Job description

Requisition ID: 114074-0 Principal Design Engineer- PCBA Liquid Cooling Design Job Summary We are seeking a highly skilled PCBA Liquid Cooling Design Engineer to lead the development of innovative thermal management systems for advanced electronic assemblies. In this role, you will design direct-to-chip cold plates, custom fluid loops, and micro-channel systems that sit directly on high-density PCBAs. You will collaborate closely with hardware layout designers and manufacturing partners to build reliable, leak-free, and highly efficient cooling architectures. Key Responsibilities  Thermal Solution Design: Architect and engineer board-level liquid cooling systems, including direct-to-chip cold plates, manifolds, and custom fittings.  Simulation & Analysis: Perform Computational Fluid Dynamics (CFD) and Finite Element Analysis (FEA) using tools like Ansys Icepak, FloTherm, or Fluent to predict fluid dynamics, pressure drops, and thermal resistance.  Component Integration: Select and specify critical loop components such as pumps, quick-disconnect valves, hoses, and leak detection sensors.  PCBA Cross-Collaboration: Partner with PCB layout engineers to optimize component placement, layout thickness, and copper weight for maximum thermal dissipation.  Prototyping & Testing: Set up and execute hardware-level thermal validation tests, including hydrostatic pressure, leak/decay verification, and environmental chamber cycling.  Failure Analysis: Conduct root-cause analysis on structural stress, thermal throttling, galvanic corrosion, and fluid degradation.  DFM Optimization: Ensure designs comply with Design for Manufacturing (DFM) requirements to guarantee scalable assembly and fluid charging processes on the production line. Required Technical Skills  CAD Software: Proficiency in 3D modeling tools like SolidWorks, PTC Creo, or Siemens NX for physical integration.  CFD/FEA Tools: Advanced skills in thermal simulation software such as Ansys Icepak, FloTherm, or SimScale.  PCBA Familiarity: Practical knowledge of PCB fabrication, electronic component layouts, and standard testing tools like oscilloscopes and multimeters.  Fluid Dynamics & Metallurgy: Strong grasp of single-phase/two-phase heat transfer, fluid flow behavior, and material compatibility (e.g., copper-to-coolant interactions).  Lab Equipment: Experience with flow meters, thermocouples, pressure transducers, and data acquisition (DAQ) systems. Qualifications  Education: Masters degree in Mechanical Engineering, Thermal Engineering, or a highly related technical field.  Experience: 3+ years of experience specifically focused on electronic cooling, liquid loops, or data center thermal design.  Standards: Familiarity with international standards governing pressure vessels and electronics cooling, such as ASME, ISO, and ASHRAE guidelines. Preferred Qualifications  Experience designing cooling for AI hardware clusters, high-performance computing (HPC) environments, or EV power electronics.  In-depth understanding of immersion cooling or phase-change cooling mechanisms.

Requirements

Must-haves

Requisition ID: 114074-0
Principal Design Engineer- PCBA Liquid Cooling Design
 Thermal Solution Design: Architect and engineer board-level liquid cooling systems, including direct-to-chip cold plates, manifolds, and custom fittings.
 Simulation & Analysis: Perform Computational Fluid Dynamics (CFD) and Finite Element Analysis (FEA) using tools like Ansys Icepak, FloTherm, or Fluent to predict fluid dynamics, pressure drops, and thermal resistance.
 Component Integration: Select and specify critical loop components such as pumps, quick-disconnect valves, hoses, and leak detection sensors.
 PCBA Cross-Collaboration: Partner with PCB layout engineers to optimize component placement, layout thickness, and copper weight for maximum thermal dissipation.
 Prototyping & Testing: Set up and execute hardware-level thermal validation tests, including hydrostatic pressure, leak/decay verification, and environmental chamber cycling.
 Failure Analysis: Conduct root-cause analysis on structural stress, thermal throttling, galvanic corrosion, and fluid degradation.
 DFM Optimization: Ensure designs comply with Design for Manufacturing (DFM) requirements to guarantee scalable assembly and fluid charging processes on the production line.
Required Technical Skills
 CAD Software: Proficiency in 3D modeling tools like SolidWorks, PTC Creo, or Siemens NX for physical integration.
 CFD/FEA Tools: Advanced skills in thermal simulation software such as Ansys Icepak, FloTherm, or SimScale.
 PCBA Familiarity: Practical knowledge of PCB fabrication, electronic component layouts, and standard testing tools like oscilloscopes and multimeters.
 Fluid Dynamics & Metallurgy: Strong grasp of single-phase/two-phase heat transfer, fluid flow behavior, and material compatibility (e.g., copper-to-coolant interactions).
 Lab Equipment: Experience with flow meters, thermocouples, pressure transducers, and data acquisition (DAQ) systems.
 Education: Masters degree in Mechanical Engineering, Thermal Engineering, or a highly related technical field.
 Experience: 3+ years of experience specifically focused on electronic cooling, liquid loops, or data center thermal design.
 Standards: Familiarity with international standards governing pressure vessels and electronics cooling, such as ASME, ISO, and ASHRAE guidelines.

Nice-to-haves

 Experience designing cooling for AI hardware clusters, high-performance computing (HPC) environments, or EV power electronics.
 In-depth understanding of immersion cooling or phase-change cooling mechanisms.

Application prep

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Keywords to mirror

Platform: sanmina
Effort: medium