Job description

As a Principal Product Engineer on our Hi-Reliability team in Palm Bay, Florida, you'll apply your semiconductor expertise to develop and deliver high-reliability ICs for space and harsh environments. Lead projects from development through NPI, characterization, qualification, manufacturing readiness, and production release. Collaborate with cross-disciplinary experts in design, test, reliability, packaging, radiation effects, and manufacturing to solve complex challenges, drive continuous improvement, and ensure the delivery of reliable, manufacturable semiconductor solutions. Responsibilities • Lead Product Engineering activities for new ICs from initial silicon through characterization, qualification, production readiness, and release. • Coordinate product engineering activities across IC design, test, applications, packaging, reliability, radiation effects, assembly, and manufacturing teams. • Plan and execute IC characterization to evaluate electrical performance and product requirements. • Analyze characterization, test, yield, and production data to identify trends, performance margins, risks, and improvement opportunities. • Use data-driven analysis to support product decisions and investigate performance, yield, quality, reliability, and manufacturability issues. • Partner with Test Engineering on characterization, production test strategy, ATE activities, correlation, and product readiness. • Support investigation and root-cause analysis of complex product and manufacturing issues. • Contribute to product specifications, qualification activities, test requirements, and release criteria. • Identify opportunities to improve NPI execution, characterization, data analysis, yield, and product release processes. • Communicate technical findings, risks, and recommendations across engineering teams and project stakeholders. Required • Bachelor's degree in Electrical Engineering. • 10+ years of experience executing new product development within the semiconductor industry. • Strong semiconductor/IC experience. • Experience with Product Engineering and semiconductor new product introduction (NPI). • Experience with IC characterization and evaluation of product performance. • Strong data analysis capability, including interpretation of characterization, test, yield, production, or other semiconductor product data. • Strong problem-solving, communication, and cross-functional collaboration skills. Preferred • Radiation-hardened IC or radiation-effects experience. • Space, high-reliability, or harsh-environment semiconductor experience. • Familiarity with MIL-PRF-38535 or related high-reliability semiconductor standards. • Experience with semiconductor Automated Test Equipment (ATE). • Experience with ATE platforms such as Advantest V93K, Teradyne UltraFLEX/microFLEX, ETS-64, or similar systems. • Experience with bench testing, IC debug, silicon bring-up, or electrical validation. • Experience with bench-to-ATE correlation or production test correlation. • Experience using JMP, Spotfire, Python, or similar statistical/data-analysis tools. • Experience with analog, mixed-signal, power management, or other complex IC technologies. • Previous technical leadership, mentoring, or cross-functional technical ownership experience. • Master's degree in Electrical Engineering. Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier . With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future. At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives. We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process. Are you ready to join our team and shape the future with us? Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement . Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.

Requirements

Must-haves

Lead Product Engineering activities for new ICs from initial silicon through characterization, qualification, production readiness, and release.
Coordinate product engineering activities across IC design, test, applications, packaging, reliability, radiation effects, assembly, and manufacturing teams.
Plan and execute IC characterization to evaluate electrical performance and product requirements.
Analyze characterization, test, yield, and production data to identify trends, performance margins, risks, and improvement opportunities.
Use data-driven analysis to support product decisions and investigate performance, yield, quality, reliability, and manufacturability issues.
Partner with Test Engineering on characterization, production test strategy, ATE activities, correlation, and product readiness.
Support investigation and root-cause analysis of complex product and manufacturing issues.
Contribute to product specifications, qualification activities, test requirements, and release criteria.
Identify opportunities to improve NPI execution, characterization, data analysis, yield, and product release processes.
Communicate technical findings, risks, and recommendations across engineering teams and project stakeholders.
Bachelor's degree in Electrical Engineering.
10+ years of experience executing new product development within the semiconductor industry.

Nice-to-haves

Radiation-hardened IC or radiation-effects experience.
Space, high-reliability, or harsh-environment semiconductor experience.
Familiarity with MIL-PRF-38535 or related high-reliability semiconductor standards.
Experience with semiconductor Automated Test Equipment (ATE).
Experience with ATE platforms such as Advantest V93K, Teradyne UltraFLEX/microFLEX, ETS-64, or similar systems.
Experience with bench testing, IC debug, silicon bring-up, or electrical validation.
Experience with bench-to-ATE correlation or production test correlation.
Experience using JMP, Spotfire, Python, or similar statistical/data-analysis tools.
Experience with analog, mixed-signal, power management, or other complex IC technologies.
Previous technical leadership, mentoring, or cross-functional technical ownership experience.
Master's degree in Electrical Engineering.
We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

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