Job description

Google's custom-designed machines make up one of the largest and most powerful computing infrastructures in the world. The Hardware Testing Engineering team ensures that this cutting-edge equipment is reliable. In the R&D lab, you design test equipment for prototypes of our machinery and develop the protocols used to scale these tests for the entire global team. Working closely with design engineers, you give input on designs to improve our hardware until you're sure it meets Google's standards of quality and reliability. The Quantum Device Backend team is responsible for delivering the highest quality quantum processors to packaging. This includes die leveling cleaning, imaging die, inspecting die, hybridize devices, and post measurement after hybridization. Our team provides die preparation and device build services and also focuses on developing robust bump bonding processes. You will work as part of the backend team and be responsible for delivering the highest quality quantum processors to packaging. Your backend processing responsibilities will include die preparation and cleaning, imaging and inspecting dies, documenting defect types, generating die defect reports, and managing die and device inventory. Additionally, you will hybridize devices using a flip chip bump bonder, measure post-hybridization parameters like alignment and chip gap, and work closely with backend engineers to develop die preparation and hybridization processes while strictly following cleanroom and safety protocols. The full potential of quantum computing will be unlocked with a large-scale computer capable of complex, error-corrected computations. Google Quantum AI's mission is to build this computer and unlock solutions to classically intractable problems. Our roadmap is focused on advancing the capabilities of quantum computing and enabling meaningful applications.Individual pay is determined by factors including job-related skills, experience, and relevant education or training. US: $99000 - $140000 (USD) + 15% bonus target + equity + benefits Learn more about benefits at Google . • Clean, image dies for Quantum device builds, perform die inspection, and generate die defect report and Inspect die images and document defect type. • Manage die and device inventory and hybridize devices with flip chip bump bonder. • Measure post hybridization parameters. • Work with backend engineers closely to develop robust backend process. • Follow cleanroom/safety protocols. • Associate's degree, trade school certification, other verifiable training in a relevant technical field, or equivalent practical experience. • 3 years of experience working in a clean room environment. • 3 years of experience with microfabrication equipment and processes. • 3 years of experience with photoresist stripping, optical inspection equipment, profiler, and die handling. • 3 years of experience handling Silicon (Si) wafers or similar substrate form factors. Minimum qualifications: • Associate's degree, trade school certification, other verifiable training in a relevant technical field, or equivalent practical experience. • 3 years of experience working in a clean room environment. • 3 years of experience with microfabrication equipment and processes. • 3 years of experience with photoresist stripping, optical inspection equipment, profiler, and die handling. • 3 years of experience handling Silicon (Si) wafers or similar substrate form factors. Preferred qualifications: • Experience with flip chip bonder or die cleaning process. • Experience with inventory management. • Experience using a MES system. • Proficiency in Google Sheets/Docs/Slides or similar applications.

Requirements

Must-haves

Learn more about benefits at Google .
Clean, image dies for Quantum device builds, perform die inspection, and generate die defect report and Inspect die images and document defect type.
Manage die and device inventory and hybridize devices with flip chip bump bonder.
Measure post hybridization parameters.
Work with backend engineers closely to develop robust backend process.
Follow cleanroom/safety protocols.
Associate's degree, trade school certification, other verifiable training in a relevant technical field, or equivalent practical experience.
3 years of experience working in a clean room environment.
3 years of experience with microfabrication equipment and processes.
3 years of experience with photoresist stripping, optical inspection equipment, profiler, and die handling.
3 years of experience handling Silicon (Si) wafers or similar substrate form factors.
Associate's degree, trade school certification, other verifiable training in a relevant technical field, or equivalent practical experience.
3 years of experience working in a clean room environment.
3 years of experience with microfabrication equipment and processes.
3 years of experience with photoresist stripping, optical inspection equipment, profiler, and die handling.
3 years of experience handling Silicon (Si) wafers or similar substrate form factors.

Nice-to-haves

US: $99000 - $140000 (USD) + 15% bonus target + equity + benefits
Experience with flip chip bonder or die cleaning process.
Experience with inventory management.
Experience using a MES system.
Proficiency in Google Sheets/Docs/Slides or similar applications.

Application prep

Use the role’s language and application details while tailoring your materials.

Keywords to mirror

Platform: google
Effort: medium