Job description

Company: Qualcomm Technologies, Inc. Job Area: Engineering Group, Engineering Group > Packaging Engineering General Summary: Qualcomm Data Center team is developing a high performance, energy efficient server solution for data center applications. The qualified individual will develop thermal solutions for server products at package and system levels resolving complex thermal management challenges related to high-performance servers. Key Responsibilities • Lead thermal architecture solutions through simulation and test while working with various stakeholders. • Perform thermal simulations utilizing CFD tools from silicon die to ambient throughout product development phase. • Drive direction and strategy discussions, work cross-functionally with technical leads on tradeoffs, conduct thermal design reviews and presentations. • Develop custom SW solutions to automate thermal modeling and test. • Conduct thermal tests to validate/characterize models and present results to stakeholders. • Analyze and document simulation and test results. Education • Required: MS in Mechanical Engineering • Preferred: PhD in Mechanical Engineering Requirements : • 10+ years of industry experience in electronics cooling related to server products. • Deep understanding of thermal management design elements including TIM, spreaders, heat sink, vapor chamber, heat pipe, and fan. • Industry exposure to 2.5/3D packaging is highly desirable. • Ability to write scripts in programming languages (i.e. Python, C/C++, MATLAB, etc.) for data analysis and tool development. • Expertise in conducting CFD simulations and proficiency in SW tools such as ANSYS-Icepak and Celsius EC. • Capability to design, execute thermal tests within a laboratory environment, and hands on experience with airflow and temperature measurements equipment. • Some experience with 3D geometry CAD tools such as Solidworks or Creo is desirable. • Excellent presentation, negotiation, and communication skills. • Ability to clearly communicate complex technical content in written and verbal formats. • Some experience with AI/ML concepts, algorithms, and methodologies is a plus." Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here . Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). To all Staffing and Recruiting Agencies : Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications. EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification. Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. Pay range and Other Compensation & Benefits : $191,800.00 - $287,800.00 The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link . If you would like more information about this role, please contact Qualcomm Careers .

Requirements

Must-haves

Qualcomm Technologies, Inc.
Engineering Group, Engineering Group > Packaging Engineering
Qualcomm Data Center team is developing a high performance, energy efficient server solution for data center applications.
The qualified individual will develop thermal solutions for server products at package and system levels resolving complex thermal management challenges related to high-performance servers.
Lead thermal architecture solutions through simulation and test while working with various stakeholders.
Perform thermal simulations utilizing CFD tools from silicon die to ambient throughout product development phase.
Drive direction and strategy discussions, work cross-functionally with technical leads on tradeoffs, conduct thermal design reviews and presentations.
Develop custom SW solutions to automate thermal modeling and test.
Conduct thermal tests to validate/characterize models and present results to stakeholders.
Analyze and document simulation and test results.
Required: MS in Mechanical Engineering
10+ years of industry experience in electronics cooling related to server products.
Deep understanding of thermal management design elements including TIM, spreaders, heat sink, vapor chamber, heat pipe, and fan.
Industry exposure to 2.5/3D packaging is highly desirable.
Ability to write scripts in programming languages (i.e. Python, C/C++, MATLAB, etc.) for data analysis and tool development.
Expertise in conducting CFD simulations and proficiency in SW tools such as ANSYS-Icepak and Celsius EC.
Capability to design, execute thermal tests within a laboratory environment, and hands on experience with airflow and temperature measurements equipment.
Some experience with 3D geometry CAD tools such as Solidworks or Creo is desirable.
Excellent presentation, negotiation, and communication skills.
Ability to clearly communicate complex technical content in written and verbal formats.
$191,800.00 - $287,800.00
If you would like more information about this role, please contact Qualcomm Careers .

Nice-to-haves

Preferred: PhD in Mechanical Engineering
Some experience with AI/ML concepts, algorithms, and methodologies is a plus."

Application prep

Use the role’s language and application details while tailoring your materials.

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