Job description

L3Harris is dedicated to recruiting and developing high-performing talent who are passionate about what they do. Our employees are unified in a shared dedication to our customers’ mission and quest for professional growth. L3Harris provides an inclusive, engaging environment designed to empower employees and promote work-life success. Fundamental to our culture is an unwavering focus on values, dedication to our communities, and commitment to excellence in everything we do. L3Harris is the Trusted Disruptor in defense tech. With customers’ mission-critical needs always in mind, our employees deliver end-to-end technology solutions connecting the space, air, land, sea and cyber domains in the interest of national security. Job Title: Lead, PCB Design – Signal Integrity/Stackup Specialist Job Code: 46234 Job Location: Palm Bay, FL, Carlsbad, CA or Herndon, VA Job Schedule: 9/80: Employees work 9 out of every 14 days – totaling 80 hours worked, and have every other Friday off Job Description: L3Harris has an immediate need for a Signal Integrity/Stackup PCB Design Specialist whose role defines and optimizes rigid, rigid-flex, and multilayer PCB stackups for signal integrity, power integrity, impedance control, EMI/EMC, thermal performance, and fabrication constraints. You will work closely with electrical, RF, mechanical, layout, and manufacturing teams to translate CCA requirements into practical, production-ready signal integrity and board-layer strategies. This is a hands-on PCB design role with particular ownership of stackup definition, impedance planning, and stackup-related layout guidance. Team members will collaborate closely with electrical engineers, mechanical engineers, and manufacturing teams to ensure high-quality, reliable designs that meet performance and cost objectives. Essential Functions: • Design and document rigid, rigid-flex, and multilayer PCB stackups for high-speed, mixed-signal, RF, and power applications. • Define controlled-impedance structures, dielectric materials, copper weights, layer assignments, and via strategies. • Partner with electrical engineers to translate Signal Integrity(SI)/Power Integrity(PI) requirements into practical routing rules, return-path planning, reference-plane strategy, grounding, shielding, and layer-transition guidance. • Evaluate stackup tradeoffs across electrical performance, EMI/EMC, thermal needs, mechanical requirements, cost, and manufacturability. • Collaborate with PCB fabricators to validate materials, impedance coupons, fabrication tolerances, bend-region constraints, and production capability. • Review PCB layouts and fabrication packages for stackup-related risks and provide clear corrective guidance. • Maintain stackup drawings, impedance tables, fabrication notes, material specifications, and revision history. • Support prototype and production issue resolution involving impedance, crosstalk, loss, resonance, warpage, or EMI. • Developing rigid, rigid-flex, and multilayer PCB stackups for high-speed, RF, mixed-signal, or high-power products. • Strong understanding of controlled impedance, transmission lines, return paths, dielectric properties, copper roughness, insertion loss, and crosstalk. • Developing stackup requirements to PCB layout, including layer usage, differential-pair routing, via transitions, reference planes, and high-speed design constraints. • Knowledge of rigid and rigid-flex PCB fabrication processes, materials, bend-region constraints, and manufacturer • Work directly with PCB fabricators and clearly communicating stackup, impedance, and material requirements. Required Qualifications: • Bachelor’s Degree and minimum 9 years of prior relevant experience. Graduate Degree and a minimum of 7 years of prior related experience. In lieu of a degree, minimum of 13 years of prior related experience. Preferred Additional Skills: • Proficiency with Siemens Xpedition PCB design or experience with similar tools. • Experience using Siemens HyperLynx Z-planner for PCB stackup design. • Experience with DDR, PCIe, USB, Ethernet, SerDes, RF, or high-current power-delivery designs. • Cadence Allegro and Altium PCB experience. • Experience designing multilayer printed circuit boards for radio-frequency or mixed-signal applications. • Familiarity with Design for Manufacturability (DFM) and Design for Testability (DFT) principles. • Experience with three-dimensional mechanical integration and electromagnetic-compatibility considerations. • Familiarity with product lifecycle management (PLM) systems and engineering configuration-control processes. • IPC Certified Interconnect Designer (CID/CID+) In compliance with pay transparency requirements, the salary range for this role in California and in Virginia - Greater Washington, D.C. area is $110,500- $205,000 . This is not a guarantee of compensation or salary, as final offer amount may vary based on factors including but not limited to experience and geographic location. L3Harris also offers a variety of benefits, including health and disability insurance, 401(k) match, flexible spending accounts, EAP, education assistance, parental leave, paid time off, and company-paid holidays. The specific programs and options available to an employee L3Harris Technologies is proud to be an Equal Opportunity Employer. L3Harris is committed to treating all employees and applicants for employment with respect and dignity and maintaining a workplace that is free from unlawful discrimination. All applicants will be considered for employment without regard to race, color, religion, age, national origin, ancestry, ethnicity, gender (including pregnancy, childbirth, breastfeeding or other related medical conditions), gender identity, gender expression, sexual orientation, marital status, veteran status, disability, genetic information, citizenship status, characteristic or membership in any other group protected by federal, state or local laws. L3Harris maintains a drug-free workplace and performs pre-employment substance abuse testing and background checks, where permitted by law. Please be aware many of our positions require the ability to obtain a security clearance. Security clearances may only be granted to U.S. citizens. In addition, applicants who accept a conditional offer of employment may be subject to government security investigation(s) and must meet eligibility requirements for access to classified information. By submitting your resume for this position, you understand and agree that L3Harris Technologies may share your resume, as well as any other related personal information or documentation you provide, with its subsidiaries and affiliated companies for the purpose of considering you for other available positions. L3Harris Technologies is an E-Verify Employer. Please click here for the E-Verify Poster in English or Spanish . For information regarding your Right To Work, please click here for English or Spanish .

