This position is cross-functional in nature and requires close cooperation with the design, development ,and production teams. The ideal candidate would possess a deep understanding of the physics of photonic devices and have a strong desire to learn about the reliability challenges associated with new product development.
• Participate in design and development process, evaluate device and system failure modes and associated risks.
• Coordinate accelerated reliability stress tests to characterize the over-life performance of next-generation PICs
• Develop life models based on data from accelerated-aging tests
• Drive failure mode analysis efforts for product reliability failures
• PhD in Electrical Engineering, Materials Science, or Physics
• Strong fundamental understanding of photonic devices and their manufacturing processes
• Aptitude to learn about new photonic device design and photonic device integration and associated processes
• E xcellent teamwork and communication skills
The Photonic Integration Circuit (PIC) group develops and manufactures chips that are the heart of Nokia’s terabit-scale digital optical transport networks. As part of our reliability effort, we are searching for a photonic component engineer to work on the development of next-generation InP-based PICs and modules. The individual needs to possess a strong fundamental understanding of photonic devices and be interested in learning about the reliability challenges associated with releasing new products. The job is based in Sunnyvale in the Optical Modules Group (OMG).