Senior Mechanical Packaging Engineer at Nokia

Job description

As part of Nokia’s Advanced Packaging R&D team, you will be responsible for the mechanical development of next generation, high performance electro-optic modules. You will be responsible for the integration of Silicon Photonics based Coherent optical transceivers within Nokia’s Photonic Service Engines, from inception stage to New Product Introduction. • Lead Package Design and Architecture in collaboration with cross-functional teams and stakeholders to ensure package requirements are met. • Innovate designs, applying Design for Manufacturing principles and with an eye towards production volumes and cost targets. • Drive key technology development to enable next generation product design. • Perform FEA structural analysis, including linear, nonlinear and dynamic studies using software. • Perform thermal analysis, and coupled-physics involving thermal–structural, thermal-mechanical stress and thermo-electric analyses. • Own and maintain mechanical drawings and manufacturing documentation along with Bill of Materials for new products. • Plan and Drive prototype assembly builds to enable deliveries for early design validation. • Drive package debug activities during product validation and qualification. • Survey new materials and vendors for all Advanced Packaging activities. • Develop semiconductor and optical packaging processes in-house, or in close partnership with contract manufacturers. You have: • Advanced Degree in Mechanical Engineering or similar field. • 5-8 years of extended experience in high-volume packaging of 2.5/3D packages. • Expertise in next generation advanced photonics packaging technologies. • Expertise in 3D CAD design, tolerance analysis, and Geometric Dimensioning and Tolerancing (GD&T) with SolidWorks or similar software. • Expertise in thermal and thermo-mechanical simulations using ANSYS or similar software. • Experience with package and process design/development from design to production. • Expertise in material properties and yield/failure mode analysis. • Experience with documentation of fabrication, inspection, and assembly processes. • Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively. • Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging. • Expertise in materials property and process, yield analysis and enhancement, and failure mode and analysis. • Experience with Industry Test Standards, such as JEDEC, EIA, Telcordia, Mil-Std, etc. It would be nice if you also have: • Experience in optical coupling design and assembly for optical engines. • Experience in multilayer material bonding and heterogeneous integration. • Experience in high-speed signal integrity design and analysis. At Nokia, we're on a mission to revolutionize global network capacity, bringing faster and more accessible connectivity to everyone. Our Network Infrastructure (NI) group is at the heart of this revolution, fueled by ambition, innovation, and technical expertise. Within NI, the Advanced Optics (AO) team designs cutting-edge optical modules using silicon photonics and advanced packaging for high-performance coherent communication. The Advanced Packaging team within AO focuses on the intricate details of package design and processes, ensuring seamless integration from wafer-scale to component-level packaging. As a Packaging Development Engineer, you'll be a key player in developing the next generation of high-performance electro-optic modules, integrating silicon photonics-based coherent optical transceivers into Nokia's Photonic Service Engines, from initial concept to product launch. Join us and be a part of this exciting journey!

Requirements

Must-haves

Lead Package Design and Architecture in collaboration with cross-functional teams and stakeholders to ensure package requirements are met.
Innovate designs, applying Design for Manufacturing principles and with an eye towards production volumes and cost targets.
Drive key technology development to enable next generation product design.
Perform FEA structural analysis, including linear, nonlinear and dynamic studies using software.
Perform thermal analysis, and coupled-physics involving thermal–structural, thermal-mechanical stress and thermo-electric analyses.
Own and maintain mechanical drawings and manufacturing documentation along with Bill of Materials for new products.
Plan and Drive prototype assembly builds to enable deliveries for early design validation.
Drive package debug activities during product validation and qualification.
Survey new materials and vendors for all Advanced Packaging activities.
Develop semiconductor and optical packaging processes in-house, or in close partnership with contract manufacturers.
Advanced Degree in Mechanical Engineering or similar field.
5-8 years of extended experience in high-volume packaging of 2.5/3D packages.
Expertise in next generation advanced photonics packaging technologies.
Expertise in 3D CAD design, tolerance analysis, and Geometric Dimensioning and Tolerancing (GD&T) with SolidWorks or similar software.
Expertise in thermal and thermo-mechanical simulations using ANSYS or similar software.
Experience with package and process design/development from design to production.
Expertise in material properties and yield/failure mode analysis.
Experience with documentation of fabrication, inspection, and assembly processes.
Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively.
Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging.
Expertise in materials property and process, yield analysis and enhancement, and failure mode and analysis.
Experience with Industry Test Standards, such as JEDEC, EIA, Telcordia, Mil-Std, etc.
It would be nice if you also have:
Experience in optical coupling design and assembly for optical engines.

Nice-to-haves

None flagged.

Application prep

Use the role’s language and application details while tailoring your materials.

Platform: oracle-cloud
Effort: medium