Optoelectronic IC Package Design Director
Ciena· Telecommunications· Aug 5, 2026 · 3mo agoPosted 83 days ago
New Providence - NJ
In office
Full-time
Director
$236K–$376K
10+ years exp
Before you apply
Ghost Signal:
Open 83 days.
Job description
As the global leader in high-speed connectivity, Ciena is committed to a people-first approach. Our teams enjoy a culture focused on prioritizing a flexible work environment that empowers individual growth, well-being, and belonging. We’re a technology company that leads with our humanity—driving our business priorities alongside meaningful social, community, and societal impact.
As Optoelectronic IC Package Design Director, you will be an integral part of the xPO engineering team and lead package development for custom in-house photonic, analog, and digital ICs, supporting next generation optical modules.
How You Will Make an Impact:
Own and drive advanced package selection, new product BGA configuration, and package structure
Own and manage package development schedules
Responsible for package layout, SI/PI optimization, design verification and tapeout
Interface and coordinate with cross-functional groups on new product package selection, feasibility analysis and design
Work cross-functionally, understand trade-offs, constraints, and optimize silicon floor plan, bump and package pin out
Simulate and optimize signal and power integrity and RF performance of the package design
Interface and work with CMs and vendors for sourcing existing designs and future product development
The Must Haves:
BS in Electrical Engineering or Physics (master’s or Ph. D degree is a plus)
10 years hands on experience with IC package design experience
The Nice to Haves:
Substrate design experience for RF, digital, high speed and mixed signal designs
Thorough understanding of signal and power integrity fundamentals
Experience with Advanced Package Designer (APD) SIP and/or Xpedition Package Designer (XPD) tools (Cadence highly preferred)
Fluent in SI/PI and EM simulation tools such as SIWave and HFSS
Experience in package design electrical review, SI/PI analysis
Experience in package design for manufacturing reviews
Experience in thermal and mechanical design is a plus
Familiar with package substrate technologies including 2.5-D IC and 3-D IC interposers
Problem solver with strong engineering fundamentals
Pay Range: The annual salary range for this position is $235,600 - $376,400.
Pay ranges at Ciena are designed to accommodate variations in knowledge, skills, experience, market conditions, and locations, reflecting our diverse products, industries, and lines of business. Please note that the pay range information provided in this posting pertains specifically to the primary location, which is the top location listed in case multiple locations are available.
Non-Sales employees may be eligible for a discretionary incentive bonus, while Sales employees may be eligible for a sales commission. In addition to competitive compensation, Ciena offers a comprehensive benefits package, including medical, dental, and vision plans, participation in 401(K) (USA) & DCPP (Canada) with company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company-paid holidays, paid sick leave, and vacation time. We also comply with all applicable laws regarding Paid Family Leave and other leaves of absence.
At Ciena, we are committed to building and fostering an environment in which our employees feel respected, valued, and heard. Ciena values the diversity of its workforce and respects its employees as individuals. We do not tolerate any form of discrimination.
Ciena is an Equal Opportunity Employer, including disability and protected veteran status.
If contacted in relation to a job opportunity, please advise Ciena of any accommodation measures you may require.
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