Job description

Company: Qualcomm Technologies, Inc. Job Area: Engineering Group, Engineering Group > Packaging Engineering General Summary: Qualcomm is the industry leader in 4G, 5G, and future-generation communication technology and designs the most advanced radio technology in the commercial wireless marketplace. QCT's RF EM Team is actively seeking engineers with demonstrated experience in the design, EM simulation and circuit modeling of passive RF components for use in our RFIC designs. Responsibilities · Design and develop RF passive components for use in the next generation of highly integrated RF integrated circuits in deep sub-micron CMOS and SOI technologies. · Work with the circuit design team to optimize component sizes and performance for use in RF circuit blocks. · Deliver components that include compact models, and DRC clean physical designs. · Execute isolation analysis and optimization to reduce on-chip and chip-package-PCB coupling. · Optimization of multichip carriers for RF systems, focusing on loss and isolation. All Qualcomm employees are expected to actively support diversity on their teams, and in the Company. Minimum Qualifications · Bachelor's degree in Science, Engineering, or related field. · 4+ years RF and electromagnetic design, verification, or related work experience. Preferred Qualifications · Experience in the design and simulation of RF passive components such as inductors, transformers, MOM capacitors and passive filters. · Demonstrated abilities with EM simulation techniques and tool including EM solvers (EMX, Helic, Peakview, HFSS, Clarity, etc). · Experience with circuit design and layout using Cadence tools and Keysight ADS. · Compact RLCK Model extraction of multiport passive components. · Ability to use EM tools to predict circuit level electric and magnetic coupling. · Passionate self-starter and team player with experience in project leadership and multi-tasking. Minimum Qualifications: • Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ years of System/Package Design/Technology Engineering or related work experience. OR Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 3+ years of System/Package Design/Technology Engineering or related work experience. OR PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ year of System/Package Design/Technology Engineering or related work experience. Required: Bachelor's degree in Science, Engineering, or related field. Preferred: Master's and PhD Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here . Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). To all Staffing and Recruiting Agencies : Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications. EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification. Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. Pay range and Other Compensation & Benefits : $160,200.00 - $240,200.00 The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link . If you would like more information about this role, please contact Qualcomm Careers .

Requirements

Must-haves

Qualcomm Technologies, Inc.
Engineering Group, Engineering Group > Packaging Engineering
Design and develop RF passive components for use in the next generation of highly integrated RF integrated circuits in deep sub-micron CMOS and SOI technologies.
Work with the circuit design team to optimize component sizes and performance for use in RF circuit blocks.
Deliver components that include compact models, and DRC clean physical designs.
Execute isolation analysis and optimization to reduce on-chip and chip-package-PCB coupling.
Optimization of multichip carriers for RF systems, focusing on loss and isolation.
All Qualcomm employees are expected to actively support diversity on their teams, and in the Company.
Bachelor's degree in Science, Engineering, or related field.
4+ years RF and electromagnetic design, verification, or related work experience.
Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ years of System/Package Design/Technology Engineering or related work experience.
Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 3+ years of System/Package Design/Technology Engineering or related work experience.
PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ year of System/Package Design/Technology Engineering or related work experience.
$160,200.00 - $240,200.00
If you would like more information about this role, please contact Qualcomm Careers .

Nice-to-haves

Experience in the design and simulation of RF passive components such as inductors, transformers, MOM capacitors and passive filters.
Demonstrated abilities with EM simulation techniques and tool including EM solvers (EMX, Helic, Peakview, HFSS, Clarity, etc).
Experience with circuit design and layout using Cadence tools and Keysight ADS.
Compact RLCK Model extraction of multiport passive components.
Ability to use EM tools to predict circuit level electric and magnetic coupling.
Passionate self-starter and team player with experience in project leadership and multi-tasking.
Required: Bachelor's degree in Science, Engineering, or related field. Preferred: Master's and PhD

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