Job description

Location: Hoboken, NJ Department: Tomorrow Reports to: Ting Bu Position Overview The Research Scientist will work on the modeling, simulation, and architectural development of quantum and artificial intelligence (AI) computational structures intended for chip-scale implementation. This role focuses on translating advanced quantum and AI concepts into physically realistic, simulation-validated device and system designs suitable for fabrication. It concentrates on high-fidelity simulation, feasibility analysis, and performance optimization under practical fabrication constraints. The role serves as a technical bridge between the research team developing novel quantum/AI architectures and the chip fabrication team responsible for implementation, ensuring that proposed designs are physically realizable, scalable, and performance-optimized prior to tape-out. Duties and Responsibilities ● Develop and simulate quantum and AI-based photonic architectures for on-chip implementation. ● Translate high-level computational concepts into device-level and system-level simulation models. ● Perform rigorous electromagnetic and multiphysics simulations to evaluate optical, nonlinear, and quantum effects. ● Model and simulate quantum photonic circuits and quantum gates under realistic device conditions. ● Analyze fabrication tolerances and material constraints to assess design robustness. Optimize photonic device structures for performance, scalability, and manufacturability. ● Collaborate closely with fabrication and packaging teams to ensure simulation models align with process capabilities. ● Support post-fabrication validation by correlating experimental results with simulation predictions. ● Document modeling methodologies, simulation results, and architectural trade-offs for internal and external reporting. Required Qualifications Education ● Ph.D. in Physics, Applied Physics, Electrical Engineering, or a closely related discipline. Technical Background ● Strong foundation in Photonics, Quantum optics, Nonlinear optics ● Demonstrated experience in simulation of photonic integrated circuits. ● Experience modeling and simulating quantum gates or quantum optical systems. ● Understanding of semiconductor/TFLN and photonic chip fabrication processes sufficient to incorporate realistic constraints into simulations. ● Familiarity with chip testing and packaging considerations from a modeling perspective. Software Proficiency ● Lumerical (FDTD, MODE, INTERCONNECT) ● Tidy3D ● COMSOL Multiphysics ● Python ● MATLAB

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