Job description

Meta is seeking a lead CAD and integration engineer to shape the methodology and physical implementation infrastructure for our custom silicon programs. Working at the intersection of circuit design, digital implementation, and physical verification, you will define and own the CAD flows that take designs from RTL and schematic intent through to foundry-ready GDS deliverables. You will establish best practices across synthesis, place-and-route, analog mixed-signal integration, and physical signoff, while building automation frameworks and integrating AI-assisted design tools to accelerate engineering velocity across the silicon team. Define and own end-to-end digital implementation methodology including RTL-to-GDS flows, synthesis, place-and-route, DFT insertion, and multi-corner physical signoff Lead analog mixed-signal physical integration strategy, establishing constraint authoring, floorplanning guidelines, and interface protocols between custom and digital domains Develop and maintain CAD automation infrastructure using Python, SKILL, and Tcl to reduce manual effort across implementation, tapeout, and regression workflows Integrate AI and LLM-assisted coding tools into CAD methodology to improve design automation productivity across the silicon engineering organization Drive physical signoff convergence across timing, power, noise, and design rule checks to produce foundry-ready deliverables on schedule Establish 3D integration and heterogeneous packaging flows including die-to-die interface planning, cross-die timing closure, and bump/interposer constraint management Partner with foundry contacts on PDK qualification, design rule interpretation, and process design kit updates for leading-edge technology nodes Define low-power implementation methodology including multi-voltage domain integration, UPF-based power intent authoring, and power analysis signoff Provide technical direction to other engineers on CAD methodology decisions, flow architecture, and implementation best practices across multiple concurrent tapeout programs Communicate implementation status, methodology decisions, and risk assessments to circuit designers, layout engineers, and program leadership Bachelor's degree in Computer Science, Computer Engineering, relevant technical field, or equivalent practical experience 8+ years of industry experience in VLSI CAD, physical implementation, or silicon design methodology across multiple technology nodes and tapeouts Expertise in full RTL-to-GDS digital implementation flows including synthesis, place-and-route, DFT, and multi-corner physical signoff using industry-standard EDA tools Experience with analog mixed-signal physical integration including constraint authoring, floorplan coordination, and interface management between custom and digital design domains Proficiency in scripting and automation using Python, SKILL, Tcl, or equivalent languages to build and maintain CAD flow infrastructure Experience communicating methodology decisions, tapeout risk, and implementation status to cross-functional partners including circuit designers, layout engineers, and foundry contacts Experience with 3D stacking or advanced packaging flows including die-to-die interface planning, cross-die timing analysis, and heterogeneous integration methodology Experience with PDK qualification and design rule development in direct collaboration with foundry partners on leading-edge process nodes Background in low-power design methodology including UPF-based power intent, multi-voltage domain integration, and power signoff for mobile or wearable silicon applications Familiarity with AI-assisted design tools or LLM-based coding assistants applied to CAD automation or implementation flow development

Requirements

Requirements not extracted — see the original description below.

Application prep

Use the role’s language and application details while tailoring your materials.

Keywords to mirror

aipythonllm

Platform: meta
Effort: medium