Manufacturing Operations Manager Day Shift - Advanced Packaging
Intel· Semiconductors· Oct 22, 2026 · 6d ago
US, Arizona, Phoenix
In office
Full-time
Manager
$89K–$171K
3+ years exp
Job description
Job Details:
Job Description: At Intel, we create world-changing technology that improves the life of every person on the planet. By joining the Substrate Packaging Technology Development (SPTD) organization within our Advanced Packaging Team, you will support our mission to be the supplier of choice for leading-edge, affordable advanced substrate packaging solutions. This is your opportunity to lead a high-performing team that values technical excellence, continuous learning, and a collaborative, supportive work environment.
We are seeking a Manufacturing Operations Manager Day Shift - Advanced Packaging to join our advanced packaging operations in Chandler, Arizona. In this role, you will lead and develop a team of highly skilled technicians responsible for equipment maintenance, troubleshooting, tool recovery, and daily factory execution. Working hands-on in our dynamic manufacturing facility, you will maintain a visible shift presence to strengthen team performance, optimize equipment stability, and directly support the strategic goals that enable Intel s continued packaging leadership.
Shift Information:
Shift 7 Shift Hours: 6:00 AM – 6:00 PM
Schedule: (days backend) AM-PM Thurs-Sat and alternating Wednesday days
Key Responsibilities:
Shift Team Leadership: Lead, schedule, and develop a shift team of technical equipment technicians, managing daily workstation assignments, rotations, and performance standards.
Maintenance & Resource Planning: Build and execute detailed resource plans for corrective and preventive maintenance activities to maximize equipment uptime and stability.
Continuous Improvement Leadership: Own shift performance metrics (safety, quality, cost, and output) by driving continuous improvement initiatives using structured Lean, Six Sigma, or Model-Based Problem Solving (MBPS) methodologies.
Training Program Execution: Establish, evaluate, and execute technical training plans to systematically upgrade technician skills aligned with manufacturing roadmap requirements.
Cross-Functional Engineering Collaboration: Partner directly with Module Engineering groups to resolve systemic hardware faults, execute tooling improvements, and stabilize manufacturing processes.
Operational Policy & Safety Enforcement: Enforce strict compliance with Intel safety guidelines, factory protocols, and operational policies on shift.
As a Successful Candidate, You Will Bring:
Dynamic Leadership & People Development: Natural talent for building, coaching, and motivating high-performing technical teams in a fast-paced environment.
Structured Problem Solving: Passion for utilizing logical, data-driven methodologies to dissect complex manufacturing bottlenecks and equipment failures.
Exceptional Communication: Clear, direct, and diplomatic verbal and written communication style to align priorities across shift handoffs and engineering teams.
Strategic Executive Presence: Comfort managing critical, high-urgency factory excursions while maintaining structural standards and promoting corporate values.
Apply today to join Intel Arizona s Substrate Packaging Technology Development team. Take command of cutting-edge shift operations, develop the next generation of technical talent, and build a rewarding career at the forefront of semiconductor innovation.
Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research and relevant previous job and/or internship experience. This Position is not eligible for Intel immigration sponsorship.
Minimum Qualifications:
A bachelor’s degree in a STEM field (Engineering preferred) with 3 years of experience in a high-volume manufacturing or military technical environment or relevant experience.
OR a master s degree in a STEM field with 2 years of experience in a high-volume manufacturing or military technical environment or relevant experience.
Relevant experience can be any of the following: Troubleshooting or supervising the repair of complex electromechanical, hydraulic, or pneumatic manufacturing equipment.
Managing, writing, or executing technical training plans for industrial technician teams.
Applying Lean Manufacturing and/or Six Sigma, and/or Model-Based Problem Solving (MBPS) to drive yield or tool stability improvements.
Preferred Qualifications:
2 years of experience: Substrate, high-density interconnect, assembly, packaging, or silicon process manufacturing.
Leading or supporting high-volume factory ramps or hardware qualifications.
Direct experience managing people, schedules, and shift logs in a manufacturing or technical environment.
Verifiable training in factory operations systems or factory physics.
Job Type: Experienced Hire
Shift: Shift 7 (United States of America)
Primary Location: US, Arizona, Phoenix
Additional Locations:
Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .
Annual Salary Range for jobs which could be performed in the US: $89,010.00-170,630.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
Application prep
Use the role’s language and application details while tailoring your materials.
- Platform
- workday
- Effort
- long