Job description

Role Overview We are seeking an Advanced 2.5D/3D/Chiplet packaging Lead, who will be directing Signal Integrity for Package, PCB and System design for Copper Interconnects beyond 200G, Work on enabling advanced packaging for Driver, TIA & Optics for AI Scale up engine including SI/ PI, Reliability, Thermals and HVM; Also drive Micro-LED packaging and Heterogeneous package development. Good understanding of OSAT ecosystem and drive the development of complete solutions for data-centers Key Responsibilities Technical Leadership & Execution Own package, PCB, and system-level signal integrity architecture for 200G+/lane copper interconnects (C2M, C2C, and cable assemblies) — from channel budgeting and topology definition through post-layout signoff and correlation with silicon measurements. Drive 2.5D/3D and heterogeneous package development for co-packaged driver, TIA, and optical engines, including substrate architecture, interposer/bridge evaluation, and die–package co-design with the SerDes and analog design teams. Lead micro-LED and photonic packaging development: optical coupling and alignment strategy, hermeticity and reliability, and thermal co-design with the optical engine. Define and manage the OSAT and substrate supplier strategy — technology selection, DFM reviews, JEDEC qualification, yield ramp, and HVM readiness. Own package-level power integrity and thermal strategy: PDN targets, decoupling plans, lid/TIM selection, and clear signoff criteria across programs. Coordinate cross-functional execution across silicon design, product/test engineering, systems hardware, and manufacturing partners; run design reviews and manage schedule and risk. Hands-On Design Personally drive substrate stackup definition, ballmap/pinmap optimization, and high-density breakout and escape routing studies for high-speed designs. Perform 3D EM extraction and channel simulation (HFSS/Q3D, ADS or equivalent), S-parameter quality checks, and COM/IL/RL budgeting against IEEE 802.3 and OIF-CEI specifications. Build and correlate PDN and thermal models spanning die, package, and board. Lead lab characterization: VNA/TDR measurements, BER and eye-margin testing, model-to-measurement correlation, and failure analysis support. Author package design guidelines, review checklists, and reference collateral used across product programs. Required Qualifications Education & Experience Ph.D. in Electrical Engineering (or related) with 5+ years, OR M.S. with 8+ years of Advanced package development in high volume. Proven experience leading teams to successful execution, with multiple products delivered in advanced CMOS nodes. Core Technical Skills Deep SI/PI expertise for multi-GHz serial links: 112G/224G PAM4 channel design, COM analysis, crosstalk and mode-conversion control, and connector/cable interfaces. Advanced packaging depth: FCBGA, RDL/fan-out, 2.5D interposers and silicon bridges, substrate design rules, and materials selection. Fluency with industry tools: HFSS, Q3D, SIwave/PowerSI, ADS channel simulation, Cadence APD/Allegro (or equivalent), and thermal tools such as Icepak or FloTHERM. Reliability and qualification: JEDEC standards, moisture sensitivity, thermo-mechanical stress, and warpage/coplanarity management for large-body packages. Working knowledge of optics packaging: VCSEL/PD or silicon-photonics co-packaging, fiber and lens coupling, and active alignment concepts. Leadership & Program Skills Track record leading small internal teams and external partners (OSATs, substrate vendors, contract labs) through complete product cycles into volume production. Strong program discipline: schedule and risk management, structured design reviews, and clear documentation in a fast-moving environment. Excellent cross-functional communication with silicon, systems, and executive stakeholders; comfortable presenting technical trade-offs to customers and partners. Preferred Qualifications Experience with co-packaged optics, linear-drive optics, or active copper/electrical cable (ACC/AEC) products. Micro-LED, VCSEL, or photonic device packaging experience. Familiarity with UCIe and chiplet/die-to-die interconnect packaging. Hands-on HVM ramp experience at leading OSATs (ASE, Amkor, JCET, or similar). Prior startup experience or comfort operating with broad scope under resource constraints. California Pay Range $180,000 — $200,000 USD

Requirements

Must-haves

Technical Leadership & Execution
Lead micro-LED and photonic packaging development: optical coupling and alignment strategy, hermeticity and reliability, and thermal co-design with the optical engine.
Define and manage the OSAT and substrate supplier strategy — technology selection, DFM reviews, JEDEC qualification, yield ramp, and HVM readiness.
Own package-level power integrity and thermal strategy: PDN targets, decoupling plans, lid/TIM selection, and clear signoff criteria across programs.
Coordinate cross-functional execution across silicon design, product/test engineering, systems hardware, and manufacturing partners; run design reviews and manage schedule and risk.
Hands-On Design
Personally drive substrate stackup definition, ballmap/pinmap optimization, and high-density breakout and escape routing studies for high-speed designs.
Perform 3D EM extraction and channel simulation (HFSS/Q3D, ADS or equivalent), S-parameter quality checks, and COM/IL/RL budgeting against IEEE 802.3 and OIF-CEI specifications.
Build and correlate PDN and thermal models spanning die, package, and board.
Lead lab characterization: VNA/TDR measurements, BER and eye-margin testing, model-to-measurement correlation, and failure analysis support.
Author package design guidelines, review checklists, and reference collateral used across product programs.
Education & Experience
Ph.D. in Electrical Engineering (or related) with 5+ years, OR M.S. with 8+ years of Advanced package development in high volume.
Proven experience leading teams to successful execution, with multiple products delivered in advanced CMOS nodes.
Core Technical Skills
Deep SI/PI expertise for multi-GHz serial links: 112G/224G PAM4 channel design, COM analysis, crosstalk and mode-conversion control, and connector/cable interfaces.
Advanced packaging depth: FCBGA, RDL/fan-out, 2.5D interposers and silicon bridges, substrate design rules, and materials selection.
Fluency with industry tools: HFSS, Q3D, SIwave/PowerSI, ADS channel simulation, Cadence APD/Allegro (or equivalent), and thermal tools such as Icepak or FloTHERM.
Reliability and qualification: JEDEC standards, moisture sensitivity, thermo-mechanical stress, and warpage/coplanarity management for large-body packages.

Nice-to-haves

Experience with co-packaged optics, linear-drive optics, or active copper/electrical cable (ACC/AEC) products.
Micro-LED, VCSEL, or photonic device packaging experience.
Familiarity with UCIe and chiplet/die-to-die interconnect packaging.
Hands-on HVM ramp experience at leading OSATs (ASE, Amkor, JCET, or similar).
Prior startup experience or comfort operating with broad scope under resource constraints.

Application prep

Use the role’s language and application details while tailoring your materials.

Keywords to mirror

Platform: greenhouse
Effort: quick