Job description

The Integration Engineering Manager focused on BCD and Image Sensor Technologies will lead a team responsible for process and device integration across established and emerging BCD and image sensor technology platforms. This role is accountable for technology health, manufacturing performance, yield improvement, process capability, and resolution of complex integration issues across the process flow. The manager will work closely with Device Engineering, Process Engineering, Yield Engineering, Manufacturing, Quality, Reliability, Product Engineering, and Technology Development to maintain robust technology performance while driving continuous improvement in yield, quality, cost, and manufacturability. • Lead integration activities for BCD and image sensor technology platforms, providing technical direction and organizational leadership. • Own overall technology health, including yield, process capability, device performance, defectivity, reliability risk, and manufacturing stability. • Drive systematic resolution of complex process integration and device-performance issues using electrical, physical, and statistical data. • Establish relationships between process parameters, device characteristics, electrical test results, yield, and reliability performance. • Lead cross-functional investigations involving inline data, defect inspection, electrical characterization, wafer probe, physical analysis, and reliability results. • Execute yield, cost, cycle-time, and process-capability improvement opportunities. • Partner with Process Engineering and Manufacturing to establish robust process controls and reduce manufacturing variability. • Provide technical leadership during excursions, containment activities, root-cause investigations, and corrective actions. • Ensure technology changes are technically sound and appropriately evaluated for device, yield, quality, and reliability impact. • Develop Integration engineers through coaching, technical mentoring, structured problem solving, and expanded technology ownership. • Establish clear priorities and accountability across the Integration team. • Communicate technology health, risks, priorities, and recovery plans to engineering and manufacturing leadership. • BS or advanced degree in Electrical Engineering, Chemical Engineering, Materials Science, Physics, or a related technical field. • Strong semiconductor process integration and/or device engineering background. • Experience with BCD, CMOS, image sensor, analog/mixed-signal, or similar semiconductor technologies. • Demonstrated understanding of semiconductor fabrication processes and their relationship to device and electrical performance. • Experience solving complex manufacturing, yield, device, or reliability problems using data-driven methods. • Demonstrated ability to lead cross-functional technical teams. • Strong communication skills with the ability to translate detailed technical issues into clear business and manufacturing impacts. • Previous technical leadership or engineering management experience preferred. Salary: onsemi is excited to share the base salary range for this position is $127,800 to $217,200 exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of the internal equity of our current team members. We also offer a competitive benefits package. onsemi.com

Requirements

Must-haves

Lead integration activities for BCD and image sensor technology platforms, providing technical direction and organizational leadership.
Own overall technology health, including yield, process capability, device performance, defectivity, reliability risk, and manufacturing stability.
Drive systematic resolution of complex process integration and device-performance issues using electrical, physical, and statistical data.
Establish relationships between process parameters, device characteristics, electrical test results, yield, and reliability performance.
Lead cross-functional investigations involving inline data, defect inspection, electrical characterization, wafer probe, physical analysis, and reliability results.
Execute yield, cost, cycle-time, and process-capability improvement opportunities.
Partner with Process Engineering and Manufacturing to establish robust process controls and reduce manufacturing variability.
Provide technical leadership during excursions, containment activities, root-cause investigations, and corrective actions.
Ensure technology changes are technically sound and appropriately evaluated for device, yield, quality, and reliability impact.
Develop Integration engineers through coaching, technical mentoring, structured problem solving, and expanded technology ownership.
Establish clear priorities and accountability across the Integration team.
Communicate technology health, risks, priorities, and recovery plans to engineering and manufacturing leadership.
BS or advanced degree in Electrical Engineering, Chemical Engineering, Materials Science, Physics, or a related technical field.
Strong semiconductor process integration and/or device engineering background.
Experience with BCD, CMOS, image sensor, analog/mixed-signal, or similar semiconductor technologies.
Demonstrated understanding of semiconductor fabrication processes and their relationship to device and electrical performance.
Experience solving complex manufacturing, yield, device, or reliability problems using data-driven methods.
Demonstrated ability to lead cross-functional technical teams.
Strong communication skills with the ability to translate detailed technical issues into clear business and manufacturing impacts.

Nice-to-haves

Previous technical leadership or engineering management experience preferred.

Application prep

Use the role’s language and application details while tailoring your materials.

Platform: oracle-cloud
Effort: medium