Job description

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is seeking an experienced Optical Interconnect Design Architect to define and drive next-generation optical connectivity solutions enabling future memory, AI accelerator, and high-performance computing platforms. This role will lead architecture development, technology pathfinding, feasibility analysis, and ecosystem engagement required to enable scalable optical interconnect solutions. The successful candidate will evaluate emerging photonic technologies, develop optical I/O architectures, guide proof-of-concept implementations, and collaborate with internal and external partners to identify solutions that meet future bandwidth, energy efficiency, thermal, reliability, and manufacturability requirements. The architect will influence Micron s long-term optical interconnect roadmap spanning photonic interposers, silicon photonics, optical memory interfaces, co-packaged optics, optical networking, and advanced heterogeneous integration technologies. Responsibilities will include, but are not limited to: Drive architecture exploration and technology pathfinding that bridges current high-speed electrical I/O and die-to-die interconnect solutions with future optical interface technologies for AI, HBM, and chiplet-based systems. Define optical interconnect architectures for next-generation memory and AI computing systems. Lead architectural tradeoff studies across electrical and optical interconnect technologies, evaluating bandwidth density, latency, power efficiency, thermal performance, reliability, and cost. Develop optical I/O architectures incorporating Photonic Integrated Circuits (PICs), modulators, detectors, Waveguide technologies, packaging and fiber interfaces, Silicon photonics integration Assess emerging technologies including Optical Interposers, Co-Packaged Optics (CPO), and Near-Package Optics (NPO). Drive proof-of-concept demonstrations and technology pathfinding activities for future HBM and die-to-die optical interconnect solutions. Successful candidates for this position will have: Demonstrated experience in one or more of the following: Optical Interconnect Architecture, Silicon Photonics, High-Speed I/O Systems, Optical Communication Systems Strong understanding of: Optical communication fundamentals, Wavelength Division Multiplexing (WDM/DWDM), Optical link budgeting, Photonic Integrated Circuit design Experience performing architecture-level tradeoff analysis involving performance, power, thermal, cost, and scalability metrics. Apply AI assisted analysis to evaluate architectural tradeoffs and technology benchmarking. Working knowledge of advanced semiconductor packaging technologies including chiplets, hybrid bonding, 2.5D/3D integration, and heterogeneous integration. Proven ability to drive technical initiatives across multiple engineering disciplines. Required Experience PhD in Electrical Engineering, Optics, Photonics, Physics, Computer Engineering, or a related technical discipline with 5 years of industry experience; or Master s degree with 8 years of relevant industry experience. Job title and level can scale depending on experience and qualifications As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits . Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws. To learn about your right to work click here. To learn more about Micron, please visit micron.com/careers For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na micron.com or 1-800-336-8918 (select option #3) Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron. AI alert : Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate s true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification. Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

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Our vision is to transform how the world uses information to enrich life for all .
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Our vision is to transform how the world uses information to enrich life for all .
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Micron is seeking an experienced Optical Interconnect Design Architect to define and drive next-generation optical connectivity solutions enabling future memory, AI accelerator, and high-performance computing platforms.
Responsibilities will include, but are not limited to:
Define optical interconnect architectures for next-generation memory and AI computing systems.
Lead architectural tradeoff studies across electrical and optical interconnect technologies, evaluating bandwidth density, latency, power efficiency, thermal performance, reliability, and cost.
Develop optical I/O architectures incorporating Photonic Integrated Circuits (PICs), modulators, detectors, Waveguide technologies, packaging and fiber interfaces, Silicon photonics integration
Assess emerging technologies including Optical Interposers, Co-Packaged Optics (CPO), and Near-Package Optics (NPO).
Drive proof-of-concept demonstrations and technology pathfinding activities for future HBM and die-to-die optical interconnect solutions.
Successful candidates for this position will have:
Demonstrated experience in one or more of the following: Optical Interconnect Architecture, Silicon Photonics, High-Speed I/O Systems, Optical Communication Systems
Strong understanding of: Optical communication fundamentals, Wavelength Division Multiplexing (WDM/DWDM), Optical link budgeting, Photonic Integrated Circuit design
Experience performing architecture-level tradeoff analysis involving performance, power, thermal, cost, and scalability metrics.
Apply AI assisted analysis to evaluate architectural tradeoffs and technology benchmarking.
Working knowledge of advanced semiconductor packaging technologies including chiplets, hybrid bonding, 2.5D/3D integration, and heterogeneous integration.
Proven ability to drive technical initiatives across multiple engineering disciplines.
PhD in Electrical Engineering, Optics, Photonics, Physics, Computer Engineering, or a related technical discipline with 5 years of industry experience; or
Master s degree with 8 years of relevant industry experience.
Job title and level can scale depending on experience and qualifications
To learn about your right to work click here.
To learn more about Micron, please visit micron.com/careers
For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na micron.com or 1-800-336-8918 (select option #3)

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Platform: workday
Effort: long

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