Job description

We are seeking an experienced Principal Process Technology Engineer to provide technical leadership in semiconductor device and process technology development and product enablement. This role will collaborate with foundry partners and Design, Product Engineering, Reliability, Packaging, and Operations teams to ensure successful product tape-outs and production ramps. The ideal candidate has deep expertise in semiconductor device physics, process and device development, and characterization, and can translate technology capabilities and limitations into practical guidance for circuit and product development. Key Responsibilities • Serve as the technical interface with foundry partners, driving device and process development, qualification, reliability, and continuous improvement. • Lead device and modeling test-chip tape-outs, characterization, and analysis. • Lead risk-reduction and enablement activities for new technologies and product development. • Drive collaboration across Design, Product Engineering, Packaging, Reliability, and Operations teams. • Provide technical guidance to design teams throughout development and tape-out. • Benchmark technology platforms for competitiveness and alignment with product and business requirements. • MS or PhD in Electrical Engineering, Physics, Materials Science, or a related field, with 10+ years of semiconductor industry experience. • Strong understanding of CMOS and BCD process integration, device physics, and reliability. • Extensive experience working with semiconductor foundries and BCD technologies; advanced-node experience is a plus. • Experience with PDKs, SPICE models, and device simulation. • Experience with device and modeling test-chip tape-outs and characterization using semiconductor parameter analyzers, power device analyzers, and TLP systems. • Excellent cross-functional communication skills, with a proven ability to align stakeholders and resolve complex technical challenges. The expected annual pay range for this position is $198K-$245K. This position is also eligible for bonus opportunities. Please note that final offer amount will be dependent on geographic location, applicable experience, and skillset of the candidate. we put in the additional information Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier . With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future. At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives. We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process. Are you ready to join our team and shape the future with us? Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement . Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.

Requirements

Must-haves

Serve as the technical interface with foundry partners, driving device and process development, qualification, reliability, and continuous improvement.
Lead device and modeling test-chip tape-outs, characterization, and analysis.
Lead risk-reduction and enablement activities for new technologies and product development.
Drive collaboration across Design, Product Engineering, Packaging, Reliability, and Operations teams.
Provide technical guidance to design teams throughout development and tape-out.
Benchmark technology platforms for competitiveness and alignment with product and business requirements.
MS or PhD in Electrical Engineering, Physics, Materials Science, or a related field, with 10+ years of semiconductor industry experience.
Strong understanding of CMOS and BCD process integration, device physics, and reliability.
Experience with PDKs, SPICE models, and device simulation.
Experience with device and modeling test-chip tape-outs and characterization using semiconductor parameter analyzers, power device analyzers, and TLP systems.
Excellent cross-functional communication skills, with a proven ability to align stakeholders and resolve complex technical challenges.
We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.
Are you ready to join our team and shape the future with us?

Nice-to-haves

Extensive experience working with semiconductor foundries and BCD technologies; advanced-node experience is a plus.

Application prep

Use the role’s language and application details while tailoring your materials.

Keywords to mirror

agile

Platform: smartrecruiters
Effort: medium