Job description

## Company: Qualcomm Technologies, Inc. ## Job Area: Engineering Group, Engineering Group > Packaging Engineering General Summary: This role represents an individual contributor within the CHS Signal Integrity organization responsible for end-to-end signal integrity and power integrity architecture, analysis, and signoff for next-generation mobile, compute, automotive, and various other connectivity platforms. Core Responsibilities * Perform high-frequency measurements of passive structures using VNA and TDR * Test, measure, and debug high-speed electrical signals and power delivery on active hardware * Drive correlation between pre-silicon models and silicon/lab data * Lead debug of eye collapse / jitter margin issues, crosstalk and power noise and silicon-package-board interactions * Drive adoption of best practices across programs * Drive improvements in methods for system SI/PI High-Speed Interface Expertise Knowledge of interfaces such as: * Memory: LPDDR4/5/6 * High-speed IO: PCIe Gen4/5/6/7, USB4, UFS, 10G–112G+ PHYs * Camera/Display: MIPI CSI/DSI * System PDN Minimum Qualifications: • Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field. Preferred Experience * 2+ years’ experience in Signal Integrity / Power Integrity / High-speed systems Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications. EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification. Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. Pay range and Other Compensation & Benefits: $111,600.00 - $167,400.00 The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link. If you would like more information about this role, please contact Qualcomm Careers.

Requirements

Must-haves

Qualcomm Technologies, Inc.
Engineering Group, Engineering Group > Packaging Engineering
Perform high-frequency measurements of passive structures using VNA and TDR
Test, measure, and debug high-speed electrical signals and power delivery on active hardware
Drive correlation between pre-silicon models and silicon/lab data
Lead debug of eye collapse / jitter margin issues, crosstalk and power noise and silicon-package-board interactions
Drive adoption of best practices across programs
Drive improvements in methods for system SI/PI
High-Speed Interface Expertise
Memory: LPDDR4/5/6
High-speed IO: PCIe Gen4/5/6/7, USB4, UFS, 10G–112G+ PHYs
Camera/Display: MIPI CSI/DSI
Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field.
2+ years’ experience in Signal Integrity / Power Integrity / High-speed systems
$111,600.00 - $167,400.00
If you would like more information about this role, please contact Qualcomm Careers.

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