Job description

Company: Qualcomm Technologies, Inc. Job Area: Interns Group, Interns Group > Interim Engineering Intern - HW General Summary: About Qualcomm Qualcomm relentlessly innovates transforming businesses, enriching lives and fortifying societies. Our solutions are pivotal in crafting a smarter, interconnected world. Building on our nearly 40-year history of era-defining technology breakthroughs, we deliver leading-edge AI, high performance, lower-power computing, and unrivaled connectivity. We’re proud to be the partner of choice to many of the world’s largest enterprises. Together with our ecosystem partners, we enable next-generation digital transformation. At Qualcomm, we are engineering human progress. Join Us in Shaping the Future At Qualcomm, we're committed to engineering human progress by delivering intelligent computing everywhere. We're passionate about harnessing the power of technology to transform industries and improve lives. Our early career programs offer limitless opportunities for growth, mentorship, and meaningful work. By joining our team, you'll be part of a community that's pushing the boundaries of what's possible in AI, computing, and connectivity. With a global footprint spanning over 30 countries, you'll have the chance to collaborate with diverse talent and contribute to projects that are shaping the future of technology. Our early career programs are designed to attract inventive minds, offering a platform to contribute to our long-term innovation pipeline. You'll be part of a community that values collaboration, creativity, and continuous learning. Our programs provide real-world experience, technical skills, and professional development opportunities, empowering you to make a meaningful impact and achieve your career goals. Join us for our U.S. 2027 summer intern class ! Maximize Your Opportunities: Our internship hiring model routes candidates from this application into multiple project specific roles. Your "Profile Visibility" choice will guide how we manage your data across our systems. To be considered for the full breadth of internship opportunities, select the option to use your profile data for "Any Roles Globally". If you choose to limit your data to "Only The Role I'm Applying For", it will restrict the opportunity for you to be considered across matching internship opportunities. You can update your profile visibility preferences at any time through the Candidate Home Portal. Steps: • Log Into Your Eightfold Candidate Home Account • Hover Over The "Profile" Dropdown • Open Settings • Edit "Profile Visibility" Role Overview As a Qualcomm Mechanical Engineering Intern , you’ll have the opportunity to push the boundaries of what exists and help establish the new standards for tomorrow. You will work as an equal contributor on a team of leading engineers to design, simulate, and test mechanical and thermal systems that support Qualcomm’s advanced semiconductor technologies. Projects may span IC packaging, chip/package co-design, thermal modeling, signal and power integrity, and next-generation cooling solutions. This internship supports the  Mechanical Engineering track. Based on your resume you will be aligned to projects within this track. Minimum Qualifications • Currently enrolled in a bachelor’s, master’s, or Ph.D. degree program in mechanical engineering, materials science, or a related field • Must be available for 11–14 weeks during Summer 2027 (May–September) • Expected graduation date of Nove mber 2027 or later • 1+ years of academic experience with programming languages such as Python, Matlab Preferred Qualifications • Candidates actively pursuing a degree with an anticipated graduation between  Nove mber 2027 and June 2028. • Familiarity with Cadence Sip, AutoCAD, and Solidworks • Coursework in Solid Mechanics, Mechanics of Materials, and Finite Element Analysis (FEA) • Knowledge of IC packaging structures, chip-package interaction, and electronic packaging processes • Experience with thermal system design, modeling, and testing • Understanding of heat transfer, mechanical design, and microelectronics • Exposure to server product design, system impedance testing, fan performance measurement, and heatsink design methodology • Experience with Computational Fluid Dynamics (CFD), wind tunnel, and/or airflow bench operation Qualcomm’s Internship Program Our interns join world-class teams to help define and build what is next for mobility and the world. You’ll be paired with a mentor with visibility to your project and team, receive support from your manager, and have access to the entire Qualcomm employee community to ensure your success. To round out your summer internship, we host professional development workshops, social events, cross-functional speaker sessions, and an executive speaker series. In addition to competitive hourly pay and accrued vacation time, you will receive relocation coverage and furnished housing accommodations for the duration of your internship. Internship opportunities may be available in the following locations, depending on team and project needs: Austin, Boulder, Boxborough, Bridgewater, Chandler, Irvine, New York City, Louisville, Raleigh, San Diego, Santa Clara, and Seattle. Application Process By applying here, you are expressing interest in one of our many  2027 Qualcomm Mechanical Engineering internships . It is important to note that this is not a job posting for a specific role. We will review resumes on an ongoing basis, and a recruiter may reach out to you. Future Employment Considerations This internship aligns to a potential role that is not eligible for Qualcomm immigration sponsorship. Export Control Notice This role may require an export license for candidates with citizenship in certain countries (see current country list below – subject to change). Qualcomm, like other companies, is experiencing significant delays in the export license process. Please be advised that if an export license is required, you may not be able to start work with Qualcomm until the license is granted, which may impact your ability to participate in the internship. Countries requiring export: Armenia, Azerbaijan, Belarus, Burma (Myanmar), Cambodia, China, Cuba, Georgia, Hong Kong, Iran, Iraq, Kazakhstan, Kyrgyzstan, Laos, Libya, Macau, Moldova, Mongolia, Nicaragua, North Korea, Russia, Sudan, Syria, Tajikistan, Turkmenistan, Ukraine, Uzbekistan, Venezuela, Vietnam, and Yemen. Applicants : Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here . Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). To all Staffing and Recruiting Agencies : Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications. EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification. Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. Pay range and Other Compensation & Benefits : $17.00 - $98.00 The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link . If you would like more information about this role, please contact Qualcomm Careers .

Requirements

Must-haves

Qualcomm Technologies, Inc.
Interns Group, Interns Group > Interim Engineering Intern - HW
If you choose to limit your data to "Only The Role I'm Applying For", it will restrict the opportunity for you to be considered across matching internship opportunities.
You can update your profile visibility preferences at any time through the Candidate Home Portal.
Log Into Your Eightfold Candidate Home Account
Hover Over The "Profile" Dropdown
Open Settings
Edit "Profile Visibility"
This internship supports the  Mechanical Engineering track. Based on your resume you will be aligned to projects within this track.
Currently enrolled in a bachelor’s, master’s, or Ph.D. degree program in mechanical engineering, materials science, or a related field
Must be available for 11–14 weeks during Summer 2027 (May–September)
Expected graduation date of Nove mber 2027 or later
1+ years of academic experience with programming languages such as Python, Matlab

Nice-to-haves

Candidates actively pursuing a degree with an anticipated graduation between  Nove mber 2027 and June 2028.
Familiarity with Cadence Sip, AutoCAD, and Solidworks
Coursework in Solid Mechanics, Mechanics of Materials, and Finite Element Analysis (FEA)
Knowledge of IC packaging structures, chip-package interaction, and electronic packaging processes
Experience with thermal system design, modeling, and testing
Understanding of heat transfer, mechanical design, and microelectronics
Exposure to server product design, system impedance testing, fan performance measurement, and heatsink design methodology
Experience with Computational Fluid Dynamics (CFD), wind tunnel, and/or airflow bench operation
Qualcomm’s Internship Program

Application prep

Use the role’s language and application details while tailoring your materials.

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aipythonrest

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Benefits

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Professional Development