditional path, or includes alternative experiences, don’t let it stop you from applying. Work/Life Balance We value work-life harmony. Achieving success at work should never come at the expense of sacrifices at home, which is why we strive for flexibility as part of our working culture. When we feel supported in the workplace and at home, there’s nothing we can’t achieve in the cloud. Inclusive Team Culture Here at AWS, it’s in our nature to learn and be curious. Our employee-led affinity groups foster a culture of inclusion that empower us to be proud of our differences. Ongoing events and learning experiences, including our Conversations on Race and Ethnicity (CORE) and AmazeCon (gender diversity) conferences, inspire us to never stop embracing our uniqueness. Mentorship and Career Growth We’re continuously raising our performance bar as we strive to become Earth’s Best Employer. That’s why you’ll find endless knowledge-sharing, mentorship and other career-advancing resources here to help you develop into a better-rounded professional. Export Control Requirement Due to applicable export control laws and regulations, candidates must be either a U.S. citizen or national, U.S. permanent resident (i.e., current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum, or be able to obtain a US export license. If you are unsure if you meet these requirements, please apply and Amazon will review your application for eligibility. About the team The AWS Center for Quantum Computing recognizes that developing quantum computing is a long-term endeavor, not a quick process. The team is dedicated to tackling the significant challenges involved in building a functional quantum computer. We are approaching this ambitious goal with enthusiasm and determination. The fabrication/packaging team within AWS Center for Quantum computing is responsible for delivering quantum computing product chips. - 2+ years of technical support experience - 2 years of direct microfabrication experience - 2 years experience with hands-on wafer level and die level handling, die cleaning, and optical inspection equipment - Excellent communication and writing skills - 2 years experience with one or more of the following: Saw Dicing, Electrical test (Probing), Wirebonding, Flip Chip Bonding - 2 years working in microfabrication in a research and development setting - Experience with developing new process and failure analysis activities - Experience with data analysis and visualization tools - Experience with inventory management and using a MES system Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status. Los Angeles County applicants: Job duties for this position include: work safely and cooperatively with other employees, supervisors, and staff; adhere to standards of excellence despite stressful conditions; communicate effectively and respectfully with employees, supervisors, and staff to ensure exceptional customer service; and follow all federal, state, and local laws and Company policies. Criminal history may have a direct, adverse, and negative relationship with some of the material job duties of this position. These include the duties and responsibilities listed above, as well as the abilities to adhere to company policies, exercise sound judgment, effectively manage stress and work safely and respectfully with others, exhibit trustworthiness and professionalism, and safeguard business operations and the Company’s reputation. Pursuant to the Los Angeles County Fair Chance Ordinance, we will consider for employment qualified applicants with arrest and conviction records. Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit amazon.jobs for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner. The base salary range for this position is listed below. Your Amazon package will include sign-on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience, qualifications, and location. Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave. Learn more about our benefits at amazon.jobs . USA, CA, Pasadena - 74,700.00 - 130,700.00 USD annually

Requirements

Must-haves

Key job responsibilities
Lead the sustainment and development of die singulation, die preparation, and device probing.
May need to support wirebonding, and flip chip bonding
Operate and maintain associated equipment to ensure optimal process outcomes and provide rapid, expert troubleshooting of process and equipment issues to minimize downtime and maintain production goals.
Design, build, and maintain backend process infrastructure to enhance efficiency, organization, and scalability. Implement standardized work practices and optimize workflows for streamlined operations.
Analyze process data to identify trends, improve stability, and drive continuous yield improvement.
A day in the life
Diverse Experiences
Work/Life Balance
Inclusive Team Culture
Mentorship and Career Growth
About the team
The fabrication/packaging team within AWS Center for Quantum computing is responsible for delivering quantum computing product chips.
2+ years of technical support experience
2 years of direct microfabrication experience
2 years experience with hands-on wafer level and die level handling, die cleaning, and optical inspection equipment
Excellent communication and writing skills
2 years experience with one or more of the following: Saw Dicing, Electrical test (Probing), Wirebonding, Flip Chip Bonding
2 years working in microfabrication in a research and development setting
Experience with developing new process and failure analysis activities
Experience with data analysis and visualization tools
Experience with inventory management and using a MES system
Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.
USA, CA, Pasadena - 74,700.00 - 130,700.00 USD annually

Nice-to-haves

None flagged.

Application prep

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Keywords to mirror

aws

Platform: amazon
Effort: medium

Benefits

Benefits detected in the listing.

Health Insurance

Dental

Vision

401(K)

Paid Time Off

Parental Leave