Job description

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) sits within the Technology and Products Group (TPG) and develops industry-leading High Bandwidth Memory (HBM) solutions for next-generation AI and high-performance computing systems. Micron is hiring an experienced MTS - Thermal Simulation Engineer! You would provide technical leadership in advanced thermal and thermo-mechanical modeling for next-generation High Bandwidth Memory (HBM) products. This role will define simulation strategy, solve complex thermal challenges across 2.5D/3D semiconductor packaging systems, drive physics-based model development and silicon correlation, and influence product, package, material, and process decisions across teams . Key Responsibilities Lead the development of high-fidelity thermal and thermo-mechanical models for HBM packages, including die, interconnects, bonding interfaces, and system-level integration. Define and implement multiphysics simulation strategies encompassing thermal, structural, and coupled analyses to evaluate performance, identify risks, and guide architecture and design decisions. Provide deep technical analysis of thermal transport, heat flux distribution, and thermo-mechanical behavior across complex stacked memory architectures. Lead simulation-to-silicon correlation with characterization and test teams, establish model validation criteria, and drive closure of gaps between prediction and measured behavior. Assess material properties, layout effects, package architecture, and manufacturing variation to identify key drivers of thermal resistance and hotspot behavior Influence design, packaging, process, and test teams by translating simulation results into thermally-aware product requirements and design direction Advance modeling methodologies, automation, and scalable simulation frameworks for HBM and advanced packaging technologies, while mentoring engineers and establishing guidelines. Lead the evaluation, adoption, and responsible use of AI-enabled solutions within engineering workflows, translating emerging AI capabilities into practical business value through improved productivity, innovation, quality, and speed of execution Minimum Qualifications PhD plus 5 years of industry experience, or Master’s degree plus 10 years of industry experience, in Mechanical Engineering, Materials Science, Physics, or a related field Extensive industry experience in thermal simulation or multiphysics modeling for semiconductor devices, advanced packaging, or closely related technologies Strong foundation in heat transfer, thermodynamics, and solid mechanics Hands-on experience with multiphysics simulation tools (e.g., Ansys, Abaqus, Fluent, Star-CCM , FloTHERM) Demonstrated expertise in modeling and interpreting thermo-mechanical phenomena such as thermal resistance, heat spreading, stress, warpage, and material interaction effects Advanced experience with finite element modeling (FEM), coupled thermal-structural simulations, model calibration, and technical problem solving for complex systems Preferred Qualifications Understanding of semiconductor packaging technologies, including HBM, 2.5D/3D integration, TSVs, hybrid bonding, and interposers Familiarity with material characterization and effective thermal property extraction across layered or heterogeneous systems Knowledge of simulation-to-silicon calibration workflows and experimental validation techniques Exposure to CFD or flow-based simulation for cooling or package-level heat transfer. Scripting or data analysis skills (Python, MATLAB, JMP) to automate simulations and analyze results. As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits . Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws. To learn about your right to work click here. To learn more about Micron, please visit micron.com/careers For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na micron.com or 1-800-336-8918 (select option #3) Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron. AI alert : Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate s true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification. Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

Requirements

Must-haves

Our vision is to transform how the world uses information to enrich life for all .
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Lead the development of high-fidelity thermal and thermo-mechanical models for HBM packages, including die, interconnects, bonding interfaces, and system-level integration.
Define and implement multiphysics simulation strategies encompassing thermal, structural, and coupled analyses to evaluate performance, identify risks, and guide architecture and design decisions.
Provide deep technical analysis of thermal transport, heat flux distribution, and thermo-mechanical behavior across complex stacked memory architectures.
Lead simulation-to-silicon correlation with characterization and test teams, establish model validation criteria, and drive closure of gaps between prediction and measured behavior.
Assess material properties, layout effects, package architecture, and manufacturing variation to identify key drivers of thermal resistance and hotspot behavior
Influence design, packaging, process, and test teams by translating simulation results into thermally-aware product requirements and design direction
Advance modeling methodologies, automation, and scalable simulation frameworks for HBM and advanced packaging technologies, while mentoring engineers and establishing guidelines.
PhD plus 5 years of industry experience, or Master’s degree plus 10 years of industry experience, in Mechanical Engineering, Materials Science, Physics, or a related field
Extensive industry experience in thermal simulation or multiphysics modeling for semiconductor devices, advanced packaging, or closely related technologies
Strong foundation in heat transfer, thermodynamics, and solid mechanics
Hands-on experience with multiphysics simulation tools (e.g., Ansys, Abaqus, Fluent, Star-CCM , FloTHERM)
Demonstrated expertise in modeling and interpreting thermo-mechanical phenomena such as thermal resistance, heat spreading, stress, warpage, and material interaction effects

Nice-to-haves

Understanding of semiconductor packaging technologies, including HBM, 2.5D/3D integration, TSVs, hybrid bonding, and interposers
Familiarity with material characterization and effective thermal property extraction across layered or heterogeneous systems
Knowledge of simulation-to-silicon calibration workflows and experimental validation techniques
Exposure to CFD or flow-based simulation for cooling or package-level heat transfer.
Scripting or data analysis skills (Python, MATLAB, JMP) to automate simulations and analyze results.
To learn about your right to work click here.
To learn more about Micron, please visit micron.com/careers
For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na micron.com or 1-800-336-8918 (select option #3)
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

Application prep

Use the role’s language and application details while tailoring your materials.

Keywords to mirror

aipython

Platform: workday
Effort: long

Benefits

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Dental

Vision