Job description

ABOUT THE ROLE Own the technology roadmap, manufacturability, and quality of the advanced PCBs and package substrates that carry our AI accelerator silicon. You'll drive where our substrate and PCB technology is headed — embedded passives/actives, inorganic core substrates, and novel thermal solutions — while making sure complex, high-layer-count boards and flip-chip organic substrates are designed to build cleanly, at yield, and to spec. Partnering across packaging, thermal, and systems teams and directly with our substrate and PCB manufacturing partners, you'll develop and qualify the new materials, structures, and processes that enable next-generation product architectures — and protect product quality where the silicon meets the system. WHAT YOU'LL DO Drive the advanced substrate and PCB technology roadmap — including embedded passive/active integration and inorganic core substrates — aligned to our AI accelerator product needs Develop and qualify new materials, structures, and processes with substrate and PCB vendors, taking them from evaluation through production readiness Cowork with cross-functional teams (packaging, SI/PI, thermal, mechanical, systems) to improve and enable new product architectures — with focus on passive/active embedding, novel thermal solutions, and improved SI/PI and mechanical behavior for assembly and reliability Lead DFM/DFx reviews for high-layer-count PCBs and organic package substrates (flip-chip BGA / ABF) — catching manufacturability, yield, and reliability risks before tape-out to the fab Own substrate and PCB supplier quality: qualify suppliers, drive PPAP/first-article and process capability, and hold partners to spec through NPI and volume ramp Define quality standards and acceptance criteria (IPC and internal) that gate build, and drive defect and failure analysis (cross-section, metrology, electrical) to root cause with corrective actions at the supplier Support reliability qualification (thermal cycling, HAST, etc.) and use statistical methods (SPC/DOE) to monitor and improve process quality across suppliers Build the DFM guidelines, checklists, and quality processes that scale with the program from prototype through production WHAT WE'RE LOOKING FOR BS/MS in Electrical, Materials, Mechanical, or Manufacturing Engineering plus 5+ years in advanced PCB/substrate technology development, DFM, or manufacturing/supplier quality for complex electronics Hands-on experience developing and qualifying advanced substrate/PCB technologies — embedded passives/actives, inorganic and organic core substrates, ABF build-up, flip-chip BGA — including materials, structures, and process development with vendors Strong grasp of advanced PCB and substrate fabrication processes (lamination, drilling/laser via, plating, ABF build-up, flip-chip BGA) and where they fail Experience partnering cross-functionally (packaging, SI/PI, thermal, mechanical, systems) to enable new product architectures, including embedded components and novel thermal solutions Supplier quality depth — qualification, PPAP/first-article, process capability, and driving corrective action with fab/substrate partners Fluency in IPC standards (e.g., IPC-6012 / IPC-A-600 or substrate equivalents) and quality acceptance criteria Failure-analysis skills: cross-section, metrology, and electrical debug to root-cause defects Full compensation packages are based on candidate experience and relevant certifications. California pay range $215,000 — $265,000 USD Compensation Final offers depend on level, location, and skills relevant to the role. Additional compensation: equity grant per company guidelines; medical / dental / vision; 401(k); standard PTO. Visa Sponsorship DensityAI sponsors qualified candidates for H-1B, O-1, TN, E-3, and other employment-based visas, and we welcome applicants on F-1 OPT and STEM-OPT. Work authorization is required at start; we provide immigration support to secure or transfer status. Export Controls Aspects of this role may involve access to information subject to U.S. export controls (EAR/ITAR). We may discuss licensing or scope adjustments during the interview. Equal Opportunity DensityAI is an Equal Opportunity Employer. We do not discriminate on the basis of race, color, religious creed, national origin, ancestry, physical or mental disability, medical condition, genetic information, marital status, sex, gender, gender identity, gender expression, age (40+), sexual orientation, military or veteran status, pregnancy, or any other status protected by law. We comply with the California CROWN Act and provide reasonable accommodations on request.

Requirements

Must-haves

Drive the advanced substrate and PCB technology roadmap — including embedded passive/active integration and inorganic core substrates — aligned to our AI accelerator product needs
Develop and qualify new materials, structures, and processes with substrate and PCB vendors, taking them from evaluation through production readiness
Lead DFM/DFx reviews for high-layer-count PCBs and organic package substrates (flip-chip BGA / ABF) — catching manufacturability, yield, and reliability risks before tape-out to the fab
Own substrate and PCB supplier quality: qualify suppliers, drive PPAP/first-article and process capability, and hold partners to spec through NPI and volume ramp
Define quality standards and acceptance criteria (IPC and internal) that gate build, and drive defect and failure analysis (cross-section, metrology, electrical) to root cause with corrective actions at the supplier
Support reliability qualification (thermal cycling, HAST, etc.) and use statistical methods (SPC/DOE) to monitor and improve process quality across suppliers
Build the DFM guidelines, checklists, and quality processes that scale with the program from prototype through production
BS/MS in Electrical, Materials, Mechanical, or Manufacturing Engineering plus 5+ years in advanced PCB/substrate technology development, DFM, or manufacturing/supplier quality for complex electronics
Strong grasp of advanced PCB and substrate fabrication processes (lamination, drilling/laser via, plating, ABF build-up, flip-chip BGA) and where they fail
Experience partnering cross-functionally (packaging, SI/PI, thermal, mechanical, systems) to enable new product architectures, including embedded components and novel thermal solutions
Supplier quality depth — qualification, PPAP/first-article, process capability, and driving corrective action with fab/substrate partners
Fluency in IPC standards (e.g., IPC-6012 / IPC-A-600 or substrate equivalents) and quality acceptance criteria
Failure-analysis skills: cross-section, metrology, and electrical debug to root-cause defects
Visa Sponsorship
Export Controls
Aspects of this role may involve access to information subject to U.S. export controls (EAR/ITAR). We may discuss licensing or scope adjustments during the interview.

Nice-to-haves

None flagged.

Application prep

Use the role’s language and application details while tailoring your materials.

Keywords to mirror

Platform: greenhouse
Effort: quick

Benefits

Benefits detected in the listing.

Dental

Vision

401(K)

Pto