Job description

About SK hynix America: At SK hynix America, we are at the forefront of semiconductor innovation. As a global leader in HBM, DRAM, and NAND flash technologies, we develop the advanced memory solutions powering everything from advanced mobile technology to massive AI data centers. With major investments in the U.S. and a leading position in the global AI revolution, we build the critical infrastructure of the digital landscape and remain committed to sustainable operations. We invite innovative minds to be part of our journey. Here, you will be part of a collaborative team pioneering the next generation of memory technologies, expanding our market footprint, and defining the future of computing. Work Model: Onsite Job Overview: SK hynix America is seeking a highly skilled and motivated Mechanical Simulation Engineer to join our Advanced Packaging (PKG) R&D team. In this role, you will be at the forefront of semiconductor innovation, driving the mechanical integrity of next-generation packaging solutions (e.g., HBM, 2.5D/3D Heterogeneous Integration). You will utilize advanced numerical methods to predict and optimize the thermos-mechanical behavior of complex IC packages, ensuring high performance and structural robustness. Additionally, you will bridge the gap between package-level integrity and system-level performance, ensuring our packaging solutions are robustly integrated into data center rack architectures and consumer systems. Responsibilities: Advanced FEA Modeling: Develop high-fidelity, non-linear Finite Element Analysis (FEA) models to characterize stress, strain, and warpage behavior in advanced semiconductor packages during assembly processes and reliability tests. Multi-Physics Analysis: Perform complex thermo-mechanical multi-physics simulations to evaluate the impact of thermal gradients on structural integrity and fatigue life. Design Optimization: Partner closely with package designers and process engineers to provide simulation-driven design directions, optimizing architectures for warpage control, solder joint reliability, and interfacial adhesion. Material Characterization: Define and implement material constitutive models (elastic, plastic, viscoelastic, etc.) for various packaging materials (EMC, Substrate, Silicon, TIM) and correlate simulation results with empirical data (e.g., Shadow Moire, DIC). Failure Analysis & Reliability: Predict potential failure modes (delamination, cracking, bump fatigue) and develop mitigation strategies to meet stringent industry reliability standards. Methodology Development: Establish and document standardized simulation workflows, advanced meshing techniques, and automation scripts to enhance simulation accuracy and throughput. Cross-functional Collaboration: Present technical findings and simulation-based risks to internal stakeholders and global R&D teams to influence product roadmaps and manufacturing process specs. System-Level Interaction Analysis: Evaluate the thermo-mechanical interactions between advanced packages and board/system-level components (e.g., Motherboard, Rack, Cooling systems), mapping system-level boundary conditions down to the package level. Qualifications: Master’s degree or higher in Mechanical Engineering, Materials Science, or a related field. Candidates with relevant industry experience are preferred Core Expertise: Deep understanding of solid mechanics, heat transfer, and strength of materials, specifically applied to semiconductor packaging. Simulation Tools: Extensive experience with commercial FEA software such as ABAQUS (preferred), ANSYS Mechanical, or LS-DYNA. Technical Knowledge: Proven knowledge of semiconductor packaging structures (Flip-chip, WLCSP, 2.5D/3D IC) and the physics of failure in electronic assemblies. Analytical Skills: Ability to interpret complex simulation data and translate it into actionable engineering recommendations. System-Level Insight: Experience or strong knowledge in mechanical simulation/testing at the system or set level, with preferred exposure to data center rack architectures, desktop form factors, or enterprise-level hardware systems. Preferred Qualifications: Experience in Multi-scale modeling (from micro-scale TSV/micro Bumps to macro-scale Package/PCB). Strong scripting skills in Python to automate Abaqus workflows, including pre-processing, job submission, and customized post-processing/data extraction. Proficiency in statistical analysis and DOE (Design of Experiments) using tools such as JMP or Minitab to interpret simulation and experiment data. Knowledge of semiconductor manufacturing processes (Reflow, Molding, Bonding) and their impact on residual stress. Experience with CAD software (NX, Solidworks, or AutoCAD) for geometry preparation and cleaning. Excellent communication skills to collaborate effectively within a multidisciplinary, global R&D environment. Benefits: Top Tier health insurance at no employee cost Paid day offs: Paid Time Off, Company Holidays, Parental Leave, Happy Fridays 401k Matching Flexible Spending Account (FSA) for Health Care & Dependent Care Educational reimbursement up to $10,000 per year Donation Matching and volunteering opportunities Corporate discount programs Free Breakfast/Lunch/Dinner provided to employees Compensation: Our compensation reflects the cost of labor across several U.S. geographic markets, and we pay differently based on those defined markets. Pay within the provided range varies by work location and may also depend on job-related skills and experience. Your Recruiter can share more about the specific salary range for the job location during the hiring process. Pay Range $105,000 — $160,000 USD Equal Employment Opportunity: SK hynix America is an Equal Employment Opportunity Employer. We provide equal employment opportunities to all qualified applicants and employees and prohibit discrimination and harassment of any type without regard to race, sex, pregnancy, sexual orientation, religion, age, gender identity, national origin, color, protected veteran or disability status, genetic information, or any other status protected under federal, state, or local applicable laws. In compliance with federal law, SK hynix America also participates in the federal E-Verify program. Upon accepting an offer of employment, all newly hired individuals will be required to complete Form I-9, which includes verifying identity and legal authorization to work in the United States. Please review the official government posters detailing your rights and protections prior to applying: E-Verify Participation Poster (Bilingual English & Spanish) IER Right to Work Poster (English) IER Right to Work Poster (Spanish)

Requirements

Must-haves

Multi-Physics Analysis: Perform complex thermo-mechanical multi-physics simulations to evaluate the impact of thermal gradients on structural integrity and fatigue life.
Failure Analysis & Reliability: Predict potential failure modes (delamination, cracking, bump fatigue) and develop mitigation strategies to meet stringent industry reliability standards.
Methodology Development: Establish and document standardized simulation workflows, advanced meshing techniques, and automation scripts to enhance simulation accuracy and throughput.
Cross-functional Collaboration: Present technical findings and simulation-based risks to internal stakeholders and global R&D teams to influence product roadmaps and manufacturing process specs.
Core Expertise: Deep understanding of solid mechanics, heat transfer, and strength of materials, specifically applied to semiconductor packaging.
Technical Knowledge: Proven knowledge of semiconductor packaging structures (Flip-chip, WLCSP, 2.5D/3D IC) and the physics of failure in electronic assemblies.
Analytical Skills: Ability to interpret complex simulation data and translate it into actionable engineering recommendations.

Nice-to-haves

Master’s degree or higher in Mechanical Engineering, Materials Science, or a related field. Candidates with relevant industry experience are preferred
Simulation Tools: Extensive experience with commercial FEA software such as ABAQUS (preferred), ANSYS Mechanical, or LS-DYNA.
Experience in Multi-scale modeling (from micro-scale TSV/micro Bumps to macro-scale Package/PCB).
Strong scripting skills in Python to automate Abaqus workflows, including pre-processing, job submission, and customized post-processing/data extraction.
Proficiency in statistical analysis and DOE (Design of Experiments) using tools such as JMP or Minitab to interpret simulation and experiment data.
Knowledge of semiconductor manufacturing processes (Reflow, Molding, Bonding) and their impact on residual stress.
Experience with CAD software (NX, Solidworks, or AutoCAD) for geometry preparation and cleaning.
Excellent communication skills to collaborate effectively within a multidisciplinary, global R&D environment.

Application prep

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Keywords to mirror

aipython

Platform: greenhouse
Effort: quick

Benefits

Benefits detected in the listing.

Health Insurance

401k

Paid Time Off

Parental Leave