Job description

Anduril Industries is a defense technology company with a mission to transform U.S. and allied military capabilities with advanced technology. By bringing the expertise, technology, and business model of the 21st century’s most innovative companies to the defense industry, Anduril is changing how military systems are designed, built and sold. Anduril’s family of systems is powered by Lattice OS, an AI-powered operating system that turns thousands of data streams into a realtime, 3D command and control center. As the world enters an era of strategic competition, Anduril is committed to bringing cutting-edge autonomy, AI, computer vision, sensor fusion, and networking technology to the military in months, not years. ABOUT THE TEAM Connected Warfare is the team at Anduril dedicated to the modernization of the command and control systems of U.S. and Allied forces. New technologies and new adversaries demand a new approach to battlefield intelligence, and you will be the driving force behind the integration of cutting-edge compute and communications technologies that make that approach a reality. You'll design the ruggedized, small form-factor enclosures that keep advanced electronics alive through shock, vibration, thermal extremes, and the dirt and water of the real battlefield. If you possess a pioneering spirit and a record of excellence in electronics packaging and mechanical design, join us in shaping the future of military might. Your work will not only create new products but also change the balance of defense capabilities on a global scale. Apply now and become a vital part of our mission to secure a safer tomorrow. WHAT YOU'LL DO Own ruggedized compute and communications hardware from concept generation to real-world use in the field Serve as a key part of a tight-knit product team, spanning electrical, thermal, manufacturing, quality and industrial design Work with customers to understand real battlefield challenges Design novel enclosures, cooling solutions, and PCBAs for those mission sets — from the ground up Solve the hard packaging problems: thermal management, shock and vibration isolation, environmental sealing (IP/ingress), EMI/EMC shielding, and dense component integration in small form factors Use engineering first-principles, analysis, and testing to ensure your designs survive battlefield conditions and meet standards such as MIL-STD-810 and MIL-STD-461 Get hands-on to build prototypes and first articles Travel to exercises and work alongside warfighters to support and collect feedback on our products Iterate on your designs and work with our manufacturing team to build and deliver them at scale REQUIRED QUALIFICATIONS Demonstrated ability to design, prototype, and ship ruggedized electronics hardware Past record of design ownership in a team setting (professional or otherwise), ideally on enclosures or electromechanical packaging High competence with, and fluid use of, engineering first principles 7+ years of professional mechanical engineering experience Hands-on experience packaging electronics for harsh environments — managing thermal, shock, vibration, sealing, and EMI constraints Familiarity with tolerance stack-up analysis and design for high-volume manufacturing CAD skills (any platform) and the ability to produce high-quality, GD&T-driven engineering drawings Experience with high volume manufacturing methods: machining, sheet metal, injection molding, die casting, composites, etc. Demonstrated hands-on fabrication skills BS, M.Eng, MS, or PhD in an engineering field Must be a U.S. Person due to required access to U.S. export controlled information or facilities PREFERRED QUALIFICATIONS Experience in NX/Teamcenter Experience designing to and testing against MIL-STD-810 (environmental) and MIL-STD-461 (EMI/EMC) Knowledge of static, dynamic, thermal, or structural analysis methods in ANSYS Active Secret security clearance or the ability to obtain and maintain one US Salary Range $151,000 — $189,000 USD The salary range for this role is an estimate based on a wide range of compensation factors, inclusive of base salary only. Actual salary offer may vary based on (but not limited to) work experience, education and/or training, critical skills, and/or business considerations. Highly competitive equity grants are included in the majority of full time offers; and are considered part of Anduril's total compensation package. Additionally, Anduril offers top-tier benefits for full-time employees, including: Benefits At Anduril, we invest in our people. Our comprehensive, competitive benefits package (available at little to no cost to employees) ensures you’re supported in health, recovery, and whatever comes next. For more information, Explore Our Benefits . Protecting Yourself from Recruitment Scams Anduril is committed to maintaining the integrity of our Talent acquisition process and the security of our candidates. We've observed a rise in sophisticated phishing and fraudulent schemes where individuals impersonate Anduril representatives, luring job seekers with false interviews or job offers. These scammers often attempt to extract payment or sensitive personal information. To ensure your safety and help you navigate your job search with confidence, please keep the following critical points in mind: No Financial Requests: Anduril will never solicit payment or demand personal financial details (such as banking information, credit card numbers, or social security numbers) at any stage of our hiring process. Our legitimate recruitment is entirely free for candidates. Please always verify communications: Direct from Anduril: If you receive an email from one of our recruiters, it will only come from an @anduril.com address. Via Agency Partner: If contacted by a recruiting agency for an Anduril role, their email will clearly identify their agency. If you suspect any suspicious activity, please verify the agency's authenticity by reaching out to contact@anduril.com . Exercise Caution with Unsolicited Outreach: If you receive any communication that appears suspicious, contains grammatical errors, or makes unusual requests, do not engage. Always confirm the sender's email domain is @anduril.com before providing any personal information or clicking on links. What to Do If You Suspect Fraud: Should you encounter any questionable or fraudulent outreach claiming to be from Anduril, please report it immediately to contact@anduril.com . Your proactive caution is invaluable in protecting your personal information and upholding the security and trustworthiness of our recruitment efforts. Data Privacy To view Anduril's candidate data privacy policy, please visit anduril.com . By submitting your application, you consent to Anduril Industries using a third-party service provider to conduct pre-employment risk, integrity, and due diligence screening and assessing potential risks as part of your application process. This third-party service provider provides risk-intelligence services that may include analysis of sanctions and watchlists, adverse media, public-record information, and other lawful open-source or commercial data sources. This third-party service provider does not act as a consumer reporting agency. Use of this provider helps to ensure compliance with applicable laws and protect technology, intellectual property, and organizational security.

