Job description

ABOUT LUMILENS At Lumilens we are building the critical photonics infrastructure that powers tomorrow’s AI supercomputing. From chip-to-chip optical interconnects to scalable photonic engines, Lumilens is unlocking a new era of computing—faster, cooler, and massively more efficient. We’re a well-funded startup backed by Mayfield and led by veterans who’ve built and scaled some of the most transformative technologies in the industry. This isn’t incremental innovation—it’s a ground-floor opportunity to rethink the optical layer from the silicon up. You’ll work alongside a team of world-class engineers solving some of the hardest challenges in optics, systems, and scale. Every line of code, every design decision, every breakthrough you help deliver—will shape the infrastructure of tomorrow. If you're looking for mission, momentum, and the chance to make an outsized impact—jump on the rocket ship. We’re just getting started. POSITION OVERVIEW We are seeking a highly skilled System Application Engineer (Optical) to support next‑generation AI networking platforms and high‑speed optical interconnects. In this role, you will work directly with customers deploying 800G and 1.6T optical transceivers on 51.2T‑class and next‑generation switches. The ideal candidate brings deep expertise in optical transceiver operation, DSP configuration, and AI switch architectures—and thrives at the intersection of applications engineering, customer support, and system integration. KEY RESPONSIBILITIES - Provide expert technical support for 51.2T and next-generation switch architectures, with a strong focus on 800G and 1.6T optical transceivers - Serve as the primary customer-facing technical lead, translating customer requirements into system-level solutions - Debug and resolve complex interoperability issues across AI networking switches, DSPs, and high-speed optical modules - Lead customer demos, evaluations, and hands-on system bring-up, including switch configuration, link validation, and performance tuning - Collaborate cross-functionally with optical, ASIC, hardware, software, mechanical, and thermal engineering teams to ensure seamless product integration - Partner with silicon, EIC, and system teams to support end-to-end bring-up from chip-level to module- and system-level integration - Engage with external ecosystem partners (foundries, ASIC vendors, module partners) to align on technical capabilities, integration, and performance targets - Contribute to industry standards bodies (e.g., MSA) and stay current with emerging trends in AI networking, optical interconnects, and switch architectures - Operate effectively across global teams, driving alignment and execution across multiple geographies REQUIRED QUALIFICATIONS - Master’s degree or higher in Electrical Engineering or a related technical field - Strong understanding of optical transceivers, including architecture, configuration, and performance characteristics - Extensive hands-on experience with DSP bring-up, transceiver configuration, and high-speed link debugging - In-depth familiarity with AI networking switch architectures and Layer 1/Layer 2 configurations - Experience working with 800G optical modules and 51.2T-class switches (1.6T and next-gen systems strongly preferred) - Solid understanding of ASIC architectures and system integration; chip-level and EIC-level experience is a strong plus - Experience interfacing with foundries and understanding semiconductor development and manufacturing flows - Active or prior involvement in industry standards (e.g., MSA participation) is highly desirable - Proven ability to work across cross-functional and geographically distributed teams - Experience building and managing ecosystem partnerships, with the ability to assess and strategically vet partner capabilities - Previous experience at a leading optical transceiver or networking systems company is highly preferred - Excellent analytical, communication, and customer-facing skills, with the ability to translate complex issues into actionable insights - Strong ability to work independently while influencing across complex organizations - Deep experience engaging with CPO/NPO (Co‑Packaged Optics / Near‑Package Optics) architectures, including system tradeoffs, optical/electrical integration considerations, and customer-facing technical discussions. - Background working at the chip level and/or EOC (Embedded Optical Connector / Engine‑On‑Chip) level—translating device‑level constraints into system and platform‑level solutions. - Hands-on experience supporting AI infrastructure deployments, with a focus on scale‑up (intra‑node/interconnect) and scale‑out (cluster/fabric) architectures for high‑performance workloads. - Proven ability to partner with customers and internal teams to map emerging AI workloads to next‑generation optical and interconnect technologies, influencing roadmaps and design wins. BENEFITS: - Competitive salary and significant equity compensation in a rapidly growing, well-funded startup. - Comprehensive health, dental, and vision insurance. - Flexible time off policy. - Direct impact on groundbreaking technology shaping the future of AI and data centers. - Opportunity to work with a highly experienced and collaborative team. - Dynamic and innovative work environment - Opportunity for rapid career growth - All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Requirements

Must-haves

Provide expert technical support for 51.2T and next-generation switch architectures, with a strong focus on 800G and 1.6T optical transceivers
Serve as the primary customer-facing technical lead, translating customer requirements into system-level solutions
Debug and resolve complex interoperability issues across AI networking switches, DSPs, and high-speed optical modules
Lead customer demos, evaluations, and hands-on system bring-up, including switch configuration, link validation, and performance tuning
Collaborate cross-functionally with optical, ASIC, hardware, software, mechanical, and thermal engineering teams to ensure seamless product integration
Partner with silicon, EIC, and system teams to support end-to-end bring-up from chip-level to module- and system-level integration
Engage with external ecosystem partners (foundries, ASIC vendors, module partners) to align on technical capabilities, integration, and performance targets
Contribute to industry standards bodies (e.g., MSA) and stay current with emerging trends in AI networking, optical interconnects, and switch architectures
Operate effectively across global teams, driving alignment and execution across multiple geographies
Master’s degree or higher in Electrical Engineering or a related technical field
Strong understanding of optical transceivers, including architecture, configuration, and performance characteristics
Extensive hands-on experience with DSP bring-up, transceiver configuration, and high-speed link debugging
In-depth familiarity with AI networking switch architectures and Layer 1/Layer 2 configurations
Solid understanding of ASIC architectures and system integration; chip-level and EIC-level experience is a strong plus
Experience interfacing with foundries and understanding semiconductor development and manufacturing flows
Active or prior involvement in industry standards (e.g., MSA participation) is highly desirable
Proven ability to work across cross-functional and geographically distributed teams
Experience building and managing ecosystem partnerships, with the ability to assess and strategically vet partner capabilities
Excellent analytical, communication, and customer-facing skills, with the ability to translate complex issues into actionable insights
Strong ability to work independently while influencing across complex organizations
Deep experience engaging with CPO/NPO (Co‑Packaged Optics / Near‑Package Optics) architectures, including system tradeoffs, optical/electrical integration considerations, and customer-facing technical discussions.
Background working at the chip level and/or EOC (Embedded Optical Connector / Engine‑On‑Chip) level—translating device‑level constraints into system and platform‑level solutions.

Nice-to-haves

Experience working with 800G optical modules and 51.2T-class switches (1.6T and next-gen systems strongly preferred)
Previous experience at a leading optical transceiver or networking systems company is highly preferred

Application prep

Use the role’s language and application details while tailoring your materials.

Keywords to mirror

Platform: ashby
Effort: quick

Benefits

Benefits detected in the listing.

Dental

Vision