Job description

We are seeking a New Product Engineering Technical Leader (Member of Technical Staff or Sr. MTS) to serve as the Engineering Product Owner (EPO) for SiC / Si Power Discrete and/or Power Module products supporting automotive and industrial applications at onsemi. This role serves as the single point of product-level engineering leadership, driving alignment across global NPD teams to achieve performance, cost, reliability, and schedule targets. The EPO will lead cross-functional execution, risk management, and escalation, ensuring disciplined delivery across the full product lifecycle. The position requires strong capability in influencing without authority, leading task forces, resolving complex technical challenges, and communicating clearly at the executive level. The successful candidate will act as the single product-level engineering owner, ensuring alignment between technical execution and business objectives across global teams to achieve performance, reliability, cost, and schedule targets. 1. Product-Level Engineering Ownership • Own product definitions and technical requirements for power discrete and power module products. • Translate business, system, and customer requirements into clear, actionable engineering deliverables. • Ensure alignment of product intent across die, package, and module implementations. • Own product-level tradeoffs across performance, reliability, cost, manufacturability, and schedule. • Evaluate and select product architectures, technologies, and packaging concepts based on feasibility and risk. • Develop deep understanding of die-to-package interaction, including its impact on electrical, thermal, and reliability performance. 2. Cross-Functional Leadership & Execution Alignment • Serve as the central technical leader driving alignment across TD, PE, packaging, test, reliability, quality, supply chain, and manufacturing teams. • Drive clarity on interfaces, dependencies, deliverables, and milestones across global NPD teams. • Identify gaps, misalignment, and execution risks early, and proactively drive resolution. • Influence cross-functional teams without direct authority, ensuring accountability and timely decision-making. • Coordinate system-level electrical, thermal, and mechanical modeling to validate product performance. 3. Execution Governance, Escalation & Risk Management • Own product-level risk identification and maintain visibility on design, execution, qualification, and manufacturing risks. • Drive mitigation strategies and ensure disciplined execution tracking. • Lead design reviews, execution checkpoints, and program gate reviews. • Act as the primary escalation point for critical product and execution issues. • Clearly frame risks, tradeoffs, and recommended actions for leadership decision-making. • Ensure adherence to NPD governance, BKMs, and engineering rigor expectations. 4. Problem Solving & Task Force Leadership • Lead cross-functional task forces to resolve critical technical and execution challenges. • Drive structured problem solving, including root cause analysis, containment, and corrective actions. • Provide strong leadership to align stakeholders, mobilize resources, and ensure closure of high-impact issues. • Enable rapid, data-driven decisions under high-pressure and crisis scenarios. • Build a culture of accountability, urgency, and excellence in engineering across teams. 5. Executive Communication & Stakeholder Management • Provide clear, concise, and high-impact executive updates on product status, risks, and recovery plans. • Translate complex technical challenges into decision-ready summaries for senior leadership. • Drive alignment across stakeholders through structured communication and consistent messaging. • Ensure transparency of risks, priorities, and tradeoffs to leadership. • Represent the product in executive reviews, escalation forums, and cross-functional leadership discussions. • Master’s or Ph.D. in Electrical Engineering, Materials Science, Physics, or a related field. • 10+ years of experience in power semiconductor product development, with deep expertise in power discrete and/or module products (SiC/Si MOSFET preferred). • Deep understanding of power device physics and semiconductor fabrication processes, including device architecture, wafer processing, and fab-to-product interactions. • Strong expertise in power device and packaging fundamentals, including module and discrete packaging, electrical, thermal, and mechanical performance, die-to-package interaction, and reliability mechanisms. • Proven track record of leading product-level execution across complex, global programs, influencing cross-functional teams without direct authority and consistently delivering against performance, cost, and schedule targets. • Demonstrated ability to lead cross-functional task forces and drive resolution of high-impact technical challenges, with strong ownership of root cause analysis, decision-making, and closure under high-pressure conditions. • Strong experience in escalation management, with the ability to clearly frame technical issues, risks, and tradeoffs, and drive decision-ready discussions with senior leadership. • Excellent cross-functional leadership, communication, and executive-level presentation skills, with the ability to translate complex technical topics into clear, concise messaging for stakeholders.

Requirements

Must-haves

Product-Level Engineering Ownership
Own product definitions and technical requirements for power discrete and power module products.
Translate business, system, and customer requirements into clear, actionable engineering deliverables.
Ensure alignment of product intent across die, package, and module implementations.
Own product-level tradeoffs across performance, reliability, cost, manufacturability, and schedule.
Evaluate and select product architectures, technologies, and packaging concepts based on feasibility and risk.
Develop deep understanding of die-to-package interaction, including its impact on electrical, thermal, and reliability performance.
Cross-Functional Leadership & Execution Alignment
Serve as the central technical leader driving alignment across TD, PE, packaging, test, reliability, quality, supply chain, and manufacturing teams.
Drive clarity on interfaces, dependencies, deliverables, and milestones across global NPD teams.
Identify gaps, misalignment, and execution risks early, and proactively drive resolution.
Influence cross-functional teams without direct authority, ensuring accountability and timely decision-making.
Coordinate system-level electrical, thermal, and mechanical modeling to validate product performance.
Execution Governance, Escalation & Risk Management
Own product-level risk identification and maintain visibility on design, execution, qualification, and manufacturing risks.
Drive mitigation strategies and ensure disciplined execution tracking.
Lead design reviews, execution checkpoints, and program gate reviews.
Act as the primary escalation point for critical product and execution issues.
Clearly frame risks, tradeoffs, and recommended actions for leadership decision-making.
Ensure adherence to NPD governance, BKMs, and engineering rigor expectations.
Problem Solving & Task Force Leadership
Lead cross-functional task forces to resolve critical technical and execution challenges.
Drive structured problem solving, including root cause analysis, containment, and corrective actions.

Nice-to-haves

10+ years of experience in power semiconductor product development, with deep expertise in power discrete and/or module products (SiC/Si MOSFET preferred).

Application prep

Use the role’s language and application details while tailoring your materials.

Platform: oracle-cloud
Effort: medium