Job description

The position is on Apple’s innovative Mac Reliability Engineering team, where we collaborate with hardware development and Silicon packaging. The engineer will be responsible for leading board level reliability on new Mac portables, development of new test procedures to quantify the reliability of a design, and failure analysis resulting from these tests. MS in Materials Science, Electrical, Mechanical Engineering or an equivalent field with 2+ years of relevant engineering experience Experience performing board level reliability testing including Mechanical Stress Tests, Shock/Drop/Vibration Testing, Environmental Testing Ability to use fundamental failure analysis methodology to derive root cause of failures, knowledge of failure modes and statistical life data analysis using curve fitting and distributions models Knowledge of board level design, DFM (Design for Manufacturing) and reliability best practices to guide component selection and placement in early architecture Strong knowledge of Semiconductor package integration, SLI (Second Level Interconnect) reliability, passive components reliability, bonding materials and warpage control Ability to apply FMEA (Failure Modes an Effects Analysis) methodologies Application of DOE (design of Experiments) Failure Analysis analytical techniques (Optical Microscopy, X-Ray, CSAM, SEM/EDS, FTIR, XPS etc) Knowledge of industry test Standards (JEDEC, ASTM, IEEE) Exceptional problem solving abilities, written and verbal communication skills and strong attention to detail Ability to manage multiple projects at the same time Dynamic and “can do” attitude with a desire to work with a great team and product Ability to travel internationally without restrictions

Requirements

Must-haves

MS in Materials Science, Electrical, Mechanical Engineering or an equivalent field with 2+ years of relevant engineering experience
Experience performing board level reliability testing including Mechanical Stress Tests, Shock/Drop/Vibration Testing, Environmental Testing
Ability to use fundamental failure analysis methodology to derive root cause of failures, knowledge of failure modes and statistical life data analysis using curve fitting and distributions models
Knowledge of board level design, DFM (Design for Manufacturing) and reliability best practices to guide component selection and placement in early architecture
Strong knowledge of Semiconductor package integration, SLI (Second Level Interconnect) reliability, passive components reliability, bonding materials and warpage control
Ability to apply FMEA (Failure Modes an Effects Analysis) methodologies
Application of DOE (design of Experiments)
Failure Analysis analytical techniques (Optical Microscopy, X-Ray, CSAM, SEM/EDS, FTIR, XPS etc)
Knowledge of industry test Standards (JEDEC, ASTM, IEEE)
Exceptional problem solving abilities, written and verbal communication skills and strong attention to detail
Ability to manage multiple projects at the same time
Dynamic and “can do” attitude with a desire to work with a great team and product
Ability to travel internationally without restrictions

Nice-to-haves

None flagged.

Application prep

Use the role’s language and application details while tailoring your materials.

Platform: apple
Effort: medium