Job description

Job Details: Job Description: Organization Overview   Manufacturing Development Customer Engineering (MDCE) is Intel s newest organization within Intel Foundry Technology Manufacturing (FTM). We bridge the critical gap between Technology Development (TD) and High-Volume Manufacturing (HVM), advancing technology nodes and process capability from initial product qualification to high-yield production across multiple products while enhancing technologies for our foundry customers.  About This Role Join Intel s Manufacturing Development and Customer Engineering (MDCE) team as a Senior Engineer driving process innovation across Intel s most advanced semiconductor technologies in volume manufacturing. You will spearhead the development, optimization, and manufacturability of critical thin film deposition processes, ensuring seamless transitions from early development to high-volume production while meeting Intel foundry customer requirements. Your Mission  Lead thin film process excellence across CVD, ALD, PVD, epitaxy, thermal/plasma deposition, furnace, implant, anneal, and/or treatment technologies. Operating at the nexus of Technology Development and High-Volume Manufacturing, you will drive breakthrough solutions for Intel 18A, Intel 3, 12nm, and next-generation technology nodes. Key Responsibilities Process Innovation & Excellence Champion safety, quality, yield, throughput, and cost optimization across thin film deposition modules Drive defectivity reduction and uniformity improvements through systematic process enhancement Lead technical problem resolution and deliver solutions that meet aggressive technology node targets Optimize equipment performance working with internal teams and key suppliers Strategic Technical Leadership Align technical vision with customer requirements and business objectives Synthesize complex technical data to formulate and execute strategic responses Own end-to-end resolution of manufacturing challenges spanning multiple engineering disciplines Deliver rapid execution of innovative solutions to meet challenging development timelines Cross-Functional Partnership Collaborate closely with Technology Development, High Volume Manufacturing, and Business Groups Build strong relationships with Integration, Device, Yield, Quality, Reliability teams, and external suppliers Present technical findings effectively to diverse audiences from engineering teams to executive leadership Foster in-person collaboration to accelerate decision-making and problem resolution Industry Leadership Stay current with semiconductor industry trends and emerging process technologies Drive strategic initiatives that position Intel at the forefront of manufacturing innovation Contribute to technology roadmaps through hands-on technical expertise and market insight What We re Looking For Technical Excellence Results-driven professional with exceptional technical problem-solving abilities Proven track record of significant accomplishments across multiple technology nodes Strong analytical skills with expertise in yield improvement, performance enhancement, and variation reduction Deep understanding of semiconductor manufacturing strategies, fab operations, and technology transfer Leadership Capabilities Outstanding communication skills for presenting complex technical information to varied audiences Self-motivated with strong initiative and ability to navigate ambiguous technical challenges Demonstrated ability to manage multiple high-priority projects under pressure while maintaining quality focus Experience driving clarity in complex technical situations and leading cross-functional initiatives Industry Expertise Comprehensive knowledge of process development, materials science, and device physics Ability to interpret industry trends and translate market dynamics into actionable technical strategies Experience with foundry business models and customer engagement requirements Proven capability to work independently while managing diverse technical assignments Qualifications: The Minimum qualifications are required to be initially considered for this position. Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications Master s degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or in a STEM related field 5 years semiconductor industry experience with strong focus on thin film deposition processes -OR- PhD and 3 years of Industry experience Proven experience in process development, technical leadership, and manufacturing engineering Experience working with equipment suppliers (AMAT, LAM, ASM, TEL) on process optimization Comprehensive fab startup experience across manufacturing, quality, RandD, and supply chain functions Proficiency with Statistical Process Control (SPC), Design of Experiments (DOE), and factory automation systems Preferred Qualifications Doctoral degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or in a STEM related field with research publications and patent portfolio in thin film technologies Expertise in Gate All Around (GAA) logic technologies within semiconductor foundry environments Proven track record delivering customized solutions across Technology Development and HVM organizations Cross-functional leadership experience managing diverse stakeholder groups Semiconductor foundry experience We invite you to bring your expertise and passion to Intel, where you ll have the opportunity to grow your career, make meaningful contributions, and shape the future of technology. Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel . Annual Salary Range for jobs which could be performed in the US: $133,800.00-255,200.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process. Work Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change. * ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Requirements

Must-haves

Job Description: Organization Overview
Your Mission
Process Innovation & Excellence
Champion safety, quality, yield, throughput, and cost optimization across thin film deposition modules
Drive defectivity reduction and uniformity improvements through systematic process enhancement
Lead technical problem resolution and deliver solutions that meet aggressive technology node targets
Optimize equipment performance working with internal teams and key suppliers
Strategic Technical Leadership
Align technical vision with customer requirements and business objectives
Synthesize complex technical data to formulate and execute strategic responses
Own end-to-end resolution of manufacturing challenges spanning multiple engineering disciplines
Deliver rapid execution of innovative solutions to meet challenging development timelines
Cross-Functional Partnership
Collaborate closely with Technology Development, High Volume Manufacturing, and Business Groups
Build strong relationships with Integration, Device, Yield, Quality, Reliability teams, and external suppliers

Nice-to-haves

Doctoral degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or in a STEM related field with research publications and patent portfolio in thin film technologies
Expertise in Gate All Around (GAA) logic technologies within semiconductor foundry environments
Proven track record delivering customized solutions across Technology Development and HVM organizations
Cross-functional leadership experience managing diverse stakeholder groups
Semiconductor foundry experience
We invite you to bring your expertise and passion to Intel, where you ll have the opportunity to grow your career, make meaningful contributions, and shape the future of technology.
Job Type: Experienced Hire
Shift: Shift 1 (United States of America)
Primary Location: US, Oregon, Hillsboro

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