Job description

Join d-Matrix and help build the future of AI inference. We’ve pioneered a memory-centric architecture that brings compute directly into memory, making AI faster, more energy efficient, and accessible on a global scale. From chips and software to rack-scale systems, our team is tackling some of AI infrastructure’s hardest challenges—and shipping breakthrough technology today. If you want to create what comes next and help make infinite inference possible, we’d love to hear from you. Our culture is built on respect, collaboration, and direct communication. We value humility, we believe our different perspectives lead to better solutions, and we’re looking for people who are driven by execution and energized by hard problems. Role Overview d-Matrix is seeking an experienced Mechanical Engineer to lead rack-scale mechanical design for our AI inference hardware platform, from chip/package to full system level. In this role, you'll own mechanical systems through their entire lifecycle — from concept and validation to mass production — working closely with thermal, electrical, software, and systems engineering teams. You'll bring deep expertise in OCP (Open Compute Project) specifications, chassis and sheet metal design, and supplier/ODM management to help scale our hardware in a fast-paced startup environment. This is a hands-on role for someone who thrives working across disciplines and can drive mechanical programs from first concept through high-volume manufacturing. This role owns mechanical systems at the rack, enclosure, and cross-program level, including oversight of liquid-cooled rack architectures. It partners closely with the Card & Sub-Chassis Mechanical Engineer, who owns card-level design and the MCM-to-cold-plate interface within the Monza chassis — this role is not expected to duplicate that card/cold-plate ownership, but should have enough liquid-cooling fluency to review and integrate that work at the rack level. What You Will Do - Lead mechanical design for our AI inference hardware platform at rack scale, in compliance with OCP specifications. - Design and validate chassis mechanical systems, sheet metal enclosures, cooling architectures, and high-power connections. - Own the full product lifecycle — from design and validation through NPI to mass production. - Conduct mechanical reliability testing (shock, vibration, thermal cycling) and lead 3D modeling, FEA, and tolerance analysis to validate designs for manufacturability. - Partner with suppliers, ODMs, CMs, and JDMs to develop custom mechanical/thermal components and manage manufacturing support through production ramp. - Debug and resolve quality issues surfaced during NPI and production, driving root-cause analysis and corrective action. - Review and sign off on liquid-cooled cold plate and manifold integration at the rack level (design owned by the Card & Sub-Chassis Mechanical Engineer), ensuring compatibility with CDU interfaces and facility water connections. - Develop specifications and test procedures for reliability and performance and mentor engineers across the design lifecycle. - Evaluate new technologies and methodologies to improve mechanical and thermal performance and ensure compliance with quality standards through product launch. What You Will Bring - Bachelor’s degree in mechanical engineering or a related field. - 10+ years of industry experience in mechanical design, simulation, and validation for IT hardware, with demonstrated technical leadership of full rack-scale programs. - Hands-on experience with OCP specifications and rack-scale system design. - Strong background in chassis mechanical design, sheet metal design/fabrication, and design-for-manufacturability (DFM) at high volume. - Experience running and interpreting shock and vibration testing. - Proven track record taking designs from concept through validation to mass production (NPI to MP). - Direct experience working with suppliers, ODMs, CMs, and/or JDMs on hardware development. - Strong debugging and root-cause analysis skills for mechanical/quality issues in production environments. - Proficiency in CAD tools and FEA. - Expertise in GD&T and tolerance stack-up analysis, and materials selection for structural and thermal performance in chassis/enclosure design. - Self-driven and detail-oriented, comfortable working independently or across engineering teams. Preferred Qualifications - Master’s degree in mechanical engineering or related field. - 15+ years of industry experience in mechanical design, simulation, and validation for IT hardware. - Experience with data center hardware or high-performance computing systems at scale. - Familiarity with liquid-cooled rack architectures (cold plates, manifolds, CDUs, facility water interfaces) sufficient to review and integrate card-level cooling designs at the rack level. - Direct hands-on cold plate or manifold design experience, beyond rack-level integration. - Deep understanding of reliability testing, failure analysis, and thermal stress modeling for electronic components. Equal Opportunity Employment Policy d-Matrix is proud to be an equal opportunity workplace and affirmative action employer. We’re committed to fostering an inclusive environment where everyone feels welcomed and empowered to do their best work. We hire the best talent for our teams, regardless of race, religion, color, age, disability, sex, gender identity, sexual orientation, ancestry, genetic information, marital status, national origin, political affiliation, or veteran status. Our focus is on hiring teammates with humble expertise, kindness, dedication and a willingness to embrace challenges and learn together every day. d-Matrix does not accept resumes or candidate submissions from external agencies. We appreciate the interest and effort of recruitment firms, but we kindly request that individual interested in opportunities with d-Matrix apply directly through our official channels. This approach allows us to streamline our hiring processes and maintain a consistent and fair evaluation of al applicants. Thank you for your understanding and cooperation.

Requirements

Must-haves

If you want to create what comes next and help make infinite inference possible, we’d love to hear from you.
Lead mechanical design for our AI inference hardware platform at rack scale, in compliance with OCP specifications.
Design and validate chassis mechanical systems, sheet metal enclosures, cooling architectures, and high-power connections.
Own the full product lifecycle — from design and validation through NPI to mass production.
Conduct mechanical reliability testing (shock, vibration, thermal cycling) and lead 3D modeling, FEA, and tolerance analysis to validate designs for manufacturability.
Partner with suppliers, ODMs, CMs, and JDMs to develop custom mechanical/thermal components and manage manufacturing support through production ramp.
Debug and resolve quality issues surfaced during NPI and production, driving root-cause analysis and corrective action.
Develop specifications and test procedures for reliability and performance and mentor engineers across the design lifecycle.
Evaluate new technologies and methodologies to improve mechanical and thermal performance and ensure compliance with quality standards through product launch.
What You Will Bring
Bachelor’s degree in mechanical engineering or a related field.
10+ years of industry experience in mechanical design, simulation, and validation for IT hardware, with demonstrated technical leadership of full rack-scale programs.
Hands-on experience with OCP specifications and rack-scale system design.
Strong background in chassis mechanical design, sheet metal design/fabrication, and design-for-manufacturability (DFM) at high volume.
Experience running and interpreting shock and vibration testing.
Proven track record taking designs from concept through validation to mass production (NPI to MP).
Direct experience working with suppliers, ODMs, CMs, and/or JDMs on hardware development.
Strong debugging and root-cause analysis skills for mechanical/quality issues in production environments.

Nice-to-haves

Master’s degree in mechanical engineering or related field.
Experience with data center hardware or high-performance computing systems at scale.
Familiarity with liquid-cooled rack architectures (cold plates, manifolds, CDUs, facility water interfaces) sufficient to review and integrate card-level cooling designs at the rack level.
Direct hands-on cold plate or manifold design experience, beyond rack-level integration.
Deep understanding of reliability testing, failure analysis, and thermal stress modeling for electronic components.
Equal Opportunity Employment Policy

Application prep

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