Job description

Company: Qualcomm Technologies, Inc. Job Area: Engineering Group, Engineering Group > Packaging Engineering General Summary: The Qualcomm Central Hardware Systems (CHS) team is seeking a Senior Leader, Electrical Systems Architect to define, develop, and productize next-generation high-speed electrical interconnect technologies for AI, hyperscale datacenter, networking, and HPC platforms. The successful candidate will be a recognized technical leader with deep expertise in 224G/448G PAM4 signaling, SerDes architectures, Signal Integrity (SI), Power Integrity (PI), advanced packaging, PCB design, connector technologies, and end-to-end electrical system analysis . This role will drive architecture and technology decisions spanning silicon, package, PCB, power delivery networks, connectors, cables, CPC/NPC flyover solutions, and rack-scale systems. Key Responsibilities • Define and drive end-to-end architecture for next-generation 224G and 448G PAM4 electrical interconnect systems , including SerDes, package, PCB, connector, cable, CPC, NPC, flyover, and rack-scale connectivity solutions. • Lead system-level Signal Integrity (SI) and Power Integrity (PI) strategy, including channel budgeting, COM analysis, insertion loss, return loss, jitter, crosstalk, PDN design, and simulation-to-silicon correlation. • Drive architecture, modeling, and optimization of high-speed link technologies spanning PHY/SerDes architectures, equalization techniques, FEC, channel operating margins, and system performance tradeoffs across bandwidth, reach, power, latency, and reliability. • Partner across silicon, package, board, power, and system teams to develop and productize advanced electrical connectivity solutions leveraging advanced packaging, CPC/NPC flyover architectures, and next-generation PCB technologies . • Provide technical leadership for future interconnect roadmaps, enabling scalable AI infrastructure through innovations in 224G/448G signaling, SI/PI methodologies, heterogeneous integration, and end-to-end electrical system design . Required: • MS or PhD in Electrical Engineering, Computer Engineering, Physics, or related discipline. • 15+ years of experience developing high-speed communication, networking, or datacenter infrastructure products. • Demonstrated success productizing 112G and/or 224G PAM4 electrical communication systems . Technical Expertise Deep expertise in: • High-speed SerDes architectures • PAM4 communication systems • Signal Integrity (SI) • Power Integrity (PI) • Package, PCB, connector, and cable design • Power delivery network architecture • Advanced packaging technologies • Channel modeling and compliance methodologies • End-to-end electrical system architecture • AI networking, scale-up, and scale-out infrastructures Hands-on experience with: ADS, HFSS, CST, HSPICE, MATLAB, Python, Cadence Sigrity, PowerSI, Clarity, SystemVerilog, Verilog-A, COM analysis tools, IBIS-AMI modeling Preferred Qualifications • Experience developing and productizing 224G+ and 448G electrical interconnect solutions . • Experience with CPC, NPC, copper flyover architectures, AECs, advanced package substrates, and next-generation PCB technologies . • Familiarity with Ethernet, PCIe, UALink, NVLink, OIF CEI, IEEE 802.3, and AI networking fabrics . • Experience with chiplets, UCIe, heterogeneous integration, EIC/PIC interfaces, and advanced packaging technologies . • Track record influencing technology roadmaps, industry standards, and large cross-functional architecture decisions. • Proven technical leadership and mentorship of senior engineering teams. Minimum Qualifications: • Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 10+ years of System/Package Design/Technology Engineering or related work experience. OR Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 9+ years of System/Package Design/Technology Engineering or related work experience. OR PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 8+ year of System/Package Design/Technology Engineering or related work experience. Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here . Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). To all Staffing and Recruiting Agencies : Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications. EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification. Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. Pay range and Other Compensation & Benefits : $256,600.00 - $385,000.00 The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link . If you would like more information about this role, please contact Qualcomm Careers .

Requirements

Must-haves

Qualcomm Technologies, Inc.
Engineering Group, Engineering Group > Packaging Engineering
Lead system-level Signal Integrity (SI) and Power Integrity (PI) strategy, including channel budgeting, COM analysis, insertion loss, return loss, jitter, crosstalk, PDN design, and simulation-to-silicon correlation.
MS or PhD in Electrical Engineering, Computer Engineering, Physics, or related discipline.
15+ years of experience developing high-speed communication, networking, or datacenter infrastructure products.
Demonstrated success productizing 112G and/or 224G PAM4 electrical communication systems .
Technical Expertise
High-speed SerDes architectures
PAM4 communication systems
Signal Integrity (SI)
Power Integrity (PI)
Package, PCB, connector, and cable design
Power delivery network architecture
Advanced packaging technologies
Channel modeling and compliance methodologies
End-to-end electrical system architecture
AI networking, scale-up, and scale-out infrastructures
ADS, HFSS, CST, HSPICE, MATLAB, Python, Cadence Sigrity, PowerSI, Clarity, SystemVerilog, Verilog-A, COM analysis tools, IBIS-AMI modeling

Nice-to-haves

Experience developing and productizing 224G+ and 448G electrical interconnect solutions .
Experience with CPC, NPC, copper flyover architectures, AECs, advanced package substrates, and next-generation PCB technologies .
Familiarity with Ethernet, PCIe, UALink, NVLink, OIF CEI, IEEE 802.3, and AI networking fabrics .
Experience with chiplets, UCIe, heterogeneous integration, EIC/PIC interfaces, and advanced packaging technologies .
Track record influencing technology roadmaps, industry standards, and large cross-functional architecture decisions.
Proven technical leadership and mentorship of senior engineering teams.

Application prep

Use the role’s language and application details while tailoring your materials.

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