Job description

We are seeking an experienced Lead/Principal Semiconductor Packaging Engineer to work on a supplier site in Malta, NY as a full time Quantinuum employee developing innovative and reliable packaging schemes for the highly scaled ion traps in our quantum computers. All applicants for placement in safety-sensitive positions will be required to submit to a pre-employment drug test. Key Responsibilities: Develop and implement advanced packaging concepts for tiling large assemblies of ion trap chips, electrical chips and optical chips together Lead cross-functional teams to develop packaging strategies for advanced packaging concepts supporting large-format ion trap chips with high I/O signal count and density Generate packaging requirements for mechanical, thermal, electrical, and optical performance Lead a team working with vendors to implement and validate packaging processes Support all stages of ion trap development to ensure compatibility with packaging Lead a team of packaging engineers to interface with broader Quantinuum team to ensure ion trap packaging meets system requirements Champion engagements with 3rd parties to cultivate key partnerships, supplier relationships, and co-development opportunities YOU MUST HAVE: Minimum Bachelor’s degree with 10+ years’ experience OR Master’s degree with 8+ year’s experience OR PhD with 6+ year’s experience in advanced semiconductor packaging development Experience with 2.5-3D packaging techniques Due to Contractual requirements, must be a U.S. Person. defined as, U.S. citizen permanent resident or green card holder, workers granted asylum or refugee status Due to national security requirements imposed by the U.S. Government, candidates for this position must not be a People's Republic of China national or Russian national unless the candidate is also a U.S. citizen. WE VALUE: PhD in Physics or Engineering Experience with advanced large area multi-chip semiconductor packaging technologies Experience with large heterogeneous integration Experience with high-density I/O technologies Experience with photonic packaging and fiber-to-chip or optical chip-to-optical chip coupling A proven track record of innovation and IP development Experience working within a cross-functional team environment Quantinuum is a leading quantum computing company delivering a full stack platform designed to make quantum computing deployable in real-world environments. With active engagements spanning pharmaceuticals, material science, financial services, government, industrial sectors, and leading academic and research institutions worldwide, we are helping organizations unlock the transformative potential of quantum computing. Our global team of more than 800 employees includes many of the world's leading scientists, engineers, and researchers, with more than 70% of our technology team holding advanced degrees at the Master's or PhD level. Headquartered in Broomfield, Colorado, Quantinuum operates across the United States, United Kingdom, Germany, Japan, and Singapore. By joining Quantinuum, you’ll help shape the future of quantum computing, pushing the limits of technology, and making the impossible possible. What’s in it for you? We believe our people are our greatest strength and offer a comprehensive rewards package that supports your professional growth, well-being, and long-term success. Competitive compensation and the opportunity to work on groundbreaking technology Flexible work arrangements that support work-life balance Employer-subsidized medical, dental, and vision insurance 401(k) retirement savings plan with company match and student loan repayment benefit Equity opportunities Generous paid time off, sick leave, and 12 paid holidays annually Paid parental leave Employee discount programs Equal Opportunity Employer Quantinuum is proud to be an equal opportunity employer. We are committed to building an inclusive workplace where all employees and applicants are treated with respect and provided equal opportunities regardless of race, color, religion, sex, sexual orientation, gender identity or expression, national origin, age, disability, veteran status, ancestry, marital status, or any other characteristic protected by applicable law. Know Your Rights: Workplace discrimination is illegal. For more information about Quantinuum, please visit our website . We are committed to making our recruitment process accessible to all. If you require any reasonable adjustments at any stage of the application or interview process, please let us know use the Lets talk contact form. Applications will be accepted on an ongoing basis, there is no application deadline for this position.

Requirements

Must-haves

All applicants for placement in safety-sensitive positions will be required to submit to a pre-employment drug test.
Develop and implement advanced packaging concepts for tiling large assemblies of ion trap chips, electrical chips and optical chips together
Lead cross-functional teams to develop packaging strategies for advanced packaging concepts supporting large-format ion trap chips with high I/O signal count and density
Generate packaging requirements for mechanical, thermal, electrical, and optical performance
Lead a team working with vendors to implement and validate packaging processes
Support all stages of ion trap development to ensure compatibility with packaging
Lead a team of packaging engineers to interface with broader Quantinuum team to ensure ion trap packaging meets system requirements
Champion engagements with 3rd parties to cultivate key partnerships, supplier relationships, and co-development opportunities
Minimum Bachelor’s degree with 10+ years’ experience OR Master’s degree with 8+ year’s experience OR PhD with 6+ year’s experience in advanced semiconductor packaging development
Experience with 2.5-3D packaging techniques
Due to Contractual requirements, must be a U.S. Person. defined as, U.S. citizen permanent resident or green card holder, workers granted asylum or refugee status
Due to national security requirements imposed by the U.S. Government, candidates for this position must not be a People's Republic of China national or Russian national unless the candidate is also a U.S. citizen.
PhD in Physics or Engineering
Experience with advanced large area multi-chip semiconductor packaging technologies
Experience with large heterogeneous integration
Experience with high-density I/O technologies
Experience with photonic packaging and fiber-to-chip or optical chip-to-optical chip coupling
A proven track record of innovation and IP development
Experience working within a cross-functional team environment
By joining Quantinuum, you’ll help shape the future of quantum computing, pushing the limits of technology, and making the impossible possible.
What’s in it for you?
We believe our people are our greatest strength and offer a comprehensive rewards package that supports your professional growth, well-being, and long-term success.
Competitive compensation and the opportunity to work on groundbreaking technology
Flexible work arrangements that support work-life balance

Nice-to-haves

None flagged.

Application prep

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Platform: lever
Effort: quick

Benefits

Benefits detected in the listing.

Dental

Vision

401(K)

Paid Time Off

Parental Leave