Requirements

Must-haves

Job Title: Lead, PCB Design – Signal Integrity/Stackup Specialist
Job Code: 46234
Job Location: Palm Bay, FL, Carlsbad, CA or Herndon, VA
Job Schedule: 9/80: Employees work 9 out of every 14 days – totaling 80 hours worked, and have every other Friday off
Design and document rigid, rigid-flex, and multilayer PCB stackups for high-speed, mixed-signal, RF, and power applications.
Define controlled-impedance structures, dielectric materials, copper weights, layer assignments, and via strategies.
Evaluate stackup tradeoffs across electrical performance, EMI/EMC, thermal needs, mechanical requirements, cost, and manufacturability.
Collaborate with PCB fabricators to validate materials, impedance coupons, fabrication tolerances, bend-region constraints, and production capability.
Review PCB layouts and fabrication packages for stackup-related risks and provide clear corrective guidance.
Maintain stackup drawings, impedance tables, fabrication notes, material specifications, and revision history.
Support prototype and production issue resolution involving impedance, crosstalk, loss, resonance, warpage, or EMI.
Developing rigid, rigid-flex, and multilayer PCB stackups for high-speed, RF, mixed-signal, or high-power products.
Strong understanding of controlled impedance, transmission lines, return paths, dielectric properties, copper roughness, insertion loss, and crosstalk.
Developing stackup requirements to PCB layout, including layer usage, differential-pair routing, via transitions, reference planes, and high-speed design constraints.
Knowledge of rigid and rigid-flex PCB fabrication processes, materials, bend-region constraints, and manufacturer
Work directly with PCB fabricators and clearly communicating stackup, impedance, and material requirements.
Bachelor’s Degree and minimum 9 years of prior relevant experience. Graduate Degree and a minimum of 7 years of prior related experience. In lieu of a degree, minimum of 13 years of prior related experience.
Proficiency with Siemens Xpedition PCB design or experience with similar tools.
Experience using Siemens HyperLynx Z-planner for PCB stackup design.
Experience with DDR, PCIe, USB, Ethernet, SerDes, RF, or high-current power-delivery designs.
Cadence Allegro and Altium PCB experience.
Experience designing multilayer printed circuit boards for radio-frequency or mixed-signal applications.
Familiarity with Design for Manufacturability (DFM) and Design for Testability (DFT) principles.
Experience with three-dimensional mechanical integration and electromagnetic-compatibility considerations.

Nice-to-haves

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Application prep

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Platform: career-feeds
Effort: medium

Benefits

Benefits detected in the listing.

Vision

401(K)

Pto

Paid Time Off

Parental Leave