Job description

About the Company: At SK Hynix Memory Solution, we're at the forefront of semiconductor innovation, developing advanced memory solutions that power everything from smartphones to data centers. As a global leader in DRAM and NAND flash technologies, we drive the evolution of advancing mobile technology, empowering cloud computing, and pioneering future technologies. Our cutting-edge memory technologies are essential in today's most advanced electronic devices and IT infrastructure, enabling enhanced performance and user experiences across the digital landscape. We're looking for innovative minds to join our mission of shaping the future of technology. At SK Hynix Memory, you'll be part of a team that's pioneering breakthrough memory solutions while maintaining a strong commitment to sustainability. We're not just adapting to technological change – we're driving it, with significant investments in artificial intelligence, machine learning, and eco-friendly solutions and operational practices. As we continue to expand our market presence and push the boundaries of what's possible in semiconductor technology, we invite you to be part of our journey to creating the next generation of memory solutions that will define the future of computing. About the Team SK hynix memory solutions America Inc. (SKHMS America), a subsidiary of SK hynix NAND Product Solutions (D.B.A Solidigm), provides industry-leading controller hardware, advanced flash management systems, and firmware for NAND and post 2D-NAND based storage solutions spanning Enterprise, Client and Mobile market segments. We are part of the world's top tier semiconductor supplier, SK hynix, offering Dynamic Random Access Memory chips (DRAM), Flash memory chips (NAND Flash) and CMOS Image Sensor (CIS) for a wide range of distinguished customers globally. Description We are looking for a driven, team-oriented Senior Signal Integrity Engineer to develop next generation Solid State Drive (SSD) products. This position requires experience in hardware design and signal and power integrity design. A successful candidate will have a good knowledge of state of the art memory device technologies and interfaces such as PCIe Gen 4, 5 and 6, DDR4/5, ONFI NAND and implementation techniques required for high-speed interfaces. This candidate will need to have a good working knowledge of simulation tools, schematic capture tools and lab equipment (scopes, analyzers, etc.). Expertise in design for optimum signal and power integrity as well as hands-on lab measurements experience is a must. Responsibilities Mentoring of engineers. Provide SI/PI expertise for SSD controller package (SoC) substrate design and SSD PCB design. Participate in the design of SSD products which includes: design guidelines, reviewing designs, validation of designs and final reports of work designs. Support PCB back-end process: defining stack-up and HDI via technologies, part placement, setting routing constraints and reviews. Interface with cross functional teams to ensure the design meets all system level requirements through verification/validation in the lab. Work closely with SoC, FW, package, and circuit design engineers. Documentation and communication to design, product and executive teams. Debug and root cause analysis at all product development stages, as well as customer escalations. Minimum Qualifications BS in Electrical Engineering required; MS in Electrical Engineering is a plus. 3-8+ years of relevant working experience. High-speed SSD board designs, pre layout simulation, post layout simulation and design layout guide generation for PCIe Gen4/5/6, DDR4/5, LPDDR4/4x, NVIO and PDN. Strong fundamentals in 3D/2D EM simulation tools and transmission line theory. Required experience of EM field solvers, time and frequency domain simulation tools like Sigrity, Allegro, ADS, HFSS, SIWAVE, and HSPICE. Simulation followed by measurement correlation using Oscilloscope, VNA and TDR equipment. Excellent understanding of PCB design fundamentals: single end and differential signaling, cross talk (near end and far end), signal loss and impedance control. Excellent written and verbal communication. Preferred Qualifications Technical leader experience. Familiar with generating and interpreting data & eye diagrams at PCIe GENx speeds: NRZ, PAM3, PAM4, PAMx. High Frequency pcb low loss board material experience. Experience with flex circuit design for high speed signaling. Familiarity with PCIe operation and DRAM operation for optimizing driver and receiver equalization schemes. Knowledge of IBIS and ability to take common simulation outputs such as S-parameters from various components and determine at the system level that PRD requirements are met. Optimizing PDN and extracting PDN for PSIJ Analysis. Familiar with PCISIG, JEDEC and ONFI specifications and compliance. COMPENSATION : $110,000/yr - $175,000/yr REGARDING COMPENSATION : SK hynix memory solutions America Inc. offers you the opportunity to apply your skills to exciting projects while working with innovative teams. Our compensation package is complimented by a generous benefits package including medical, dental, vision, life insurance and a company 401(k) match, as well as cafeteria, onsite gym and much more. If you are motivated by technical challenges, we offer a collaborative work environment that encourages career growth. The salary offered to a selected candidate will be tailored based on several factors, including the location, job grade, relevant knowledge, skills, and experience. We also take into account the internal equity among our current team members to ensure fairness and competitiveness

Requirements

Must-haves

Mentoring of engineers.
Provide SI/PI expertise for SSD controller package (SoC) substrate design and SSD PCB design.
Participate in the design of SSD products which includes: design guidelines, reviewing designs, validation of designs and final reports of work designs.
Support PCB back-end process: defining stack-up and HDI via technologies, part placement, setting routing constraints and reviews.
Interface with cross functional teams to ensure the design meets all system level requirements through verification/validation in the lab.
Work closely with SoC, FW, package, and circuit design engineers.
Documentation and communication to design, product and executive teams.
Debug and root cause analysis at all product development stages, as well as customer escalations.
3-8+ years of relevant working experience.
High-speed SSD board designs, pre layout simulation, post layout simulation and design layout guide generation for PCIe Gen4/5/6, DDR4/5, LPDDR4/4x, NVIO and PDN.
Strong fundamentals in 3D/2D EM simulation tools and transmission line theory.
Required experience of EM field solvers, time and frequency domain simulation tools like Sigrity, Allegro, ADS, HFSS, SIWAVE, and HSPICE.
Simulation followed by measurement correlation using Oscilloscope, VNA and TDR equipment.
Excellent understanding of PCB design fundamentals: single end and differential signaling, cross talk (near end and far end), signal loss and impedance control.

Nice-to-haves

BS in Electrical Engineering required; MS in Electrical Engineering is a plus.
Technical leader experience.
Familiar with generating and interpreting data & eye diagrams at PCIe GENx speeds: NRZ, PAM3, PAM4, PAMx.
High Frequency pcb low loss board material experience.
Experience with flex circuit design for high speed signaling.
Familiarity with PCIe operation and DRAM operation for optimizing driver and receiver equalization schemes.
Knowledge of IBIS and ability to take common simulation outputs such as S-parameters from various components and determine at the system level that PRD requirements are met.
Optimizing PDN and extracting PDN for PSIJ Analysis.
Familiar with PCISIG, JEDEC and ONFI specifications and compliance.
COMPENSATION : $110,000/yr - $175,000/yr

Application prep

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Keywords to mirror

machine learning

Platform: greenhouse
Effort: quick

Benefits

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Dental

Vision

401(K)