Requirements

Must-haves

Own ruggedized compute and communications hardware from concept generation to real-world use in the field
Serve as a key part of a tight-knit product team, spanning electrical, thermal, manufacturing, quality and industrial design
Work with customers to understand real battlefield challenges
Design novel enclosures, cooling solutions, and PCBAs for those mission sets — from the ground up
Solve the hard packaging problems: thermal management, shock and vibration isolation, environmental sealing (IP/ingress), EMI/EMC shielding, and dense component integration in small form factors
Use engineering first-principles, analysis, and testing to ensure your designs survive battlefield conditions and meet standards such as MIL-STD-810 and MIL-STD-461
Get hands-on to build prototypes and first articles
Travel to exercises and work alongside warfighters to support and collect feedback on our products
Iterate on your designs and work with our manufacturing team to build and deliver them at scale
Demonstrated ability to design, prototype, and ship ruggedized electronics hardware
Past record of design ownership in a team setting (professional or otherwise), ideally on enclosures or electromechanical packaging
High competence with, and fluid use of, engineering first principles
7+ years of professional mechanical engineering experience
Hands-on experience packaging electronics for harsh environments — managing thermal, shock, vibration, sealing, and EMI constraints
Familiarity with tolerance stack-up analysis and design for high-volume manufacturing
CAD skills (any platform) and the ability to produce high-quality, GD&T-driven engineering drawings
Experience with high volume manufacturing methods: machining, sheet metal, injection molding, die casting, composites, etc.
Demonstrated hands-on fabrication skills
BS, M.Eng, MS, or PhD in an engineering field
Must be a U.S. Person due to required access to U.S. export controlled information or facilities

Nice-to-haves

Experience in NX/Teamcenter
Experience designing to and testing against MIL-STD-810 (environmental) and MIL-STD-461 (EMI/EMC)
Knowledge of static, dynamic, thermal, or structural analysis methods in ANSYS
Active Secret security clearance or the ability to obtain and maintain one

Application prep

Use the role’s language and application details while tailoring your materials.

Keywords to mirror

Platform: greenhouse
Effort: quick

Benefits

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