Company:
Qualcomm Technologies, Inc.
Job Area:
Engineering Group, Engineering Group > Packaging Engineering
General Summary:
This position is a senior leadership position responsible for leading the RF Package Design. The main role of this position is to focus on Electrical Characterization of RF Packages working with RF design leads. The RF-IC Package and system in package are for products to be used in 6G Infrastructure and 6G consumer devices including mobile phones.
This position requires defining the packaging roadmap and project the resource needs and/or gaps to execute the roadmap. This position will oversee both design and advancing RF packaging roadmaps and develop/extend the company's technical capabilities. A successful candidate will have a thorough understanding of RF package design and a good understanding of RF circuit design. In addition, the individual should have the ability to formulate plans based on ambiguous project definitions to move the projects forward. As part of a cross-functional development team, the candidate will interact with other essential disciplines, including RF-IC, PCB, RF-EM, System and Process Technology Development teams.
In addition to the technical role, the candidate is expected to manage, train, hire and mentor junior engineers. Principal engineers are expected to work across multiple geographies.
The responsibilities will include but not be limited to the following:
• Working with Package designer & various RF-IC block owners (Tx, Rx, LO, PLL, ADC/DAC, etc.) to discuss bump/ball assignments, perform early analysis and discuss trade-offs to optimize the design.
• Establish BKM how to extract 3D parasitic models for various RF packages in ANSYS Electronic Desk Suite (HFSS/3D Layout/Q3D/SIWave).
• Guide team how to troubleshoot various RF problems (DC convergence, leakage, and isolation) efficiently in testbench
• Further define methodologies for RF simulations for various Package type, frequency band and IP requirements.
• Work with Advanced Technology team to develop more robust future RF PKG technology
• Update the design & analysis flow and automate the process
• Create technical documentation and presentations
• Recruit and lead team of engineers. Provide technical mentoring to junior team members
Minimum Qualifications:
• Master's degree in Science, Engineering, or related field
• 10+ years of RF Package/PCB design experience
• Solid understanding and experience in Electromagnetics, Transmission line theory & Crosstalk
• Proficiency in field solvers such as Ansys HFSS, Q3D and PSI
• Proficiency in simulation tools such as ADS and Hspice
• Good knowledge in design tool such as Cadence Allegro/APD/Sip or Mentor Xpedition
Preferred Qualifications:
• Ability to optimize RF design & analysis flow and being able to automate it
• Thorough understanding of Packaging technologies and industry landscape in RF Packaging
• Familiarity with Analog & RF-IC design
• Proficiency in MatLab
• Experience in programming language(c/c++) or scripting language (Perl/Python) is a plus
• People Management experience is a plus
• Ph.D. with 10+ years of experience or Master’s Degree with 15+ years of experiences
Minimum Qualifications:
• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 6+ years of System/Package Design/Technology Engineering or related work experience.
OR
Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 5+ years of System/Package Design/Technology Engineering or related work experience.
OR
PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ year of System/Package Design/Technology Engineering or related work experience.
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Pay range and Other Compensation & Benefits :
$191,800.00 - $287,800.00
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link .
If you would like more information about this role, please contact Qualcomm Careers .