Job description

SAIC is seeking a talented and motivated Advanced Packaging Engineer to support cutting-edge missile system hardware design and analysis efforts. In this role, you will collaborate with multidisciplinary engineering teams to develop, analyze, and validate advanced microelectronics packaging solutions for complex defense systems. This position offers a hybrid work schedule; however, candidates must reside within commuting distance of Crane, IN. JOB RESPONSIBILITES: • Support mechanical design and analysis of missile system hardware and microelectronics packaging and assembly • Perform mechanical modeling and simulation activities, including finite element analysis (FEA), thermal fatigue, shock and vibration analysis, and MATLAB-based modeling • Apply systems engineering principles throughout all stages of the product lifecycle, including requirement development, verification, and validation • Participate in and support Systems Engineering Technical Reviews, including System Requirements Reviews (SRR), Preliminary Design Reviews (PDR), Critical Design Reviews (CDR), and Production Readiness Reviews (PRR) • Collaborate with design teams to facilitate and document design development activities • Support Technical Interchange Meetings (TIMs) and contribute to cross-functional team discussions • Analyze solder interconnect technologies, including Ball Grid Array (BGA), Column Grid Array (CGA), Flip-Chip, and J-lead packages • Conduct experimental test and evaluation activities, including solder fatigue analysis and material property evaluations • Clearly communicate technical findings, analyses, and recommendations to a wide range of audiences, including both technical and non-technical stakeholders REQUIRED EDUCATION AND EXPERIENCE: • Bachelor’s degree in mechanical or aerospace engineering • 5+ years’ experience with mechanical modeling and simulation (e.g., FEA/ANSYS, MATLAB, vibration, shock, thermal fatigue) • Experience with or knowledge of systems engineering principles • Interim secret clearance is required to start with the ability to obtain a secret clearance. SAIC will sponsor the clearance process • Must be a US citizen PREFERRED EXPERIENCE: • Experience with missile system hardware design and analysis • Familiarity with microelectronics packaging and assembly, including solder interconnect technologies

Requirements

Must-haves

Support mechanical design and analysis of missile system hardware and microelectronics packaging and assembly
Perform mechanical modeling and simulation activities, including finite element analysis (FEA), thermal fatigue, shock and vibration analysis, and MATLAB-based modeling
Apply systems engineering principles throughout all stages of the product lifecycle, including requirement development, verification, and validation
Participate in and support Systems Engineering Technical Reviews, including System Requirements Reviews (SRR), Preliminary Design Reviews (PDR), Critical Design Reviews (CDR), and Production Readiness Reviews (PRR)
Collaborate with design teams to facilitate and document design development activities
Support Technical Interchange Meetings (TIMs) and contribute to cross-functional team discussions
Analyze solder interconnect technologies, including Ball Grid Array (BGA), Column Grid Array (CGA), Flip-Chip, and J-lead packages
Conduct experimental test and evaluation activities, including solder fatigue analysis and material property evaluations
Clearly communicate technical findings, analyses, and recommendations to a wide range of audiences, including both technical and non-technical stakeholders
Bachelor’s degree in mechanical or aerospace engineering
5+ years’ experience with mechanical modeling and simulation (e.g., FEA/ANSYS, MATLAB, vibration, shock, thermal fatigue)
Experience with or knowledge of systems engineering principles
Interim secret clearance is required to start with the ability to obtain a secret clearance. SAIC will sponsor the clearance process
Must be a US citizen

Nice-to-haves

Experience with missile system hardware design and analysis
Familiarity with microelectronics packaging and assembly, including solder interconnect technologies

Application prep

Use the role’s language and application details while tailoring your materials.

Platform: oracle-cloud
Effort: medium